Benvenuti nel sito SECO S.p.A.

×

Inscription

Informations compte

  • Données de connexion

    ou se connecter

    Prénom obligatoire!
    Nom obligatoire!
    Numéro fiscal obligatoire!
    Société obligatoire!
    Numéro de TVA obligatoire!
    Pays obligatoire!
    Prénom non valide!
    Nom non valide!
    Ce n'est pas une adresse email!
    Adresse email obligatoire!
    Cet email existe déjà!
    Mot de passe obligatoire!
    Saisir un mot de passe valide!
    Saisir au moins 6 caractères!
    Saisir au maximum 16 caractères!
    Les mots de passe ne sont pas les mêmes!
    Termes et conditions obligatoires!
    Email ou mot de passe incorrect!
    Account confirmation is required. Please, check your email for the confirmation link. To resend the confirmation email pleasecliquez ici

    COMe-C08-BT6

    COM Express™ 3.0 Basic Type 6 Module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs

    • 8th Gen Core™/Xeon® (Coffee Lake) & 9th Gen Core™/ Xeon® /Pentium®/Celeron® CPUs (Coffee Lake Refresh)
    • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
    • Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    • Two DDR4 SO-DIMM Slots supporting DDR4-2666 ECC Memory, up to 64GB

      COMe-C08-BT6

    COMe-C08-BT6

    COMe-B75-CT6

    COMe-B75-CT6

    COMe-B09-BT6

    COMe-B09-BT6

    COMe-A98-CT6

    COMe-A98-CT6

     
    Statut de développement du produit
    Processeur

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
    • Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    • Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
    • Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
    • Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
    • Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
    • Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

    Puces
    Intel® QM370, HM370 or CM246 PCH
    ...

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    ...
    Max Cores
    6
    4
    4
    4
    Max Thread
    12
    0
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    0
    Mémoire

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB 
    ECC DDR4 memory modules supported only with Xeon®, Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I)

    Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported

    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
    G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHz 

    Graphique

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG, HEVC/H.265, VP9

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

    Interfaces vidéo

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

    Résolution vidéo

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

    Stockage de masse

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    2 x S-ATA Gen3 Channels
    4 x S-ATA Gen3 Channels
    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller
    USB

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports 

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    8 x PCI-e x1 Gen3 lanes

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

    Audio
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    Ports série
    2 x UARTs

    2 x UARTs

    2 x UARTs
    2 x HS UARTs
    Autres interfaces

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog 
    4 x GPI, 4 x GPO (pins shared with SD interface)

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Optional TPM 1.2 module on-board

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

    Alimentation électrique

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and +5VSB (optional)
    +12VDC ± 10% and + 5VSB (optional)
    Consommation d'énergie
    ...
    ...
    ...
    ...
    Système d'exploitation

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 10
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Linux

    Température d'exploitation

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Description

    Détails

    COMe-C08-BT6 is a COM Express™ Basic Type 6 with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs reaching a maximum of 12 threads. Mounting the Intel® Gen9 LP graphic core architecture, COMe-C08-BT6 can manage up to 3 independent displays at once, with a resolution up to 4096x2304 @60Hz, 24bpp. The module also embeds an H.265 / HEVC hardware transcoder - a peculiarity that, combined with the outstanding performance and the compatibility with multiple video interfaces, makes it an ideal platform for projects operating in the field of gaming, digital signage, infotainment, and HMI.
    Informations supplémentaires

    Informations complémentaires

    Processeur

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
    • Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    • Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
    • Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
    • Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
    • Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
    • Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP
    Puces
    Intel® QM370, HM370 or CM246 PCH
    Max Cores
    6
    Max Thread
    12
    Mémoire

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB 
    ECC DDR4 memory modules supported only with Xeon®, Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

    Graphique

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG, HEVC/H.265, VP9

    Interfaces vidéo

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Résolution vidéo

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Stockage de masse

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports 

    PCI-e

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    Audio
    HD Audio Interface
    Ports série
    2 x UARTs
    Autres interfaces

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog 
    4 x GPI, 4 x GPO (pins shared with SD interface)

    Alimentation électrique

    +12VDC ± 10% and + 5VSB (optional)

    Système d'exploitation

    Microsoft® Windows 10 
    Linux

    Température d'exploitation

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    Logiciel
    BIOS
    • [Bios] - Release version 1.02 - download with Chrome or Firefox*
    EAPI
    • [Embedded application programming interface] - Release version 1.20.19*
    Windows 10
    • [Driver package] - Release version for Windows 10 iot 2019 (RS5)*
    • [Driver package] - Release version for Windows 10 iot 2016 (RS1)*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documents

    * User need to register to site before download reserved files. Please login if you are a registered user.

    COMe-C08-BT6

    COMe-C08-BT6
    • ÉVALUER NOS PRODUITS

      Max. 3 pcs par code article
    • PRIX ÉCHANTILLONNAGE

      Frais d'expédition inclus
    • UNIQUEMENT B2B

      Support technique fourni exclusivement pour les entreprises
    COM Express™ 3.0 Basic Type 6 Module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
    Code article SKU Description article Configuration article Acheter des échantillons en ligne Nous contacter comparer
    MC08-4000-1200-C0-V COM Express Basic Type 6 - Intel i7-8850H Six Core @2.6GHz with HT (Coffee Lake H) COM Express Basic Type 6 - Intel i7-8850H Six Core @2.6GHz with HT (Coffee Lake H), 3x DDI + eDP video interfaces ,TPM 2.0 module on-board - Commercial temp. range AJOUTER POUR COMPARER

    • Automatisation industrielle
    • Infodivertissement
    • Instruments de mesure
    • Médical
    • Utilities (Energy-Telco)
    Top