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    SM-B71

    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC

    • Xilinx® Zynq® Ultrascale+™ CG/EG/EV MPSoCs in C784 package
    • PCI-e x4; 2x GbE; 2x CAN Bus; 2x SPI; 12x GPI/Os
    • Integrated ARM Mali-400 MP2 GPU
    • Up to 8GB + 2GB DDR4 soldered down
    Verfügbar im industriellen Temperaturbereich

      SM-B71

    SM-B71

    Q7-928

    Q7-928

    Q7-C26

    Q7-C26

    Q7-C25

    Q7-C25

     
    Entwicklungsstatus des Produkts
    Prozessor

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    0
    0
    Max Thread
    0
    0
    0
    0
    Speicher
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    soldered down LPDDR4-3200 memory, 64-bit interface

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    Grafik
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    Videoschnittstellen
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    Videoauflösung
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    Massenspeicher

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    Networking
    Up to 2 x Gigabit Ethernet interfaces
    Gigabit Ethernet interface

    1 x Gigabit Ethernet interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    PCI-e
    PCI-e x4 interface
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Up to 2x PCI-e x1 Gen3 ports

    1x PCI-e x1 port, optional

    Audio
    Dependent on the IP implemented in the programmable logic
    AC'97 Audio Interface
    I2S

    I2S Audio Interface

    I2S Audio Interface

    Serielle Anschlüsse

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    2 x serial ports (TTL interface)
    CAN port interface

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Andere Schnittstellen

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    Stromversorgung
    +3÷+5.25VDC
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ± 5%
    +3.3V_RTC

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem
    Linux
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux
    Android

    Linux
    Android

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...

    Beschreibung

    Details

    The SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
    Zusatzinformation

    Zusatzinformation

    Prozessor

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Speicher
    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Grafik
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec
    Videoschnittstellen
    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces
    Videoauflösung
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    Videoschnittstellen
    DUAL CHANNEL LVDS, DP
    Massenspeicher

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Networking
    Up to 2 x Gigabit Ethernet interfaces
    USB

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    PCI-e
    PCI-e x4 interface
    Audio
    Dependent on the IP implemented in the programmable logic
    Serielle Anschlüsse

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    Andere Schnittstellen

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    Stromversorgung
    +3÷+5.25VDC
    +3.3V_RTC
    Betriebssystem
    Linux
    Android
    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    50 x 82 mm (1.97” x 3.23”)
    Software

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    Dokumente

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    SM-B71

    SM-B71
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    SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC
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