HMI Solutions

Touch displays
Experience in assembly services
Experience in mechanical design
Possibilities Offered by SECO
Touch integration for Resistive, Capacitive and Projected Capacitive technologies
Touch-screen customization
LCD Air Bonding, OCA, and OCR touch-screen bonding technologies
Heat dissipation solutions – both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
Manufacturing of plastic elements with injection molding
Production of aluminum mechanical parts with extrusion technology
Design of mechanical parts with die-casting technology
Bending and pressing of sheet metal parts
Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays
Description

Thanks to its experience in integrating modules and boards into complex systems, SECO has created user-ready, off-the-shelf HMI solutions with touch displays and integrated boards, based on its own ARM and x86 SBCs that are also available in our catalog. Get inspired and find ideas for your own custom solution.

2 Products

SYS-B08-7

Embedded Panel with 7” LCD display based on the NXP i.MX 6SoloX Processor

  • up to 2x Fast Eth; optional WiFi + BT LE
  • Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
Development
Sampling
Production
SHOW DETAILS
Production

SYS-A62-10

Embedded Panel with 10.1” LCD display based on the Multicore NXP i.MX 6 SoC family

  • Wi-Fi add-on module; up 22 GPI/Os; CAN Bus
  • 30K hours 10.1" LVDS display with projected capacitive touchscreen integrated
Development
Sampling
Production
SHOW DETAILS
Production