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    SYS-A90-IPC

    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)

    • AMD Embedded 3rd generation R-Series SOC or G-Series SOC-I or G-Series SOC-J (formerly Prairie Falcon)
    • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
    • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)

    • Up to 2x 8GB DDR4 SODIMM modules

      SYS-A90-IPC

    SYS-A90-IPC

    COMe-A98-CT6

    COMe-A98-CT6

    COMe-B09-BT6

    COMe-B09-BT6

    SBC-B68-eNUC

    SBC-B68-eNUC

     
    Entwicklungsstatus des Produkts
    Prozessor

    AMD Embedded 3rd generation R-Series SOC (Merlin Falcon):
    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded 3rd generation G-Series SOC-I (Brown Falcon):
    AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon):
    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Chipsatz
    ...
    ...

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    ...
    Max Cores
    0
    4
    4
    4
    Maximale Gewindelänge
    0
    0
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    4
    Speicher

    Up to 2x 8GB DDR4 SODIMM modules

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
    G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHz 

    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Grafik

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Videoschnittstellen

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Videoauflösung

    Up to 4K

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    Massenspeicher

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    4 x S-ATA Gen3 Channels

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Networking

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    USB

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    PCI-e

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

    8 x PCI-e x1 Gen3 lanes
    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    Audio

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    HD Audio Interface
    HD Audio Interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    Serielle Anschlüsse

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    2 x HS UARTs
    2 x UARTs
    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    Andere Schnittstellen

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Stromversorgung

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    +12VDC ± 10% and + 5VSB (optional)
    +12VDC ± 10% and +5VSB (optional)
    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Betriebstemperatur

    0°C ÷ +60 °C (Commercial temp.)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    101.6 x 101.6 mm (4” x 4”)
    Security
    Keine Angabe
    ...
    Keine Angabe
    ...
    BIOS
    Keine Angabe
    ...
    Keine Angabe
    ...
    Embedded Controller Functionalities
    Keine Angabe
    ...
    Keine Angabe
    ...

    Beschreibung

    Details

    The SYS-A90-IPC is a Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon) designed for high level graphic performance. It includes 3 independent heads with UltraHD 4K resolution and h.264/h.265 4K hardware decoding and is ideal for digital signage and infotainment applications.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    AMD Embedded 3rd generation R-Series SOC (Merlin Falcon):
    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded 3rd generation G-Series SOC-I (Brown Falcon):
    AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon):
    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W

    Speicher

    Up to 2x 8GB DDR4 SODIMM modules

    Grafik

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    Videoschnittstellen

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Videoauflösung

    Up to 4K

    Massenspeicher

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    Networking

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    USB

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    PCI-e

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    Audio

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    Serielle Anschlüsse

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    Andere Schnittstellen

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    Stromversorgung

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    Betriebssystem

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Betriebstemperatur

    0°C ÷ +60 °C (Commercial temp.)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    Software
    BIOS
    • [BIOS] – Release version 1.08*
    Windows 10
    • [Driver package] – Release version 01*
    Linux
    • [Amdgpu kernel package] – Kernel package 4.19.8 for Ubuntu 18.04.1*
    • [Amdgpu kernel package] – Kernel package 4.14.14 for Ubuntu 18.04.1*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    SYS-A90-IPC

    SYS-A90-IPC
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    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)
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    SYS-A90-IPC Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) Auf die Vergleichsliste

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    • Gebäudetechnik /Home Automation
    • Industrielle Automatisierung
    • Infotainment/Vending
    • Transport- und Verkehrswesen
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