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    Q7-796

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

    • OMAP™ 37xx Family - ARM Cortex™ A8 up to 1 GHz core
    • 2 x COM ports; CAN interface; 10/100 Base-T interface
    • PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core
    • Mobile DDR 128 / 256MB / 512 MB onboard
    Available in Industrial Temperature Range

      Q7-796

    Q7-796

    μQ7-A76-J

    μQ7-A76-J

    SYS-B08-7/BD

    SYS-B08-7/BD

    Q7-C25

    Q7-C25

     
    Product Development Status
    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Chipset
    ...
    ...
    ...
    ...
    Max Cores
    1
    2
    1 + 1
    0
    Max Thread
    0
    2
    ...
    0
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    512MB RAM

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Graphics
    ...

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Video Resolution
    LVDS, up to 1366 x 768
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Networking
    10/100 Base-T interface
    Gigabit Ethernet interface
    1x FastETH

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    USB
    1x USB OTG
    2x USB 2.0 Host
    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    PCI-e
    ...
    3 x PCI-e x1 lanes (Gen2)
    ...

    1x PCI-e x1 port, optional

    Audio
    AC’97 Audio Interface
    HD Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header

    I2S Audio Interface

    Serial Ports
    2 x COM ports

    CAN interface
    1 x Serial Port (TTL interface, Tx/Rx only)

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    Power Supply
    ...
    +5VDC ± 5%

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    Power Consumption
    ...
    ...
    ...
    ...
    Operating System
    Microsoft® Windows® CE 6.0

    Linux

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Android
    Linux

    Linux
    Android

    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    40 x 70 mm (1.57 x 2.76)
    189.60 x 121.40 x 28.20 mm
    70x70 mm (2.76” x 2.76”)

    Description

    Details

    The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.


    The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.

    Additional Information

    Additional Information

    Processor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Max Cores
    1
    Memory
    Mobile DDR 128 / 256MB / 512 MB onboard
    Video Interfaces
    LVDS Single/Dual Channel 18/24 Bit
    Video Resolution
    LVDS, up to 1366 x 768
    Mass Storage
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Networking
    10/100 Base-T interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    Audio
    AC’97 Audio Interface
    Serial Ports
    2 x COM ports

    CAN interface
    Other Interfaces

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    Operating System
    Microsoft® Windows® CE 6.0

    Linux
    Operating Temperature

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    70x70 mm (2.76” x 2.76”)
    Software

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    Documents
    Data Sheet
    Manual
    • quadmo747_x_omap3_manual_rel1_5.pdf*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-796

    Q7-796
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family
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