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COMe-A98-CT6
COM Express™ Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon)
- AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J
- 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
- AMD Radeon 3rd -Generation Graphics Core Next (GCN)
- Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules
COMe-A98-CT6 |
COMe-B75-CT6 |
COMe-C08-BT6 |
SBC-B68-eNUC |
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| Product Development Status |
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| Processor |
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W |
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Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:
Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:
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Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP |
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| Chipset |
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Intel® QM370, HM370 or CM246 PCH
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| Max Cores |
4
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4
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6
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4
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| Max Thread |
0
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0
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12
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4
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| Memory |
R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz |
Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I) Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported |
Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB |
Quad Channel soldered down LPDDR4 memory, up to 8GB
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| Graphics |
AMD Radeon 3rd -Generation Graphics Core Next (GCN) |
AMD Radeon™ Vega GPU with up to 11 Compute Units |
Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units |
Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units |
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| Video Interfaces |
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) |
3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0 |
Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4 |
Two DP++ 1.2 interfaces on miniDP connectors |
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| Video Resolution |
DDIs: up to 4K |
DDIs, eDP: up to 4K |
eDP, DP: up to 4096x2304 @ 60Hz, 24bpp |
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| Mass Storage |
2 x SATA Gen3 Channels
SD interface shared with GPI/Os |
2 x S-ATA Gen3 Channels
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4 x S-ATA Gen3 Channels |
Optional eMMC drive onboard |
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| Networking |
Gigabit Ethernet interface
Intel® I210 / I211 GbE Controller |
Gigabit Ethernet interface |
Gigabit Ethernet interface |
2x Gbit LAN / Intel Gigabit Ethernet i21x family controller |
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| USB |
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports |
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports |
4 x USB 3.0 Host ports |
2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
2 x USB 2.0 Host ports on USB 2.0 Type-A sockets 2 x USB 2.0 Host ports on internal pin header 1 x USB 3.0 Host port on SSD/WWAN M.2 slot 1 x USB 2.0 Host port on WLAN M.2 Slot |
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| PCI-e |
3 x PCI-e x 1 lanes |
Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports |
8 x PCI-e x 1 Gen3 lanes |
1 x PCI-e x2 port on M.2 SSD/WWAN Slot
1 x PCI-e x1 port on WLAN M.2 Slot |
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| Audio |
HD Audio Interface
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HD Audio Interface
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HD Audio Interface
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HD Audio codec / Cirrus Logic CS4207
Mic In and Line Out Audio jacks Amplified Speaker output on internal pin header |
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| Serial Ports |
2 x HS UARTs
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2 x UARTs |
2 x UARTs
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2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
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| Other Interfaces |
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management |
SPI, I2C bus, SM Bus, LPC bus, FAN management Optional TPM 1.2 module on-board |
SPI, I2C, SM Bus, Thermal Management, FAN management |
2 x I2C + 8 x GPI/Os on Feature connector |
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| Power Supply |
+12VDC ± 10% and + 5VSB (optional)
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+12VDC ± 10% and + 5VSB (optional) |
+12VDC ± 10% and + 5VSB (optional) |
+18VDC ÷ +32 VDC recommended |
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| Power Consumption |
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| Operating System |
Microsoft® Windows 7 |
Microsoft® Windows 10 |
Microsoft® Windows 10 |
Microsoft® Windows 10 Enterprise (64 bit) |
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| Operating Temperature |
0°C ÷ +60 °C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
0°C ÷ +60 °C (Commercial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
0°C ÷ +60 °C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
0°C ÷ +60 °C (commercial version)
-40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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| Dimensions |
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
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95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
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125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout) |
101.6 x 101.6 mm (4” x 4”)
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| Security |
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| BIOS |
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| Embedded Controller Functionalities |
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| CAN Bus |
N/A
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N/A
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N/A
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| Functional Safety Features |
N/A
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N/A
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N/A
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Please wait... - Description
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Details
COMe-A98-CT6 is a COM Express Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. COMe-A98-CT6 is ideal in applications where scalable graphics performance makes the difference. - Additional Information
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Additional Information
Processor AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range
AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15WAMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10WMax Cores 4 Memory R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHzGraphics AMD Radeon 3rd -Generation Graphics Core Next (GCN)
AMD RX-421BD - Radeon R7
AMD RX-418GD, RX-416GD - Radeon R6
AMD-RX-216GD - Radeon R5
AMD GX-217GI - Radeon R6E
AMD GX-224IJ - Radeon R4E
AMD GX-215IJ - Radeon R2E
Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
DirectX® 12 supported
UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supportedVideo Interfaces Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
Optional VGA interface (excludes one DDI Port)
Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)Video Resolution DDIs: up to 4K
LVDS, VGA: up to 1920 x 1200 @ 60HzMass Storage 2 x SATA Gen3 Channels
SD interface shared with GPI/OsNetworking Gigabit Ethernet interface
Intel® I210 / I211 GbE ControllerUSB 4 x USB 3.0 Host ports
8 x USB 2.0 Host portsPCI-e 3 x PCI-e x 1 lanes
PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)Audio HD Audio Interface Serial Ports 2 x HS UARTs Other Interfaces SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
LID# / SLEEP# / PWRBTN#, Watchdog
4 x GPI, 4 x GPO (multiplexed with SD interface)
Optional TPM 1.2 or 2.0 module onboardPower Supply +12VDC ± 10% and + 5VSB (optional) Operating System Microsoft® Windows 7
Microsoft® Windows 10
Microsoft® Windows 10 IoT
LinuxOperating Temperature 0°C ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions 95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
COMe-A98-CT6
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Technical support provided exclusively to businesses
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