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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. DEV-KIT-COMe-T6
    DEV-KIT-COMe-T6
    Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 6 modules
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  2. Carrier-COMe-T6-C30
    Carrier-COMe-T6-C30
    Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor
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  3. DEV-KIT-SMARC
    DEV-KIT-SMARC
    SMARC 2.0 / 2.1 / 2.1.1 Development Kit. (SMARC DEV KIT)
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  4. SOM-SMARC-EHL
    SOM-SMARC-EHL
    SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93)
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  5. DEV-KIT-Q7-2.1
    DEV-KIT-Q7-2.1
    Cross Platform Starter Kit compatible with both x86 and Arm Rel. 2.0 / 2.1 Qseven® modules . (Q7 STARTER KIT 2.1)
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  6. DEV-KIT-Q7-2.0
    DEV-KIT-Q7-2.0
    Cross Platform Starter Kit compatible with both x86 and Arm Rev. 2.0 Qseven® modules: a complete package including the basic components necessary to start developing. (Formerly Q7 DEV KIT 2.0)
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  7. Carrier-Q7-A42
    Carrier-Q7-A42
    Qseven® rel. 2.0 Compliant Carrier Board on 3.5” Form factor. (Formerly CQ7-A42)
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  8. Carrier-Q7-D59
    Carrier-Q7-D59
    Carrier Board for Qseven® Rel. 2.0 / 2.1 Compliant Modules in the 3.5” Form Factor. (Formerly CQ7-D59 )
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  9. Carrier-Q7-D03
    Carrier-Q7-D03
    Carrier Board for Qseven® and μQseven® Rev 2.1 Modules in embedded NUC™ Form factor . (Formerly CQ7-D03 )
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  10. Q928-DISS-1-C-M-PK
    Q928-DISS-1-C-M-PK
    Q7-928 Heat Spreader Monolithic block (PASSIVE) for COMMERCIAL VERSION and Solo & DualLite INDUSTRIAL Packaged
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Items 81-90 of 260

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Cpu Power Consumption
  1. range 10-25 W 25 item
  2. range < 10 W 40 item
  3. range < 5 W 6 item
  4. range > 25 W 9 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 3 item
  3. AMD® G-Series™ 2 item
  4. AMD® R-Series  2 item
  5. AMD® Ryzen™ embedded V-Series™ 5 item
  6. Espressif ESP32-D0WD 3 item
  7. Intel® Atom™ 29 item
  8. Intel® Celeron® 32 item
  9. Intel® Core™  18 item
  10. Intel® Pentium®  19 item
  11. Intel® Xeon® 3 item
  12. MediaTek Genio 510 1 item
  13. MediaTek Genio 700 1 item
  14. NVIDIA Tegra® T30  1 item
  15. NXP i.MX 8M 6 item
  16. NXP i.MX 8M Mini 7 item
  17. NXP i.MX 8M Nano 3 item
  18. NXP i.MX 8M Plus 2 item
  19. NXP i.MX 8X 3 item
  20. NXP i.MX 93 2 item
  21. NXP i.MX 933/935 1 item
  22. NXP i.MX 95 1 item
  23. NXP i.MX6  21 item
  24. NXP i.MX8  3 item
  25. Qualcomm Snapdragon 1 item
  26. Qualcomm® QCS5430 1 item
  27. Qualcomm® QCS6490 1 item
