Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz (up to 1600MHz with GX217GI)

Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

Up to 2x 8GB DDR4 SODIMM modules

Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
Up to 3 independent displays supported
DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
HW accelerated video decode MPEG2, VC1/WMV9,
AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
HEVC/H.265, VP9

Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
Three independent display support

AMD Radeon 3rd -Generation Graphics Core Next (GCN)
RX-421BD -Radeon™ R7
RX-418GD -Radeon™ R6
RX-216GD -Radeon™ R5
GX-217GI -Radeon™ R6E
GX-224IJ, Radeon™ R4E

Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
Video Coding Engine (VCE) 3.1 (4K H.264 encode)

Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

Two DP++ 1.2 interfaces on miniDP connectors
(supports HDMI displays through external adapter)
embedded Display Port (eDP) internal connector
LVDS through optional external adapter

Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
LVDS, VGA: up to 1920x1200 @ 60Hz

Up to 4K

 4 x S-ATA Gen3 Channels
SD interface (shared with GPI/Os) 

Optional eMMC drive onboard
M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
microSD Card slot
SATA 7p M connector

** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

Up to 2x internal SATA drives
2x CFAST Slots
1x microSD card slot
PCI-e x4 M.2 Key M NVMe SSD Slot

Gigabit Ethernet interface
Intel® I219-LM GbE Controller

2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

4 x USB 3.1 Gen2 Host ports
8 x USB 2.0 Host ports

2x USB 3.0 Type-A sockets
2x USB 2.0 Type-A sockets
2x USB 3.0 on internal pin header
2x USB 2.0 on internal pin header

8 x PCI-e x 1 Gen3 lanes
PCI-express Graphics (PEG) Gen3 x16

1 x PCI-e x4 port on M.2 Key M SSD Slot

5.1 non-amplified Jacks
S/PDIF
Amplified Audio Stereo + Sub 3x30W

4 x RS-232 Full Modem ports on external DB9 male connectors
2 x RS-232 Full modem ports on internal IDC pin headers

SPI, I2C, SM Bus, Thermal Management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4 x GPI, 4 x GPO

2 x I2C + 8 x GPI/Os on Feature connector
Button / LED front panel header
CIR (Consumer InfraRed) sensor
microSIM slot for M.2 WWAN Modem
Optional TPM 2.0 on-board

2x FAN connectors
Optional TPM 1.2
TPM 2.0 embedded in SoC (Windows support only)
8 x GPI, 8 x GPO

+12V_DC ± 10% and + 5V_SB (optional)

+12V_DC ± 5%, mini-Fit 4x2 Power connector
220mAh non-rechargeable Coin cell battery for RTC

Microsoft® Windows 7
Microsoft® Windows 8.1
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Standard 8
Linux

Microsoft® Windows 10 
Linux

Microsoft® Windows 10 Enterprise (64 bit)
Microsoft® Windows 10 IoT Core
Wind River Linux 64 bit
Yocto (64 bit)
Android (planning)

Microsoft® Windows 7
Microsoft® Windows 8.1
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Microsoft® Windows Embedded Standard 7
Microsoft® Windows Embedded Standard 8
Linux

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C  ÷ +60 °C (Commercial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)