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    Architecture

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    11 Article(s)

    1. 3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs

      • 2x GbE; M.2 WWAN and WLAN slots; 2x USB3.0; 2x USB 2.0; 8x GPI/Os
      • AMD Radeon™ Vega GPU with up to 11 Compute Units

    2. COM Express™ Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCs
      • 4x USB 3.1; 24x PCI-e Gen3 lanes
      • N.A.
    3. SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
      • 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 port (PCI-e x16 mechanical slot); VPU High Speed Connector with 4xUSB3.1 + 2x PCI-ex4
      • Intel® UHD Graphics 630/P630 architecture, supports up to 3 independent displays

    4. COM Express™ 3.0 Compact Type 6 Module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
      • 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2
      • Intel® HD Graphics 500 series controller with up to 18 Execution Units 

    5. COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors
      • 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
      • AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

    6. COM Express Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon)
      • 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
      • AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    7. COM Express™ 3.0 Basic Type 6 Module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
      • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
      • Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    8. COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
      • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
      • Intel® HD Graphics 530 /P530/630/P630

    9. COM Express™ Basic Type 6 Module with Intel® Haswell family CPUs
      • 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1
      • Integrated Intel® HD Graphics 4600
    10. Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)
      • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
      • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)

    11. Compact COM-Express Rel.3.0 Type 6 module, with the AMD Ryzen™ Embedded R1000 family of SoCs
      • 4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3
      • AMD Radeon™ Vega GPU with 3 Compute Units

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    11 Article(s)

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