  28. Rockchip PX30 1 item
  29. Rockchip RK3399 5 item
  30. Rockchip RK3568 1 item
  31. Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 106 item
  2. ETHERNET≥2 54 item
Form Factor
  1. Boxed Solutions 15 item
  2. COM Express® 16 item
  3. COM-HPC® 5 item
  4. ESP32 2 item
  5. ETX®  1 item
  6. Modular HMIs 15 item
  7. Qseven 13 item
  8. Single Board Computer  29 item
  9. SMARC 13 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 4 item
  3. 48,5 x 32,5 mm 2 item
  4. 67,6 x 36,7 mm 4 item
  5. ≤ 100 x 100mm 38 item
  6. ≤ 80 x 80mm 22 item
  7. ≥ 100 x 100mm 39 item
Form Factor Specification
  1. 3,5" 9 item
  2. COM Express Basic 6 item
  3. COM Express Compact 10 item
  4. COM-HPC Client 4 item
  5. embedded NUC 2 item
  6. ESP32 2 item
  7. Other Single Board Computers 10 item
  8. Pico-ITX 4 item
  9. Qseven 70x70 mm 9 item
  10. µQseven 70x40 4 item
Mass Storage
  1. CFAST slot 3 item
  2. M.2 NVMe SSD slot 13 item
  3. M.2 SATA SSD slot 16 item
  4. microSD card slot  29 item
  5. mSATA half-size slot 2 item
  6. onboard eMMC 88 item
  7. onboard SSD 5 item
  8. PATA channel 2 item
  9. SATA channels ≥ 1 44 item
  10. SATA channels ≥ 2  31 item
  11. SATA channels ≥ 3 6 item
  12. SATA channels ≥ 4 4 item
  13. SD interface  39 item
  14. standard SATA connector 8 item
Memory
  1. soldered down 60 item
  2. SO_DIMM 31 item
  3. ≤1 98 item
  4. ≤16 25 item
  5. ≤2 83 item
  6. ≤4 73 item
  7. ≤8 57 item
  8. ≥32 23 item
Operating Temperature
  1. -20°C ÷ +60°C 44 item
  2. -20°C ÷ +70°C 14 item
  3. -40°C ÷ +85°C 56 item
  4. 0°C ÷ +50°C 85 item
  5. 0°C ÷ +60°C 97 item
  6. 20°C ÷ +70°C 42 item
Pci Express
  1. PCI-e lanes ≥ 1 46 item
  2. PCI-e lanes ≥ 2 36 item
  3. PCI-e lanes ≥ 3 27 item
  4. PCI-e lanes ≥ 4 26 item
  5. PCI-e lanes ≥ 5 19 item
Ttl Uarts
  1. ≥1 55 item
  2. ≥2 52 item
  3. ≥3 19 item
USB
  1. USB 2.0 ≥ 1  94 item
  2. USB 2.0 ≥ 2  85 item
  3. USB 2.0 ≥ 3 55 item
  4. USB 2.0 ≥ 4 44 item
  5. USB 2.0 ≥ 5 28 item
  6. USB 2.0 ≥ 6 24 item
  7. USB 3.0 ≥ 1 49 item
  8. USB 3.0 ≥ 2 39 item
  9. USB 3.0 ≥ 3 13 item
  10. USB 3.0 ≥ 4 9 item
  11. USB 3.1 ≥ 1 11 item
  12. USB 3.1 ≥ 2 9 item
  13. USB 3.2 ≥ 1 7 item
  14. USB 3.2 ≥ 2 12 item
  15. USB 4.0 ≥ 1 4 item
  16. USB 4.0 ≥ 2 5 item
  17. USB 4.0 ≥ 3 3 item
  18. USB 4.0 ≥ 4 4 item
  19. USB CLIENT 4 item
  20. USB OTG 41 item
Video Interfaces
  1. DDI 14 item
  2. DP 32 item
  3. DP++ 35 item
  4. DUAL CHANNEL LVDS 53 item
  5. eDP 43 item
  6. HDMI 67 item
  7. MIPI-CSI camera connector 11 item
  8. MIPI-DSI 14 item
  9. PARALLEL RGB 7 item
  10. SINGLE CHANNEL LVDS 53 item
  11. VGA 7 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 29 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 12 item
  3. M.2 Socket 2 key B (SSD) 11 item
  4. ONBOARD WI-FI/BLE 29 item
Installation Depth
  1. 30-35 4 item
  2. 35-40 5 item
  3. 40-45 1 item
  4. >45 7 item
Screen Dimension
  1. <8 4 item
  2. 10-14 8 item
  3. 14-19 3 item
  4. >20 1 item