Modules

Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description

The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.

33 Products

SM-D18

SMARC Rel. 2.1 compliant module with NXP i.MX 8M Plus Applications Processors

  • 2x Gigabit Ethernet; opt. Wi-Fi +BT 5.0; CSI camera; 2x USB 3.0; 3x USB2.0; 1x PCI-e x1; 2x CAN Bus; 4xUART; 14x GPI/Os; QuadSPI interface
  • Integrated GPU, supports 3 independent displays
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CHPC-C77-CSA

COM-HPC® Client module Size A, with the 11th Gen Intel® Core™ and Celeron® processors (formerly Tiger Lake-U)

  • 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3 ; 1x PCI-e x4 Gen4; up to 2x 2.5GbE
  • Intel® Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays
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SM-C93

SMARC® Rel. 2.1 compliant module with the Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors (formerly Elkhart Lake) for FuSa applications

  • 2x GbE with precision time protocol IEEE 1588, optional SERDES for external 3rd Ethernet, 6x USB 2.0, 3x USB 3.1, up to 4x PCI-e
  • Integrated Gen11 UHD Graphics controller supporting 3 independent displays
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