SECO has just released UDOO BOLT GEAR, the ultimate Mini PC Kit based on AMD Ryzen™ Embedded V1000 Processor.
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SECO is releasing UDOO BOLT GEAR, the ultimate Mini PC Kit by UDOO based on AMD Ryzen™ Embedded V1000 Processor.
Arezzo – May 11th 2020 – The Board of Directors of SECO SPA, a high-tech manufacturer of computer miniaturization and “ready-to-use” IoT integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, presented today its 2019 financial results.
SECO and IBD announce a partnership for the realization of “Respira” non-invasive pulmonary ventilators
At the embedded world Exhibition & Conference, in addition to its wide range of products and services in exposition, SECO is also going to present EDGEHOG, i.e., SECO’s IIoT-as-a-service platform.
At the embedded world Exhibition & Conference, in addition to its vast array of products and services in exposition, SECO is also going to present SENSE-D01 i.e., SECO’s newest microcontroller for industrial applications.
In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. the COMe-B75-CT6 and the COMe-C89-CT6.
At the embedded world Exhibition & Conference, SECO will be exhibiting its first COM Express™ Type 7 product: the COMe-C42-BT7, a COM Express™ Rel. 3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Processor.
From February 25th to 27th 2020, embedded world exhibition & conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre, Germany. At SECO's booth, among the variety of products displayed, there will be a strong focus on NXP-based solutions.
From February 25th to 27th 2020 in Nuremberg, during embedded world Exhibition & Conference, SECO will showcase its latest solutions to the tens of thousands of expected visitors at its booth. Here, SECO will be proud to announce the expansion of its Qseven® standard products portfolio.
At embedded world Exhibition & Conference SECO’s booth, among the many products of its portfolio, will showcase the company’s range of the most up-to-date Intel®-based solutions.
2020 edition of embedded world in Germany will provide the opportunity to proudly launch SECO’s partnership with Rockchip, presenting its first off-the-shelf product built on the Rockchip RK3399 processor and developed in 3.5” form factor: the SBC-C31.
Among the Arm-based products from SECO’s portfolio on display at embedded world, there will also be the SM-B71, a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC.
SECO enters a new market, keeping a leading-edge portfolio with a new standard from PICMG®: the COM-HPC™. This line enables SECO to take part in the HPC revolution, emerged from the needs of an increasingly demanding market, in line with the performance and speed of the newest processors, retaining high computation and low-latency features.
SECO is pleased to announce that today it has signed an agreement to acquire InHand, a Maryland-based leading provider of low-power embedded systems and software to original equipment manufacturers of handheld, portable, battery operated, Internet of Things (IoT), and wireless devices.
SECO is is attending the IoT Solutions World Congress in Barcelona with its IoT Business Unit, showing its innovative one-stop IoT solution: the Edgehog platform.
SECO is pleased to announce its participation at ARM TechCon with its most innovative and newly released ARM-based solutions on display.
SECO’s strive to improve and discover new markets lead the company to become a reliable partner in many industries, and in 2019 the company is expanding its reach further than ever before.
Today SECO propels into a new market, completing its portfolio of products with a new line: the COM Express™ Type 7. This new line enables SECO to enter the Networking & Communications and Storage markets, and become a competitive partner in the HPC domain.
In the context of its continuous global expansion, SECO increases its coverage of the Russian Market with a new technology partnership agreement with OSATEC LLC for all its portfolio of embedded modules.
Simultaneously with Intel®’s launch, SECO is making available a new range of solutions based on the latest Intel® technologies: the 8th Gen Intel® Core™ U processor family (codename “Whiskey Lake”) and the 9th Generation Intel® Core™ H processor family (codename “Coffee Lake Refresh”).
From cross-platform solutions to SECO’s Industrial Internet of Things platform to the disruptive UDOO BOLT, SECO is going to present the widest range of solutions for the IoT industry of tomorrow.