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    μQ7-A75-J

    μQseven® standard module with NXP i.MX 6 Processor

    • Single and Dual Core Lite (ARM Cortex™A9 Cores)
    • FastEthernet; GPI/Os
    • 2D/3D dedicated graphics processors
    • up to 1GB DDR3L on-board
    Available in Industrial Temperature Range

      μQ7-A75-J

    μQ7-A75-J

    Q7-C25

    Q7-C25

    SM-C12

    SM-C12

    SYS-B08-7/BD

    SYS-B08-7/BD

     
    Product Development Status
    Processor

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    2
    0
    0
    1 + 1
    Max Thread
    ...
    0
    0
    ...
    Memory

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    512MB RAM
    Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking
    Fast Ethernet (10/100) interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    1x FastETH
    USB

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1x PCI-e x1 port, optional

    2x PCI-e x1 ports
    ...
    Audio
    I2S / AC’97 Audio Interface

    I2S Audio Interface

    I2S Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports
    ...

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC
    +3.3V_RTC

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Linux
    Yocto

    Linux
    Android

    Linux
    Android
    Linux
    Operating Temperature

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Dimensions
    40x70 mm (1.57” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    189.60 x 121.40 x 28.20 mm
    Security
    N/A
    N/A
    N/A
    N/A
    BIOS
    N/A
    N/A
    N/A
    N/A
    Embedded Controller Functionalities
    N/A
    N/A
    N/A
    N/A

    Description

    Details

    The extremely low power and low cost μQseven Rev. 2.0 Compliant Module with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support.
    Additional Information

    Additional Information

    Processor

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Max Cores
    2
    Memory

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Graphics

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Video Interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Video Resolution

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Mass Storage

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking
    Fast Ethernet (10/100) interface
    USB

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio
    I2S / AC’97 Audio Interface
    Other Interfaces

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Power Supply

    +5VDC ± 5%
    Optional Low Power RTC

    Operating System

    Linux
    Yocto

    Operating Temperature

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    40x70 mm (1.57” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

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    Documents

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    μQ7-A75-J

    μQ7-A75-J
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
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