SECO’s PICMG-based solutions at embedded world 2019
From 26 to 28 February 2019, the embedded world Exhibition & Conference, the leading international fair for embedded systems, is coming to the Nuremberg Exhibition Centre, Germany. SECO, a renowned company in electronic embedded solutions and a proud, long-time exhibitor at the fair, has put everything in place to showcase, on stand 1.330, the latest additions to its product range to the tens of thousands of expected visitors.
Among the innovations, SECO will be showcasing its vast array of state-of-the-art solutions in COM Express™ standard form factor.
First and foremost, the COMe-B75-CT6, a COM Express™ Compact 3.0 Type 6 Module based on the AMD Ryzen™ Embedded V1000 processors, will be presented on both the SECO stand and the PICMG stand (3A-528). Ensuring top performances thanks to the x86 "Zen" Core CPU, it also features an AMD Radeon™ Vega GPU with up to 11 compute units and support for DirectX® 12. As the icing on the cake, it can drive up to 4 independent displays at the same time. When it comes to connectivity, the COMe-B75-CT6 equips 4x USB 3.0, 8x USB 2.0, 4x PCI-e x1 Gen 3 and PEG x8 Gen 3. Finally, the module embeds two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory. The product is perfect for biomedical and medical devices, digital signage & infotainment and gaming.
On February 27 at 15:00 on the PICMG stand, Marco Attardo, SECO Channel Manager EMEA, will also give a presentation on a success story showing how SECO was able to meet several requirements of its customer (a provider of data acquisition and recording systems to avionics and aerospace companies) supplying a fanless and rugged COM Express™ Type 6 Compact w/AMD RX-416GD solution with high graphic performances and extended temperature range with coating service included, highlighting reasons for the COM Express™ form factor and processor choice.
On the SECO booth, the COM Express™ scalability with the latest Intel® platforms will be also highlighted. From the new COM Express™ Compact Type 6 module with the 8th Gen Intel® Core™ U-series processors (COMe-C55-CT6) to the COM Express™ Basic Type 6 module with the Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs (COMe-C08-BT6) and the COM Express™ Compact Type 6 Module based on the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium ®N Series (formerly Apollo Lake) processors, this broad range of solutions excels in terms of scalability and flexibility, with support for up to 3 independent 4K Ultra HD displays, industrial temperature range and HW accelerated machine learning through OpenVINO™, to fully meet a broad range of market demands and design requirements.