SECO choose MICRO TERRA as a new distributor to accelerate the already fast growth of its business in Russia, with the aim to improve support for Russian companies that use SECO products.
On October 13th SECO will be in Pisa at the Officine Garibaldi for the TECH JOBS FAIR: an entire day dedicated to meetings between companies and professionals in the technology sector.
Two years after the stunning Kickstarter success of UDOO X86 the UDOO Team is back in the game with the UDOO BOLT.
SECO will showcase a comprehensive range of products at Nangang Exhibition Hall 1, booth No K0102, focused around SECO's cross-platform philosophy and its modular solutions with embedded system form factor standards (Qseven®, COM Express™, SMARC).
On 14-17 May 2018, SECO will take part to Intel® Partner Connect, an invite-only, premier-partner event by Intel® to be held at the Prague Congress Center in Prague, Czech Republic.
SECO participates in the Open Day of the Arezzo University Pole together with other companies of excellence in the IT and high tech sectors of the territory
By combining almost a century of expertise, know-how and technology of SECO and Wind River, it is now possible to offer complete solutions to the end customer, from the sensor to cloud applications, across the entire IoT landscape.
COMe-C08-BT6 enables the Intel® 8th Generation Core™ i7/i5/Xeon® Processors (formerly Coffee Lake H), reaching up to 12 threads. COMe-C08-BT6, a COM Express™ 3.0 Basic Type 6 Module, is an extraordinary platform as regards performance: with up to six cores at up to 4.7 GHz - not to mention the Intel® Hyper-Threading Technology, that adds 12 virtual cores on top of that – this module can handle anything you throw at it.
The SM-B71, among the products that SECO is going to present, deserves particular attention due to its unique architecture: it is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC – in other words, a combination of ARM and FPGA heterogeneous processing in a standard form factor.
extreme graphics, low-power processors, countless fields of applications
Among the great innovations of this year, the launch of COMe-B75-CT6: it is a COM Express™ Compact 3.0 Type 6 Module with nothing less than the AMD Ryzen™ Embedded V1000 processors.
As every year, SECO will be in Nuremberg (Germany) for the annual Embedded World trade fair. The 2018 event is held from the February 27th to March 1st, where SECO will be showcasing its solutions at booth 1.441 (SECO main booth), and 4.539 (SECO Lab booth, the education-oriented business unit).
‘I’m with Telethon Foundation’: SECO joins the program aimed at companies wishing to give concrete shape to their social and corporate responsibility by contributing to the construction of a future without genetic diseases.
At LinuxLab 2017 participants will have the chance to discover four of SECO solutions equipped with Linux; two are embedded modular solutions in the compact Qseven® form factor, a standard co-founded by SECO in 2008, and two systems for HMI applications with 7 and 10 inches displays