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    Q7-796

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

    • OMAP™ 37xx Family - ARM Cortex™ A8 up to 1 GHz core
    • 2 x COM ports; CAN interface; 10/100 Base-T interface
    • PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core
    • Mobile DDR 128 / 256MB / 512 MB onboard
    Available in Industrial Temperature Range

      Q7-796

    Q7-796

    Q7-C25

    Q7-C25

    μQ7-A75-J

    μQ7-A75-J

    SYS-B08-7/BD

    SYS-B08-7/BD

     
    Product Development Status
    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    1
    0
    2
    1 + 1
    Max Thread
    0
    0
    ...
    ...
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard

    soldered down DDR4-2400 memory, 32-bit interface, up to 8GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    512MB RAM
    Graphics
    ...
    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Video Resolution
    LVDS, up to 1366 x 768
    HDMI:Up to 4096 x 2160p60
    LVDS:Up to 1920 x 1080 @ 60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB

    eMMC 5.0 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking
    10/100 Base-T interface

    1 x Gigabit Ethernet interface

    Fast Ethernet (10/100) interface
    1x FastETH
    USB
    1x USB OTG
    2x USB 2.0 Host

    2 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    1 x USB 2.0 OTG port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    PCI-e
    ...

    2x PCI-e x1 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    ...
    Audio
    AC’97 Audio Interface

    I2S Audio Interface

    I2S / AC’97 Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serial Ports
    2 x COM ports

    CAN interface

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    ...

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Power Management Signals
    Watchdog

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Power Supply
    ...

    +5VDC ±5%
    +3.3V_RTC

    +5VDC ± 5%
    Optional Low Power RTC

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Microsoft® Windows® CE 6.0

    Linux

    Linux
    Android

    Linux
    Yocto

    Android
    Linux
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial
    Dimensions
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    40x70 mm (1.57” x 2.76”)
    189.60 x 121.40 x 28.20 mm

    Description

    Details

    The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.


    The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.

    Additional Information

    Additional Information

    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Max Cores
    1
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard
    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit
    Video Resolution
    LVDS, up to 1366 x 768
    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Networking
    10/100 Base-T interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    Audio
    AC’97 Audio Interface
    Serial Ports
    2 x COM ports

    CAN interface
    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    Operating System
    Microsoft® Windows® CE 6.0

    Linux
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documents
    Data Sheet
    Manual
    • quadmo747_x_omap3_manual_rel1_5.pdf*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-796

    Q7-796
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family
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