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    Arquitectura

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    1. Boxed Solution for Digital Signage applications based on the AMD Ryzen™ Embedded R1000 / V1000 family of SOCs
      • 2x GbE; M.2 WWAN and WLAN slots; 2x USB 3.0; 2x USB 2.0
      • AMD Radeon™ Vega GPU with up to 8 Compute Units
    2. Boxed solution based on the Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
      • 2x GbE; WWAN and WLAN M.2 module slots
      • Integrated Intel® HD Graphics 505 or 500 series controller

    3. 3.5” SBC with Rockchip RK3399 SoC
      • up to 2x GbE; opt WiFi; up to 2x RS-232 or RS-485 or CAN; opt Modem with SIM slot or eSIM
      • 4-Core Mali-T860MP4 GPU

    4. 3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs
      • 2x GbE; M.2 WWAN and WLAN slots; 2x USB3.0; 2x USB 2.0; 8x GPI/Os
      • AMD Radeon™ Vega GPU with up to 11 Compute Units

    5. COM Express™ 3.0 Compact Type 6 Module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
      • 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2
      • Intel® HD Graphics 500 series controller with up to 18 Execution Units 

    6. Pico-ITX SBC with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
      • 2x GbE; M.2 WWAN and WLAN slots; 8x GPI/Os
      • Integrated Intel® HD Graphics 500 series controller with up to 18 Execution Units

    7. Boxed solution based on the Intel® Atom™ X Series Processors
      • 2x GbE; WWAN and WLAN M.2 module slots
      • Integrated Intel® HD Graphics 500 or 505 series controller

    8. Qseven® Rel. 2.1 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
      • 2x USB 3.0; 4x PCI-e; 6x USB 2.0
      • Integrated Gen9-LP Graphics controller
    9. SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
      • 2x GbE; 6 x USB 2.0; 2 x USB 3.0; 4x PCI-e
      • Integrated Gen9-LP HD Graphics controller
    10. SMARC Rel. 2.1 compliant module with the NXP i.MX 8M Applications Processors
      • WiFi + BT LE; CSI camera; QuadSPI interface; 12x GPI/Os
      • Integrated Graphics Processing Unit, supports 2 independent displays
    11. embedded NUC™ SBC with the N-series Intel® Pentium® and Celeron® SOCs
      • 2x GbE; CIR sensor; 8x GPI/Os
      • Integrated Graphics, three independent display support
    12. SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
      • PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
      • Integrated ARM Mali-400 MP2 GPU
    13. COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors
      • 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
      • AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

    14. COM Express Compact Type 6 with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon)
      • 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3
      • AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    15. COM Express™ 3.0 Basic Type 6 Module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs
      • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
      • Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    16. COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
      • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
      • Intel® HD Graphics 530 /P530/630/P630

    17. COM Express™ Basic Type 6 Module with Intel® Haswell family CPUs
      • 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1
      • Integrated Intel® HD Graphics 4600
    18. COM Express™ Compact Type 6 with Intel® Atom™ E3800 and Celeron® families (formerly Bay Trail)
      • 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2
      • Integrated Intel® HD Graphics 4000 Series controller
    19. embedded NUC™ SBC with the Intel® Atom™ E39xx family, Intel® Celeron® N3350 and Intel® Pentium® N4200 (formerly code name Apollo Lake) SoCs
      • 2x GbE; M.2 WWAN and WLAN slots; CIR sensor; 2x I2C; 8x GPI/Os
      • Integrated Intel® HD Graphics 500 series controller

    20. Pico-ITX SBC with Intel® Atom™ E3800 family (formerly Bay Trail) SoCs and ECC DDR3L memory
      • 2x GbE; Half miniPCI-e slot; 8x GPI/Os
      • Integrated Intel® HD Graphics controller
    21. Pico-ITX SBC with AMD Embedded G-Series SoC
      • 2x GbE; Half miniPCI-e slot
      • Embedded AMD HD RADEON GPUs - HD8000 series
    22. Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)
      • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
      • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)

    23. Compact COM Express™ Rel.3.0 Type 6 module, with the AMD Ryzen™ Embedded R1000 family of SoCs
      • 4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3
      • AMD Radeon™ Vega GPU with 3 Compute Units

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