[Picture] SBC-CD23_front

SBC-D23

3.5” SBC with Rockchip PX30 SoC

Product status

Development
Sampling
Production

Contact us for more information and quotes

CPU

Rockchip PX30 Processor

Graphics

Mali-G31 GPU

Connectivity

10/100 Ethernet; WiFi + BT onboard; 1x RS-232, 1 x RS-485, 1x CAN

Memory

Soldered-down DDR3L memory, up to 2GB

Product details

Technical Info

  • Description
    3.5” SBC with Rockchip PX30 SoC
  • Processor

    Rockchip PX30 processor, 4x Cortex®-A35 cores

  • Max Cores
    4
  • Memory

    Soldered-down DDR3L memory, up to 2GB total, 32-bit interface

  • Graphics

    Mali-G31 GPU with High performance dedicated 2D processor
    OpenGL ES 1.1 / 2.0 / 3.2, Vulkan 1.0, OpenCL 2.0 , DX11 FL9_3
    Embedded VPU, able to offer:

    • Multi-format 1080P 60fps video decoders (H.265, H.264,VC-1, MPEG-1/2/4, VP8)
    • 1080p Video encoding for H.264, VP8

    Supports 2 independent video outputs

  • Video Interfaces

    LVDS Single / Dual Channel interface
    HDMI interface

  • Video Resolution

    Up to 1920x1080

  • Mass Storage

    eMMC 5.1 Drive soldered on-board

  • Networking

    1x 10/100 Ethernet ports
    Soldered on-board M.2 1216 WLAN IEEE 802.11 a/b/g/n/ac + BT 5.0 module
    M.2 Socket 2 Key B WWAN Slot for M.2 Modems

  • USB

    4 x USB 2.0 Host ports on Dual Type-A sockets

  • Audio

    I2S Audio amplifier
    Line Out audio jack
    Buzzer on-board

  • Serial Ports

    1x Debug UART
    1x CAN port
    1x RS-485 port on DB-9 connector
    1x RS-232port on DB-9 connector
    1x TTL UART on internal connector

  • Other Interfaces

    microSIM Slot for optional M.2 WWAN modules (modem)
    Ultra-low Power RTC

  • Power Supply

    +12VDC ÷ +24 VDC
    RTC battery

  • Operating System

    Linux Yocto
    Android

  • Operating Temperature

    0°C ÷ +60°C (Commercial Temperature range)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    146 x 102 mm (3.5form factor)

Documentation