Boxed Solutions

Off-The-Shelf Solutions
Experience in Assembly Services
Experience in Mechanical Design
Possibilities Offered by SECO
Heat dissipation solutions - both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
Manufacturing of plastic components with injection molding
Production of aluminum mechanical parts with extrusion technology
Design of mechanical parts with die-casting technology
Bending and pressing of sheet metal parts
Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays, etc.
Description

Thanks to our experience in integrating modules and boards into complex systems, SECO has created “off-the-shelf” solutions based on its own ARM and x86 SBCs, all available in our catalog. SECO Boxed Solutions have been developed for applications in Industrial IoT with the goal of satisfying the need for flexibility and security.

7 Products

SYS-B68-IPC

Boxed solution based on the Intel® Atom™ X Series (formerly Apollo Lake) Processors

  • 2x GbE; WWAN and WLAN M.2 module slots
  • Integrated Intel® HD Graphics 500 or 505 series controller
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SYS-B68-IGW

Boxed solution based on the Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

  • 2x GbE; WWAN and WLAN M.2 module slots
  • Integrated Intel® HD Graphics 505 or 500 series controller
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SYS-C90-DS

Boxed Solution for Digital Signage applications based on the AMD Ryzen™ Embedded R1000 / V1000 family of SOCs

  • 2x GbE; M.2 WWAN and WLAN slots; 2x USB 3.0; 2x USB 2.0
  • AMD Radeon™ Vega GPU with up to 8 Compute Units
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SYS-C23-IGW

Industrial IoT Gateway based on the NXP i.MX 6SoloX Processor

  • up to 2x Fast Eth; WiFi + BTLE; optional LTE Cat4 modem onboard; 3x Multicolor Signalling LEDs; 1x RS-232 port; 1x RS-485 port; 2x CAN port
  • N.A.
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SYS-A90-IPC

Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)

  • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
  • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)
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B901

The boxed solution B901 supports the CQ7-901 carrier board on Pico-ITX Form Factor and the following module: • Q7-928

  • 1 x Gigabit / FastEthernet connector 1 x optional additional FastEthernet port
  • 2D/3D dedicated graphics processors (Q7-928)
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[Picture] SENSE-D47_front

SENSE-D47

IoT Sensor to Cloud

  • Programmable expansion connector, CAN Port, dedicated RS-232 / TTL UART
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