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    Q7-922

    Computer on Module with NVIDIA® Tegra® T30 Processor

    • ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

    • 6x USB 2.0
    • NVIDIA GeForce Ultra low power GPU
    • up to 2GB DDR3L on-board soldered memory

      Q7-922

    Q7-922

    Q7-C25

    Q7-C25

    Q7-928

    Q7-928

    μQ7-A76-J

    μQ7-A76-J

     
    Statut de développement du produit
    Processeur
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    Puces
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    4
    2
    Max Thread
    0
    0
    0
    2
    Mémoire
    up to 2GB DDR3L on-board soldered memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    Graphique
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Interfaces vidéo
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    Résolution vidéo
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz
    Stockage de masse
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard
    Networking
    Gigabit Ethernet Interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet interface
    Gigabit Ethernet interface
    USB
    6 x USB 2.0 Host ports

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)

    1x PCI-e x1 port, optional

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    3 x PCI-e x1 lanes (Gen2)
    Audio
    HD Audio Interface

    I2S Audio Interface

    AC'97 Audio Interface
    I2S
    HD Audio Interface
    Ports série

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    2 x serial ports (TTL interface)
    CAN port interface

    1 x Serial Port (TTL interface, Tx/Rx only)
    Autres interfaces
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    Alimentation électrique

    +5VDC ± 5%

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ± 5%
    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation
    Linux

    Linux
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Température d'exploitation

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...

    Description

    Détails

    Q7-922 is a Qseven® Rel. 1.20 Compliant Module designed by SECO that represents the top performance possibility for computational and graphical applications based on low power ARM architectures.
    The board integrates Tegra® T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
    Informations supplémentaires

    Informations complémentaires

    Processeur
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core
    Max Cores
    4
    Mémoire
    up to 2GB DDR3L on-board soldered memory
    Graphique
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support
    Interfaces vidéo
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    Résolution vidéo
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    Interfaces vidéo
    SINGLE CHANNEL LVDS, DUAL CHANNEL LVDS, HDMI
    Stockage de masse
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Networking
    Gigabit Ethernet Interface
    USB
    6 x USB 2.0 Host ports
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    Audio
    HD Audio Interface
    Ports série

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Autres interfaces
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals
    Alimentation électrique

    +5VDC ± 5%

    Système d'exploitation
    Linux
    Température d'exploitation

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Logiciel
    Linux Kernel Patches
    • Patch to add jedec 5.1 Support*
    • e1000e_kernel_R16r2_svn1152.tar.gz*
    • Release Note - e1000e Patch.pdf*
    Linux 1.4
    • Linaro Compiler*
    • Kernel Linux 3.1.10*
    • File System Ubuntu 12.04 - Desktop version*
    • File System Ubuntu 12.04 - minimal version*
    • SECO Flash Bootargs*
    • SECO Tools*
    • U-Boot 2011.03*
    • md5sum.txt*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-922

    Q7-922
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    Computer on Module with NVIDIA® Tegra® T30 Processor
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
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