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    Q7-C25

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors

    • 1x USB 3.0; 4x USB2.0; 1x PCI-e x1; 1x CAN Bus; 2x UART; 8x GPI/Os
    • Integrated GPU, supports 2 independent displays

    • up to 4GB soldered down DDR4-2400 memory

    Available in Industrial Temperature Range

      Q7-C25

    Q7-C25

    μQ7-962

    μQ7-962

    μQ7-A75-J

    μQ7-A75-J

    SBC-A62-J

    SBC-A62-J

     
    Product Development Status
    Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX 6 Family, based on ARM Cortex-A9 processors:
    SBC-A62-J-SOLO: Single Core (i.MX6S) @1GHz
    SBC-A62-J-LITE: Dual Core Lite (i.MX6DL) @1GHz
    SBC-A62-J-PLUS: Dual Core Plus (i.MX6DP) @1GHz
    SBC-A62-J-QUAD: Quad Core (i.MX6Q) @1GHz

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    2
    4
    Max Thread
    0
    0
    ...
    0
    Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Soldered on-board DDR3L memory***:
    SBC-A62-J-SOLO: 512MB 32-bit interface
    SBC-A62-J-LITE: 1GB 64-bit interface
    SBC-A62-J-PLUS: 2GB 64-bit interface
    SBC-A62-J-QUAD: 1GB 64-bit interface

    *** For additional configurability please contact SECO

    Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D
    OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62-J-QUAD)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays
    SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3independent displays

    Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface
    HDMI interface 1.4

    Video Resolution
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    HDMI, up to 1080p
    LVDS, up to 1920x1200

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    HDMI: up to 1920 x 1080p
    LVDS: up to 1920 x 1200

    Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    4GB eMMC drive soldered onboard***
    microSD Card slot
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector

    *** For additional configurability please contact SECO

    Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface

    Gigabit Ethernet connector
    Internal USB connector for Wi-Fi Module

    USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    PCI-e

    1x PCI-e x1 port, optional

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    ...
    Audio

    I2S Audio Interface

    I2S / AC’97 Audio Interface
    I2S / AC’97 Audio Interface

    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
    AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks

    Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    2 x Serial ports (TTL interface)
    CAN port interface
    ...

    Debug UART interface, TTL voltage level.
    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V)
    Other serial interfaces on the expansion connector:
    SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) -2 x CAN (TTL level);
    SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level);
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level)

    Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    I2C Bus
    SM Bus
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector;
    Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF Audio interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs

    * Please note that some of these interfaces are factory options, other configurations are made via SW.

    Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    +12VDC; Additional embedded Low Power RTC;
    SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real Time Clock (external battery required for time/date retention, not included)
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real TimeClock with onboard battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Linux
    Android

    Linux
    Yocto

    Linux
    Yocto

    - Free Android and Linux community BSP available at UDOO.org
    - SECO Android (under development) and Linux BSP / WEC7 on request. Please contact us
    - Yocto Guideline valid for SECO BSP

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)**
    For industrial temp. (-40°C ÷ +85°C)** please contact us

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    40x70 mm (μQseven, 1.57” x 2.76”)
    40x70 mm (1.57” x 2.76”)
    110 x 86.5 mm (4.5” x 3.7”)

    Description

    Details

    The Q7-C25 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. Q7-C25 is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia.

    Additional Information

    Additional Information

    Processor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Memory

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Graphics

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Video Interfaces

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Video Resolution
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    Mass Storage

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Networking

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    USB

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    PCI-e

    1x PCI-e x1 port, optional

    Audio

    I2S Audio Interface

    Serial Ports

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Other Interfaces

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    Power Supply

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    Operating System

    Linux
    Android

    Operating Temperature

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

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    Documents

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    Q7-C25

    Q7-C25
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      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8M Applications Processors
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    QC25-0000-2200-C0 Qseven with NXP i.MX 8M Q7-C25 Qseven - NXP i.MX 8M, LVDS Add to Compare

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    • Industrial Automation
    • Infotainment/Vending
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