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    Q7-922

    Computer on Module with NVIDIA® Tegra® T30 Processor

    • ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

    • 6x USB 2.0
    • NVIDIA GeForce Ultra low power GPU
    • up to 2GB DDR3L on-board soldered memory

      Q7-922

    Q7-922

    Q7-C25

    Q7-C25

    μQ7-A76-J

    μQ7-A76-J

    SM-C12

    SM-C12

     
    Statut de développement du produit
    Processeur
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Puces
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    2
    0
    Max Thread
    0
    0
    2
    0
    Mémoire
    up to 2GB DDR3L on-board soldered memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Graphique
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Interfaces vidéo
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Résolution vidéo
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Stockage de masse
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Networking
    Gigabit Ethernet Interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB
    6 x USB 2.0 Host ports

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)

    1x PCI-e x1 port, optional

    3 x PCI-e x1 lanes (Gen2)
    2x PCI-e x1 ports
    Audio
    HD Audio Interface

    I2S Audio Interface

    HD Audio Interface
    I2S Audio Interface
    Ports série

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    1 x Serial Port (TTL interface, Tx/Rx only)
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Autres interfaces
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentation électrique

    +5VDC ± 5%

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC
    +3.3V_RTC

    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation
    Linux

    Linux
    Yocto
    Android

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Linux
    Yocto
    Android

    Température d'exploitation

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    50 x 82 mm (1.97” x 3.23”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Description

    Détails

    Q7-922 is a Qseven® Rel. 1.20 Compliant Module designed by SECO that represents the top performance possibility for computational and graphical applications based on low power ARM architectures.
    The board integrates Tegra® T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
    Informations supplémentaires

    Informations complémentaires

    Processeur
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core
    Max Cores
    4
    Mémoire
    up to 2GB DDR3L on-board soldered memory
    Graphique
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support
    Interfaces vidéo
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    Résolution vidéo
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    Stockage de masse
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Networking
    Gigabit Ethernet Interface
    USB
    6 x USB 2.0 Host ports
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    Audio
    HD Audio Interface
    Ports série

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Autres interfaces
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals
    Alimentation électrique

    +5VDC ± 5%

    Système d'exploitation
    Linux
    Température d'exploitation

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Logiciel
    Linux Kernel Patches
    • Patch to add jedec 5.1 Support*
    • e1000e_kernel_R16r2_svn1152.tar.gz*
    • Release Note - e1000e Patch.pdf*
    Linux 1.4
    • Linaro Compiler*
    • Kernel Linux 3.1.10*
    • File System Ubuntu 12.04 - Desktop version*
    • File System Ubuntu 12.04 - minimal version*
    • SECO Flash Bootargs*
    • SECO Tools*
    • U-Boot 2011.03*
    • md5sum.txt*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-922

    Q7-922
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    Computer on Module with NVIDIA® Tegra® T30 Processor
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    Q922-1210-1000-C0 Q7 - Nvidia Tegra T30@1.3GHz, 2GB DDR3L Dual Channel, 4GB eMMC, CAN Controller - Commercial temp. range Q7 - Nvidia Tegra T30@1.3GHz, 2GB DDR3L Dual Channel, 4GB eMMC, CAN Controller - Commercial temp. range AJOUTER POUR COMPARER

    • Automatisation industrielle
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    • Sécurité/Surveillance
    • Transports
    • Utilities (Energy-Telco)
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