We’re in a garage in the 1970s and two guys are in the process of inventing the future.
SECO’s NXP i.MX8 solutions will be on display during the show on May 15/16, 2019
The domain of Human-Computer Interaction does not only concern the design of technology that is easy to use, useful, and fancy—it has to do with our role in shaping our environment, our ecological niche that today involves the whole earth.
SECO, a proven partner of NXP as well as a leading-edge partner of Arm is investing much effort in the partnership with NXP with both Layerscape® LX2160A Multicore Communications Processor and the i.MX 8 Family.
SECO makes your business IoT-ready in three easy steps
Heterogeneous processing systems based on the Xilinx® Zynq® Ultrascale+™ MPSoCs
Among the innovations presented this year, SECO will be showcasing its vast array of state-of-the-art and fully scalable solutions - from low power to high-end SBCs and standard modules - built on the latest Intel® technologies in a large number of form factors, to fully meet a broad range of market demands and design requirements.
Among the innovations, SECO will be showcasing at embedded world its vast array of state-of-the-art solutions in COM Express™ standard form factor.
Hangzhou, February 25th, 2019 - SECO SpA (Arezzo), a high-tech manufacturer of computer miniaturization and “ready-to-use” integrated systems, with shareholder FII Tech Growth fund backed by Cassa Depositi e Prestiti, is pleased to announce that today it has signed an agreement to acquire the majority of Fannal Electronics Co. Ltd., a leading manufacturer of Human Machine Interaction technologies based in Hangzhou (China).
SECO choose MICRO TERRA as a new distributor to accelerate the already fast growth of its business in Russia, with the aim to improve support for Russian companies that use SECO products.
On October 13th SECO will be in Pisa at the Officine Garibaldi for the TECH JOBS FAIR: an entire day dedicated to meetings between companies and professionals in the technology sector.
Two years after the stunning Kickstarter success of UDOO X86 the UDOO Team is back in the game with the UDOO BOLT.
SECO will showcase a comprehensive range of products at Nangang Exhibition Hall 1, booth No K0102, focused around SECO's cross-platform philosophy and its modular solutions with embedded system form factor standards (Qseven®, COM Express™, SMARC).
On 14-17 May 2018, SECO will take part to Intel® Partner Connect, an invite-only, premier-partner event by Intel® to be held at the Prague Congress Center in Prague, Czech Republic.
SECO participates in the Open Day of the Arezzo University Pole together with other companies of excellence in the IT and high tech sectors of the territory