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    Q7-922

    Computer on Module with NVIDIA® Tegra® T30 Processor

    • ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

    • 6x USB 2.0
    • NVIDIA GeForce Ultra low power GPU
    • up to 2GB DDR3L on-board soldered memory

      Q7-922

    Q7-922

    SM-C12

    SM-C12

    μQ7-A76-J

    μQ7-A76-J

    SYS-B08-7/BD

    SYS-B08-7/BD

     
    Product Development Status
    Processor
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    2
    1 + 1
    Max Thread
    0
    0
    2
    ...
    Memory
    up to 2GB DDR3L on-board soldered memory
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    512MB RAM
    Graphics
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking
    Gigabit Ethernet Interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet interface
    1x FastETH
    USB
    6 x USB 2.0 Host ports
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    2x PCI-e x1 ports
    3 x PCI-e x1 lanes (Gen2)
    ...
    Audio
    HD Audio Interface
    I2S Audio Interface
    HD Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    1 x Serial Port (TTL interface, Tx/Rx only)

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply

    +5VDC ± 5%

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Linux
    Linux
    Android

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Android
    Linux
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Dimensions
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    40 x 70 mm (1.57 x 2.76)
    189.60 x 121.40 x 28.20 mm

    Description

    Details

    Q7-922 is a Qseven® Rel. 1.20 Compliant Module designed by SECO that represents the top performance possibility for computational and graphical applications based on low power ARM architectures.
    The board integrates Tegra® T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
    Additional Information

    Additional Information

    Processor
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core
    Max Cores
    4
    Memory
    up to 2GB DDR3L on-board soldered memory
    Graphics
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support
    Video Interfaces
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    Video Resolution
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    Mass Storage
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Networking
    Gigabit Ethernet Interface
    USB
    6 x USB 2.0 Host ports
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    Audio
    HD Audio Interface
    Serial Ports

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Other Interfaces
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals
    Power Supply

    +5VDC ± 5%

    Operating System
    Linux
    Operating Temperature

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software
    Linux Kernel Patches
    • Patch to add jedec 5.1 Support*
    • e1000e_kernel_R16r2_svn1152.tar.gz*
    • Release Note - e1000e Patch.pdf*
    Linux 1.4
    • Linaro Compiler*
    • Kernel Linux 3.1.10*
    • File System Ubuntu 12.04 - Desktop version*
    • File System Ubuntu 12.04 - minimal version*
    • SECO Flash Bootargs*
    • SECO Tools*
    • U-Boot 2011.03*
    • md5sum.txt*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-922

    Q7-922
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    Computer on Module with NVIDIA® Tegra® T30 Processor
    sku part number part number description part number configuration buy samples online contact us compare
    Q922-1210-1000-E0 Qseven NVIDIA® Tegra® T30 Nvidia Tegra T30 @1,3GHz, 2GB RAM, eMMC 4GB, CAN Controller, (Extended temperature -20°C to 70°C) Add to Compare
    Q922-1210-1000-C0 Qseven NVIDIA® Tegra® T30 Nvidia Tegra T30 @1,3GHz, 2GB RAM, eMMC 4GB, CAN Controller (commercial temp.) Add to Compare

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