From 26 to 28 February 2019, the embedded world Exhibition & Conference, the leading international fair for embedded systems, is coming to the Nuremberg Exhibition Centre, Germany. SECO, a renowned company in electronic embedded solutions and a proud, long-time exhibitor at the fair, has put everything in place to showcase the latest additions to its product range to the tens of thousands of expected visitors. Among the innovations presented this year, SECO will be showcasing its vast array of state-of-the-art and fully scalable solutions - from low power to high-end SBCs and standard modules - built on the latest Intel® technologies in a large number of form factors, to fully meet a broad range of market demands and design requirements. From the new COM Express™ module with the 8th Gen Intel® Core™ U-series processors to the COM Express™ with the Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs and the complete product portfolio based on the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium ®N Series (formerly Apollo Lake) processors, all these solutions excel in terms of scalability and flexibility, with support for up to 3 independent 4K Ultra HD displays, industrial temperature range and HW accelerated machine learning through OpenVINO™. First and foremost, the COM Express™ scalability with the latest Intel® platforms will be highlighted with three innovative products: the COMe-C55-CT6, the COMe-C24-CT6, and the COMe-C08-BT6, all characterized by low-power consumption and significant multimedia capabilities. The main innovation is the COMe-C55-CT6, a COM Express™ 3.0 Compact Type 6 module with the 8th Gen Intel® Core™ U-series processors with 15W TDP. Designed as a low power multi-core Intel® architecture for mobile applications, it features an Intel® UHD Graphics 620 and, in terms of connectivity, comes with 4x USB 3.1, 8x USB 2.0, and most notably, up to 8x PCI-e x1 lanes. The memory consists of two DDR4 SO-DIMM slots supporting DDR4-2400 (up to 32GB). It excels in versatility, being capable of delivering on its promises in a wide number of fields such as biomedical and medical devices, digital signage & infotainment, edge computing, HMI, info kiosks, measuring instruments, and transportation. The COMe-C08-BT6, instead, is a COM Express™ 3.0 Basic Type 6 Module with the Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs. It is an exceptional platform when it comes to performance, with up to six cores for greater processing power. Furthermore, it features an Intel® Gen9 LP graphic core architecture, up to 48 execution units and also comes with 4x USB 3.0, 8x USB 2.0, 8x PCI-e x1 Gen3, and finally PEG x16 Gen3. The supported memory is up to 32GB DDR4-2666 on two SO-DIMM slots (also ECC technology with Xeon® and Core™ i3 combined with CM246 PCH). It is ideal for biomedical and medical devices, digital signage & infotainment, gaming, telco, HMI, industrial automation and control. The COMe-C24-CT6, finally, is a COM Express™ 3.0 Compact Type 6 Module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium ®N Series (formerly Apollo Lake) processors. The COMe-C24-CT6 shines in industrial scenarios and is indeed designed as a rugged solution for IIoT. It features an integrated Intel® HD Graphics 500 series controller with up to 18 execution units and, when it comes to connectivity, is equipped with 4x USB 3.0, 8x USB 2.0, 5x PCI-e x1 Gen2 and optional Gigabit Ethernet interface. Memory-wise it mounts two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory. Because of its industry-oriented features, it is particularly well suited for contexts such as automotive, avionics, transportation, biomedical and medical devices, industrial automation and control. Its great multimedia capabilities make it also suitable for digital signage & infotainment as well as gaming. In addition to the COM Express™ product line, SECO will also be presenting solutions using the SMARC® versatile and small form factor, such as the SM-B69. This module is a SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) processors. It mounts an integrated Gen9-LP HD graphics controller, with 18 execution units and, connectivity-wise, comes with 2x Gigabit Ethernet, 2x USB 3.0, 6x USB 2.0 and 4x PCI-e root ports. The memory is a dual channel soldered-down LPDDR4-2400 (up to 8GB). Like any other SMARC® module, the SM-B69 comes as an extremely compact low-power system and is therefore suitable for all those scenarios where energy-efficiency is an important requirement. The range of applications is, in fact, astounding, ranging from automotive, biomedical and medical devices to digital signage & infotainment, gaming, HMI, industrial, and also including IoT, mobile and multimedia devices, robotics, and visual computing. Looking at other small form factors that constitute SECO's product line, it’s worth mentioning SECO’s Intel®-based products built upon Qseven® standard. In particular, SECO is going to showcase the Q7-B03, a Qseven® Rel. 2.1 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) processors. The Q7-B03 is designed to be a high-graphic performance module, capable of withstanding extreme temperature and characterized by a low-power design. It mounts an integrated Gen9-LP graphics controller, with 18 execution units. Its connectivity is also a great plus of this product, that comes with 2x USB 3.0, 4x PCI-e root ports (including the PCI-e port used for Gigabit Ethernet), and 6x USB 2.0. Finally, the memory consists of a dual channel soldered-down DDR3L-1866 (up to 8GB). All in all, this computer-on-module is particularly flexible as it is suitable for multiple contexts and applications such as automotive, biomedical and medical devices, digital signage & infotainment, HMI, gaming, IoT, industrial, mobile and multimedia devices and visual computing. For those looking for an Intel®-based single-board computer with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series, SECO also provides a host of options, one of which is the SBC-C41-pITX, built upon the Pico-ITX form factor. Conceived as an x86 solution for IoT edge computing in harsh environments, it features an integrated Intel® HD Graphics 500 series controller with up to 18 execution units and, in terms of connectivity, it comes with a Dual Gigabit Ethernet connector, M.2 WWAN and WLAN slots, not to mention 8x GPIOs. The memory consists of an 8GB LPDDR4. All things considered, the SBC-C41-pITX is perfect for edge computing, industrial automation and control, info kiosks, IoT, surveillance, telecommunications and transportation. Last but not least, SECO has also developed a single-board solution based on the embedded NUC™ form factor, i.e. the SBC-B68-eNUC. Designed to be a flexible and expandable full industrial x86 eNUC SBC, it mounts Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series. Graphics-wise, the board comes with an integrated Intel® HD Graphics 500 series controller, with up to 18 execution units. In terms of connectivity, the board features 2x GbE, M.2 WWAN and WLAN slots, CIR sensor, 2x I2C, and 8x GPIOs. Finally, the memory is an LPDDR4 (up to 8GB) soldered onboard. It has several fields of applications, including automotive, digital signage & infotainment, HMI, industrial automation and control, info kiosks, IIoT, multimedia devices, and point of sales. With a much larger stand than in previous years, in addition to its complete solutions for the industrial domain and IoT, for the very first time SECO will also host the UDOO product line and applications for makers, educators and IoT designers: SECO is happy to welcome visitors to stand 1.330 at embedded world 2019.