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    μQ7-A75-J

    μQseven® standard module with NXP i.MX6 Processor

    • Single and Dual Core Lite (ARM Cortex™A9 Cores)
    • FastEthernet; GPI/Os
    • 2D/3D dedicated graphics processors
    • up to 1GB DDR3L on-board
    Verfügbar im industriellen Temperaturbereich

      μQ7-A75-J

    μQ7-A75-J

    SYS-B08-7/BD

    SYS-B08-7/BD

    Q7-928

    Q7-928

    SM-C12

    SM-C12

     
    Entwicklungsstatus des Produkts
    Prozessor

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    2
    1 + 1
    4
    0
    Maximale Gewindelänge
    ...
    ...
    0
    0
    Speicher

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    512MB RAM
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Grafik

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Videoschnittstellen

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Videoauflösung

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Massenspeicher

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Networking
    Fast Ethernet (10/100) interface
    1x FastETH
    Gigabit Ethernet interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    ...
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    2x PCI-e x1 ports
    Audio
    I2S / AC’97 Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    AC'97 Audio Interface
    I2S
    I2S Audio Interface
    Serielle Anschlüsse
    ...

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    2 x serial ports (TTL interface)
    CAN port interface

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Andere Schnittstellen

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Stromversorgung

    +5VDC ± 5%
    Optional Low Power RTC

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ± 5%

    +5VDC
    +3.3V_RTC

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Linux
    Yocto

    Android
    Linux

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux
    Android
    Betriebstemperatur

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    40x70 mm (1.57” x 2.76”)
    189.60 x 121.40 x 28.20 mm
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)

    Beschreibung

    Details

    The extremely low power and low cost μQseven Rev. 2.0 Compliant Module with the NXP i.MX6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX6 product family, along with dedicated hardware and software development support.
    Zusatzinformation

    Zusatzinformation

    Prozessor

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Max Cores
    2
    Speicher

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Grafik

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Videoschnittstellen

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Videoauflösung

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Massenspeicher

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking
    Fast Ethernet (10/100) interface
    USB

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio
    I2S / AC’97 Audio Interface
    Andere Schnittstellen

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Stromversorgung

    +5VDC ± 5%
    Optional Low Power RTC

    Betriebssystem

    Linux
    Yocto

    Betriebstemperatur

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    40x70 mm (1.57” x 2.76”)
    Software
    SECO WIKI
    Linux
    • SECO BSP*
    Linux-YOCTO
    • Yocto meta SECO BSP release Guideline*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Dokumente

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    μQ7-A75-J

    μQ7-A75-J
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    μQseven® standard module with NXP i.MX6 Processor
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