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    SM-B71

    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC

    • Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in C784 package
    • PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
    • Integrated ARM Mali-400 MP2 GPU
    • Up to 8GB + 2GB DDR4 soldered down
    Disponible dentro del rango de temperaturas industriales

      SM-B71

    SM-B71

    Q7-928

    Q7-928

    SM-B69

    SM-B69

    SM-C12

    SM-C12

     
    Estado de desarrollo del producto
    Procesador

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Chipset
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    Máx. núcleos
    0
    4
    4
    0
    Rodadura máx.
    0
    0
    4
    0
    Memoria
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Gráficos
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units
    Three Independent displays supported
    HW decoding of HEVC(H.265), H.264, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats
    HW encoding of HEVC(H.265), H.264, MVC, VP8, VP9 and JPEG/MPEG formats

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Interfaces vídeo
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Resolución de vídeo
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    DP++ Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    MIPI-DSI, LVDS Up to 1920 x 1200 @ 60Hz
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Almacenamiento en masa

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Optional eMMC 5.0 drive soldered on-board
    External S-ATA Gen3 Channel
    SD interface

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Red
    Up to 2 x Gigabit Ethernet interfaces
    Gigabit Ethernet interface

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e
    PCI-e x4 interface
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    4 x PCI-e Root Ports
    2x PCI-e x1 ports
    Audio
    Dependent on the IP implemented in the programmable logic
    AC'97 Audio Interface
    I2S
    HD Audio interface
    I2S Audio interface
    I2S Audio Interface
    Puertos en serie

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    2 x serial ports (TTL interface)
    CAN port interface

    2 x HS-UARTs
    2 x UARTs

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Otras interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    FAN management
    Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentación
    +3÷+5.25VDC
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC and +3.3V_RTC

    +5VDC
    +3.3V_RTC

    Consumo energético
    ...
    ...
    ...
    ...
    Sistema operativo
    Linux
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto

    Linux
    Yocto
    Android

    Temperatura de funcionamiento

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensiones
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    50 x 82 mm (1.97” x 3.23”)
    Seguridad
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    BIOS
    ...
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    ...
    ...
    Funcionalidades del controlador integrado
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Descripción

    Details

    The SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
    Información adicional

    Additional Information

    Procesador

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Memoria
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Gráficos
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec
    Interfaces vídeo
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces
    Resolución de vídeo
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    Almacenamiento en masa

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Rojo
    Up to 2 x Gigabit Ethernet interfaces
    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    PCI-e
    PCI-e x4 interface
    Audio
    Dependent on the IP implemented in the programmable logic
    Puertos en serie

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    Otras interfaces

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Alimentación
    +3÷+5.25VDC
    +3.3V_RTC
    Sistema operativo
    Linux
    Android
    Temperatura de funcionamiento

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensiones
    50 x 82 mm (1.97” x 3.23”)
    Software

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    Documentos

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    SM-B71

    SM-B71
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    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
    número de pieza sku descripción número de pieza configuración número de pieza compra muestras en línea contacto comparar
    RB71-6211-1000-C0-V SMARC - Xilinx Zynq Ultrascale+ ZU4EG Quad Core SMARC - Xilinx Zynq Ultrascale+ ZU4EG Quad Core + GPU @1,3GHz, 2GB DDR4 PSU Memory, 512MB DDR4 PL Memory, 4GB eMMC, 2nd Gigabit Ethernet - Commercial Temperature Añadir para comparar

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