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    COMe-B75-CT6

    COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors

    • AMD Ryzen™ Embedded V1000 processors
    • 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
    • AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

    • Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
    Available in Industrial Temperature Range

      COMe-B75-CT6

    COMe-B75-CT6

    COMe-C08-BT6

    COMe-C08-BT6

    COMe-A98-CT6

    COMe-A98-CT6

    COMe-B09-BT6

    COMe-B09-BT6

     
    Product Development Status
    Processor
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.75 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz in Turbo Boost),  with HT, 8MB Cache, 45W TDP
    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP
    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz in Turbo Boost), with HT, 12MB Cache, 45W TDP 

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Chipset
    ...
    Intel® QM370, HM370 or CM246 PCH
    ...

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    Max Cores
    4
    6
    4
    4
    Max Thread
    0
    12
    0
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    Memory
    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

    Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz (up to 1600MHz with GX217GI)

    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Graphics

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9,
    AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
    HEVC/H.265, VP9

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon™ R7
    AMD RX-418GD, RX-416GD - Radeon™ R6
    AMD GX-217GI - Radeon™ R6E
    Up to 3 independent displays supported (up to 2  with GX217GI)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported
    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    Video Interfaces

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (R-Series SOCs only, excludes one DDI Port)
    PCI-express Graphics (PEG) x 8 (x4 with GX217GI)

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Video Resolution

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Mass Storage
    2 x S-ATA Gen3 Channels

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    4 x S-ATA Gen3 Channels
    Networking

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.1 Gen2 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    3 x PCI-e x1 Gen3 lanes
    8 x PCI-e x1 Gen3 lanes
    Audio
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    Serial Ports

    2 x UARTs

    2 x UARTs
    ...
    2 x UARTs
    Other Interfaces

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4 x GPI, 4 x GPO

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Power Supply

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)
    +12VDC ± 10% and +5VSB (optional)
    Power Consumption
    ...
    ...
    ...
    ...
    Operating System

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)

    Description

    Details

    COMe-B75-CT6 is a COM Express™ Compact Type 6 with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
    Additional Information

    Additional Information

    Processor
    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.75 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released
    Max Cores
    4
    Memory
    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)
    Graphics

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Video Interfaces

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Video Resolution

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    Mass Storage
    2 x S-ATA Gen3 Channels
    Networking

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    Audio
    HD Audio Interface
    Serial Ports

    2 x UARTs

    Other Interfaces

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Power Supply

    +12VDC ± 10% and + 5VSB (optional)

    Operating System

    Microsoft® Windows 10
    Linux Ubuntu

    Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    Software
    EAPI
    • [Embedded application programming interface] - Release version 1.20.17*
    BIOS
    • [Bios] - Release version 1.02*
    Windows 10
    • [Driver package] - Release version 01*
    Linux Kernel Patches
    • [Amdgpu kernel package] - Kernel package 4.14 for Ubuntu 18.04.1*
    • [Amdgpu kernel package] - Kernel package 4.9 for Ubuntu 18.04.1*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Documents

    * User need to register to site before download reserved files. Please login if you are a registered user.

    COMe-B75-CT6

    COMe-B75-CT6
    • EVALUATE OUR PRODUCTS

      Max. 3 pcs per part number
    • SAMPLING PRICE

      Shipping costs included
    • BUSINESS TO BUSINESS ONLY

      Technical support provided exclusively to businesses
    COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors
    sku part number part number description part number configuration buy samples online contact us compare
    MB75-3001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp Add to Compare
    MB75-3001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp Add to Compare
    MB75-4001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp Add to Compare
    MB75-4001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp Add to Compare
    MB75-5001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1756B @ 3.25GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp Add to Compare
    MB75-6001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp Add to Compare
    MB75-6001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - Comm. Temp Add to Compare

    • Industrial Automation
    • Infotainment/Vending
    • Medical
    • Security/Surveillance
    • Transportation
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