News

Fri, 04/20/2018 - 07:15
Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani. 
Tue, 04/03/2018 - 10:15

On the occasion of the ESC Boston 2018 SECO will present for the first time its COM Express ™ Type VI based on Intel® 8th generation Core ™ / Xeon® processors (formerly known as Coffee Lake H)

COMe-C08-BT6
Tue, 04/03/2018 - 09:30

COMe-C08-BT6 enables the Intel® 8th Generation Core™ i7/i5/Xeon® Processors (formerly Coffee Lake H), reaching up to 12 threads. COMe-C08-BT6, a COM Express™ 3.0 Basic Type 6 Module, is an extraordinary platform as regards performance: with up to six cores at up to 4.7 GHz - not to mention the Intel® Hyper-Threading Technology, that adds 12 virtual cores on top of that – this module can handle anything you throw at it.

Fri, 02/23/2018 - 12:45

Among the solutions that SECO is going to present, the SYS-A90-IPC stands out as a boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon). 

Fri, 02/23/2018 - 12:30

As a member of the exclusive i.MX 8 early development access program, SECO is delighted to present its innovative NXP-based solutions. 

Fri, 02/23/2018 - 12:30

The SM-B71, among the products that SECO is going to present, deserves particular attention due to its unique architecture: it is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC – in other words, a combination of ARM and FPGA heterogeneous processing in a standard form factor. 

Fri, 02/23/2018 - 12:30

extreme graphics, low-power processors, countless fields of applications

Fri, 02/23/2018 - 12:15

Among the great innovations of this year, the launch of COMe-B75-CT6: it is a COM Express™ Compact 3.0 Type 6 Module with nothing less than the AMD Ryzen™ Embedded V1000 processors. 

Fri, 02/23/2018 - 12:15

Arezzo (Italy), February 23, 2018

Fri, 02/23/2018 - 10:45

As every year, SECO will be in Nuremberg (Germany) for the annual Embedded World trade fair. The 2018 event is held from the February 27th to March 1st, where SECO will be showcasing its solutions at booth 1.441 (SECO main booth), and 4.539 (SECO Lab booth, the education-oriented business unit).

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SECO S.p.A. Via Calamandrei, 91, 52100 Arezzo Italy - Phone +39 0575 26979 - Fax: +39 0575 350210 - P.IVA 00325250512
Reg. Imprese n. 4196 Arezzo - REA n. 70645 - Meccanografico AR007079


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