Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

soldered down LPDDR4-3200 memory, 64-bit interface

Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Supports 2 independent displays

Integrated Graphics Processing Unit, supports 2 independent displays
Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface

HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

LVDS, resolution up to 1920x1200
HDMI, resolution up to 1080p

On-board eMMC drive, up to 8 GB
SD / MMC / SDIO interface
Internal SPI Flash for booting

1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
eMMC 5.1 drive soldered on-board
SD 4-bit interface
QSPI Flash soldered-on-board

1 x Gigabit Ethernet interface

1 x USB OTG interface
1 x USB 2.0 Host interface

4 x USB 2.0 Host Ports 
1 x USB 3.0 Host Port
1 x USB 2.0 OTG port

1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

Up to 2x PCI-e x1 Gen3 ports

I2S Audio Interface

1x UART Tx/Rx/RTS/CTS
1x CAN Bus (TTL level)

On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
- Additional SD interface
- Up to 4 UARTs
- CAN interface
- Watchdog(s)
- I2C interfaces
- PWM outputs
- SPI interface
- Additional Audio interface

(*) not all the combinations are allowed simultaneously Power Management Signals

1x 4-lanes + 1x 2-lanes CSI camera interfaces
I2C Bus
SM Bus
2x SPI interfaces
QuadSPI interface
12 x GPI/Os
Boot select signals
Power Management Signals

CSI camera connector
2x I2C Bus
SPI interface
8 x GPI/Os
Boot select signal
Power Management Signals
Watchdog

+5V_DC ± 5%
Optional Low Power RTC

+5V_DC
+3.3V_RTC

+5V_DC ± 5%
+3.3V_RTC

Linux
Yocto

Linux
Android

0°C ÷ +60°C (commercial version)
-40°C ÷ +85°C (industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C  ÷ +60 °C (commercial temp.)*
-40°C ÷ +85°C (Industrial temp.)* 

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.