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    SYS-A90-IPC

    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)

    • AMD Embedded 3rd generation R-Series SOC or G-Series SOC-I or G-Series SOC-J (formerly Prairie Falcon)
    • 2x GbE; 4x USB 3.0; 4x USB 2.0; 6x RS-232
    • AMD Radeon™ 3rd -Generation Graphics Core Next (GCN)

    • Up to 2x 8GB DDR4 SODIMM modules

      SYS-A90-IPC

    SYS-A90-IPC

    COMe-B75-CT6

    COMe-B75-CT6

    COMe-B09-BT6

    COMe-B09-BT6

    COMe-C08-BT6

    COMe-C08-BT6

     
    Entwicklungsstatus des Produkts
    Prozessor

    AMD Embedded 3rd generation R-Series SOC (Merlin Falcon):
    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded 3rd generation G-Series SOC-I (Brown Falcon):
    AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon):
    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
    AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
    AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

    • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
    • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
    • Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

    Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

    • Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
    • Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
    • Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
    • Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
    • Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
    • Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
    • Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP
    Chipsatz
    ...
    ...

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    Intel® QM370, HM370 or CM246 PCH
    Max Cores
    0
    4
    4
    6
    Maximale Gewindelänge
    0
    0
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    12
    Speicher

    Up to 2x 8GB DDR4 SODIMM modules

    Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 64GB 
    ECC DDR4 memory modules supported only with Xeon®, Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

    Grafik

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    AMD Radeon™ Vega GPU with up to 11 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    4 independent displays supported

    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9

    Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG, HEVC/H.265, VP9

    Videoschnittstellen

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Videoauflösung

    Up to 4K

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Massenspeicher

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    2 x S-ATA Gen3 Channels
    4 x S-ATA Gen3 Channels

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    Networking

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports 

    PCI-e

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
    PCI-express Graphics (PEG) x 8 Gen3

    8 x PCI-e x1 Gen3 lanes

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    Audio

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    Serielle Anschlüsse

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    2 x UARTs

    2 x UARTs
    2 x UARTs
    Andere Schnittstellen

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    SPI, I2C bus, SM Bus, LPC bus, FAN management
    LID#/SLEEP#/PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog 
    4 x GPI, 4 x GPO (pins shared with SD interface)

    Stromversorgung

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and +5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 10
    Linux Ubuntu

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Microsoft® Windows 10 
    Linux

    Betriebstemperatur

    0°C ÷ +60 °C (Commercial temp.)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    Security
    Keine Angabe
    ...
    Keine Angabe
    Keine Angabe
    BIOS
    Keine Angabe
    ...
    Keine Angabe
    Keine Angabe
    Embedded Controller Functionalities
    Keine Angabe
    ...
    Keine Angabe
    Keine Angabe

    Beschreibung

    Details

    The SYS-A90-IPC is a Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon) designed for high level graphic performance. It includes 3 independent heads with UltraHD 4K resolution and h.264/h.265 4K hardware decoding and is ideal for digital signage and infotainment applications.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    AMD Embedded 3rd generation R-Series SOC (Merlin Falcon):
    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), 2MB L2 Cache, TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded 3rd generation G-Series SOC-I (Brown Falcon):
    AMD GX-217GI, Dual Core @ 1.7 GHz (2.0 GHz Max), 1MB L2 Cache, TDP 15W

    AMD Embedded™ 3rd generation G-Series SOC-J (Prairie Falcon):
    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8 GHz Max), 1MB L2 Cache, TDP 15W

    Speicher

    Up to 2x 8GB DDR4 SODIMM modules

    Grafik

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    RX-421BD -Radeon™ R7
    RX-418GD -Radeon™ R6
    RX-216GD -Radeon™ R5
    GX-217GI -Radeon™ R6E
    GX-224IJ, Radeon™ R4E

    Three independent displays supported (two with GX-217GJ and GX-224IJ) DirectX® 12 supported
    Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode)
    Video Coding Engine (VCE) 3.1 (4K H.264 encode)

    Videoschnittstellen

    Up to 3 DP++ interfaces, supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0

    Videoauflösung

    Up to 4K

    Massenspeicher

    Up to 2x internal SATA drives
    2x CFAST Slots
    1x microSD card slot
    PCI-e x4 M.2 Key M NVMe SSD Slot

    Networking

    2x Gigabit LAN / Realtek RTL8111G Gigabit Ethernet controllers

    USB

    2x USB 3.0 Type-A sockets
    2x USB 2.0 Type-A sockets
    2x USB 3.0 on internal pin header
    2x USB 2.0 on internal pin header

    PCI-e

    1 x PCI-e x4 port on M.2 Key M SSD Slot

    Audio

    5.1 non-amplified Jacks
    S/PDIF
    Amplified Audio Stereo + Sub 3x30W

    Serielle Anschlüsse

    4 x RS-232 Full Modem ports on external DB9 male connectors
    2 x RS-232 Full modem ports on internal IDC pin headers

    Andere Schnittstellen

    2x FAN connectors
    Optional TPM 1.2
    TPM 2.0 embedded in SoC (Windows support only)
    8 x GPI, 8 x GPO

    Stromversorgung

    +12VDC ± 5%, mini-Fit 4x2 Power connector
    220mAh non-rechargeable Coin cell battery for RTC

    Betriebssystem

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Betriebstemperatur

    0°C ÷ +60 °C (Commercial temp.)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    300 x 230 x 90 mm (11.81” x 9.05” x 3.54”)

    Software
    BIOS
    • [BIOS] – Release version 1.08*
    Windows 10
    • [Driver package] – Release version 01*
    Linux
    • [Amdgpu kernel package] – Kernel package 4.19.8 for Ubuntu 18.04.1*
    • [Amdgpu kernel package] – Kernel package 4.14.14 for Ubuntu 18.04.1*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    SYS-A90-IPC

    SYS-A90-IPC
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    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) or G-Series SOC-J (formerly Prairie Falcon)
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    SYS-A90-IPC Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) Auf die Vergleichsliste

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    • Gebäudetechnik /Home Automation
    • Industrielle Automatisierung
    • Infotainment/Vending
    • Transport- und Verkehrswesen
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