COMe-B75-CT6

COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors

Product status

Development
Sampling
Production
Available in Industrial Temperature Range

Contact us for more information and quotes

CPU

AMD Ryzen™ Embedded V1000 processors

Graphics

AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported

Connectivity

4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3

Memory

Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Product details

Technical Info

  • Description
    COMe-B75-CT6 is a COM Express™ Compact Type 6 with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
  • Processor

    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

  • Chipset

    AMD Ryzen™ Embedded V1000 processors

  • Max Cores
    4
  • Memory

    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I)

    Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported

  • Graphics

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

  • Video Interfaces

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

  • Video Resolution

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

  • Mass Storage

    2 x S-ATA Gen3 Channels

  • Networking

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

  • USB

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

  • PCI-e

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

  • Audio

    HD Audio Interface

  • Serial Ports

    2 x UARTs

  • Other Interfaces

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Optional TPM 1.2 module on-board

  • Power Supply

    +12VDC ± 10% and + 5VSB (optional)

  • Operating System

    Microsoft® Windows 10
    Linux Ubuntu

  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Software

Part Number

  • MB75-4001-1211-C0

    Part number description
    COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp
    Contact us for more informations or quotes
    CONTACT US
  • MB75-6001-2111-C0

    Part number description
    COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp
    Contact us for more informations or quotes
    CONTACT US

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Market applications