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    Mehr Ansichten

    SYS-A90-IPC

    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)

    • AMD Embedded 3rd generation R-Series SOC or G-Series SOC-I or G-Series SOC-J (formerly Prairie Falcon)
    • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
    • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)

    • Up to 2x 8GB DDR4 SODIMM modules

      SYS-A90-IPC

    SYS-A90-IPC

    SBC-B68-eNUC

    SBC-B68-eNUC

    COMe-B09-BT6

    COMe-B09-BT6

    COMe-B75-CT6

    COMe-B75-CT6

     
    Entwicklungsstatus des Produkts
    Prozessor

    AMD Embedded 3rd generation R-Series SOC (Merlin Falcon):
    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded 3rd generation G-Series SOC-I (Brown Falcon):
    AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon):
    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released
    Chipsatz
    ...
    ...

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    ...
    Max Cores
    0
    4
    4
    4
    Max Thread
    0
    4
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    0
    Speicher

    Up to 2x 8GB DDR4 SODIMM modules

    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH

    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I)

    Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported

    Grafik

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Videoschnittstellen

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Videoauflösung

    Up to 4K

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    Massenspeicher

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    4 x S-ATA Gen3 Channels
    2 x S-ATA Gen3 Channels
    Networking

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    USB

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    8 x PCI-e x1 Gen3 lanes

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    Audio

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    HD Audio Interface
    HD Audio Interface
    Serielle Anschlüsse

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    2 x UARTs

    2 x UARTs

    Andere Schnittstellen

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Optional TPM 1.2 module on-board

    Stromversorgung

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    +18VDC ÷ +32 VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery

    +12VDC ± 10% and +5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Linux

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Yocto (64 bit)
    Linux

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 10
    Linux

    Microsoft® Windows 10
    Linux Ubuntu

    Betriebstemperatur

    0°C ÷ +60 °C (Commercial temp.)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    101.6 x 101.6 mm (4” x 4”)
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    Keine Angabe
    Keine Angabe
    Keine Angabe
    ...
    Functional Safety Features
    Keine Angabe
    Keine Angabe
    Keine Angabe
    ...

    Beschreibung

    Details

    The SYS-A90-IPC is a Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon) designed for high level graphic performance. It includes 3 independent heads with UltraHD 4K resolution and h.264/h.265 4K hardware decoding and is ideal for digital signage and infotainment applications.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    AMD Embedded 3rd generation R-Series SOC (Merlin Falcon):
    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded 3rd generation G-Series SOC-I (Brown Falcon):
    AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon):
    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W

    Speicher

    Up to 2x 8GB DDR4 SODIMM modules

    Grafik

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    Videoschnittstellen

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Videoauflösung

    Up to 4K

    Massenspeicher

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    Networking

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    USB

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    PCI-e

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    Audio

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    Serielle Anschlüsse

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    Andere Schnittstellen

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    Stromversorgung

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    Betriebssystem

    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Linux

    Betriebstemperatur

    0°C ÷ +60 °C (Commercial temp.)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    Software
    BIOS
    • [BIOS] – Release version 1.08 - download with Chrome or Firefox*
    Windows 10
    • [Driver package] – Release version 01*
    Linux
    • [Amdgpu kernel package] – Kernel package 4.19.8 for Ubuntu 18.04.1*
    • [Amdgpu kernel package] – Kernel package 4.14.14 for Ubuntu 18.04.1*

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    Dokumente

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    SYS-A90-IPC

    SYS-A90-IPC
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    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    SYS-A90-IPC Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) Auf die Vergleichsliste

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    • Gebäudetechnik /Home Automation
    • Industrielle Automatisierung
    • Infotainment/Vending
    • Transport- und Verkehrswesen
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