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    SM-C12

    SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors
    • WiFi + BT LE; CSI camera; QuadSPI interface; 12x GPI/Os
    • Integrated Graphics Processing Unit, supports 2 independent displays
    • Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface.
    Verfügbar im industriellen Temperaturbereich

      SM-C12

    SM-C12

    μQ7-A76-J

    μQ7-A76-J

    Q7-C25

    Q7-C25

    Q7-C26

    Q7-C26

     
    Entwicklungsstatus des Produkts
    Prozessor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    0
    2
    0
    0
    Maximale Gewindelänge
    0
    2
    0
    0
    Speicher
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    Soldered onboard DDR3L memory
    E3825, E3815:  up to 4GB Single-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    soldered down LPDDR4-3200 memory, 64-bit interface

    Grafik

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Integrated Intel® HD Graphics 4000 Series controller
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Videoschnittstellen
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    Multimode Display Port (DP++) interface
    18 / 24 bit Dual Channel LVDS interface

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Videoauflösung
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    DP++ (HDMI compatible) Up to 2560x1600@60Hz
    LVDS interface Up to 1920x1200@60Hz
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    Massenspeicher
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    2 x external S-ATA channels
    SD interface
    Optional eMMC drive soldered onboard

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Networking
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    1 x Gigabit Ethernet interface

    USB
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB 3.0 Host port
    4 x USB 2.0 Host ports (one shared with USB 3.0 interface)

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e
    2x PCI-e x1 ports
    3 x PCI-e x1 lanes (Gen2)

    1x PCI-e x1 port, optional

    Up to 2x PCI-e x1 Gen3 ports

    Audio
    I2S Audio Interface
    HD Audio Interface

    I2S Audio Interface

    I2S Audio Interface

    Serielle Anschlüsse
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    1 x Serial Port (TTL interface, Tx/Rx only)

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Andere Schnittstellen

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C bus
    LPC Bus
    SM Bus
    Thermal / FAN Management
    PWR Management signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Stromversorgung

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +5VDC ± 5%
    +3.3V_RTC

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem
    Linux
    Android

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Microsoft® Windows Embedded Compact 7
    Linux
    Yocto

    Linux
    Android

    Linux
    Android

    Betriebstemperatur
    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    50 x 82 mm (1.97” x 3.23”)
    40 x 70 mm (1.57 x 2.76)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    Security
    ...
    Keine Angabe
    Keine Angabe
    Keine Angabe
    BIOS
    ...
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Embedded Controller Functionalities
    ...
    Keine Angabe
    Keine Angabe
    Keine Angabe

    Beschreibung

    Details

    The SM-C12 is a SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
    Zusatzinformation

    Zusatzinformation

    Prozessor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Speicher
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    Grafik

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Videoschnittstellen
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    Videoauflösung
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    Massenspeicher
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Networking
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    USB
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    PCI-e
    2x PCI-e x1 ports
    Audio
    I2S Audio Interface
    Serielle Anschlüsse
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    Andere Schnittstellen

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Stromversorgung

    +5VDC
    +3.3V_RTC

    Betriebssystem
    Linux
    Android
    Betriebstemperatur
    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    50 x 82 mm (1.97” x 3.23”)
    Software

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    Dokumente

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    SM-C12

    SM-C12
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    SMARC Rel. 2.0 compliant module with the NXP i.MX 8M Applications Processors
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    • Devices
    • Gebäudetechnik /Home Automation
    • Industrielle Automatisierung
    • Infotainment/Vending
    • Transport- und Verkehrswesen
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