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    SM-B69

    SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

    • Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
    • 2x GbE; 6 x USB 2.0; 2 x USB 3.0; 4x PCI-e
    • Integrated Gen9-LP HD Graphics controller
    • Dual Channel Soldered Down LPDDR4-2400 memory
    Verfügbar im industriellen Temperaturbereich

      SM-B69

    SM-B69

    Q7-A36

    Q7-A36

    SM-B71

    SM-B71

    SBC-B68-eNUC

    SBC-B68-eNUC

     
    Entwicklungsstatus des Produkts
    Prozessor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Atom™ E3845, Quad Core @1.91GHz, 2MB Cache, 10W TDP
    Intel® Atom™ E3827, Dual Core @1.75GHz, 1MB Cache, 8W TDP
    Intel® Atom™ E3826, Dual Core @1.46GHz, 1MB Cache, 7W TDP
    Intel® Atom™ E3825, Dual Core @1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom™ E3815, Single Core @1.46GHz, 512KB Cache, 5W TDP
    Intel® Atom E3805, Dual Core @ 1.33GHz, 1MB Cache, 3W TDP
    Intel® Celeron® J1900, Quad Core @2.0GHz, 2MB Cache, 10W TDP
    Intel® Celeron® N2930, Quad Core @1.83GHz, 2MB Cache, 7.5W TDP
    Intel® Celeron® N2807, Dual Core @1.58GHz, 1MB Cache, 4.3W TDP

    Xilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
    Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
    Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    4
    4
    0
    4
    Maximale Gewindelänge
    ...
    4
    0
    4
    Speicher
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB

    Soldered on-board DDR3L memory
    E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L @ 1333MHz
    E3826: up to 8GB Dual-Channel DDR3L @ 1066MHz
    N2807: up to 4GB Single-Channel DDR3L @ 1333MHz
    E3825, E3815: up to 4GB Single-Channel DDR3L @ 1066MHz

    Soldered Down DDR4-2400 memory
    Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Grafik

    Up to 3 independent displays
    Integrated Gen9-LP HD Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

    Integrated Intel® HD Graphics 4000 Series controller (not for E3805)
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats
    Only on EG and EV MPSOcs:
    Integrated ARM Mali-400 MP2 Graphics Processing Unit
    Multicore 2D/3D acceleration at 667MHz
    OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
    On EV MPSoCs only, H.264/H.265 integrated video codec

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Videoschnittstellen

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface through eDP-to-LVDS bridge
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    HDMI or Multimode Display Port interface (factory options)
    eDP or 18/24 bit dual channel LVDS interface (factory options)
    Optional Camera Interface

    18- / 24-bit Dual Channel LVDS interface
    DP interface
    2 x CSI interfaces

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Videoauflösung
    DP++ Up to 4096 x 2160
    eDP     Up to 3840 x 2160 (4K)
    HDMI Up to 3840 x 2160 (4K)
    LMIPI-DSI, LVDS Up to 1920 x 1200
    HDMIUp to 1920x1080p @ 60Hz
    Display Port, eDP, CRTUp to 2560x1600 @ 60Hz
    Optional LVDS interfaceUp to 1920x1200 @ 60Hz
    DPUp to 4096 x 2160
    LVDSDependent on the IP implemented in the programmable logic
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    Massenspeicher

    1 x external S-ATA Gen3 Channel
    SD interface
    Optional eMMC 5.0 drive soldered on-board

    2 x external S-ATA channels
    SD Interface
    Optional eMMC Drive soldered on board

    1 x external S-ATA Gen3 Channel
    SD interface
    QSPI Flash soldered-onboard
    Optional eMMC 4.51 drive soldered on-board

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    Gigabit Ethernet interface
    Up to 2 x Gigabit Ethernet interfaces

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    1 x USB 3.0 Host port
    6 x USB 2.0 Host ports (one shared with USB 3.0 interface)

    1x USB 2.0 OTG
    2x USB 2.0 Host
    2x USB 3.0 Host

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    PCI-e
    4 x PCI-e Root Ports
    3 x PCI-e x1 lanes
    PCI-e x4 interface
    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    Audio
    HD Audio interface
    I2S Audio interface
    HD Audio Interface
    Dependent on the IP implemented in the programmable logic
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    Serielle Anschlüsse

    2 x HS-UARTs
    2 x UARTs

    1 x Serial Port (TTL interface)

    2 x UART Tx/Rx/RTS/CTS
    2 x UART Tx/Rx
    2 x CAN Bus

    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    Andere Schnittstellen

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    I2C Bus
    LPC Bus
    SM Bus
    Thermal / FAN management
    SPI interface
    Power management signals

    2 x I2C Bus
    2 x SPI interfaces
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Stromversorgung
    +5VDC and +3.3V_RTC

    +5VDC ± 5%

    +3÷+5.25VDC
    +3.3V_RTC
    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto
    Android

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux (32/64 bit)
    Yocto

    Linux
    Android

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    50 x 82 mm (1.97” x 3.23”)
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    101.6 x 101.6 mm (4” x 4”)
    Security
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Keine Angabe
    BIOS
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Embedded Controller Functionalities
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Keine Angabe

    Beschreibung

    Details

    The SM-B69 is a SMARC Rel. 2.0 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly code name Apollo Lake) Processors. This high performance, low power and feature-rich solution is able to run up to 3 independent displays, with 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC. It features Quad Channel Soldered Down LPDDR4-2400 memory up to 8GB, up to 2 x Gigabit Ethernet interfaces and 2 x MIPI CSI interfaces.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Max Cores
    4
    Speicher
    Dual Channel Soldered Down LPDDR4-2400 memory, up to 8GB
    Grafik

    Up to 3 independent displays
    Integrated Gen9-LP HD Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC

    Videoschnittstellen

    eDP + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface through eDP-to-LVDS bridge
    HDMI or DP++ interface
    DP++ interface
    2 x CSI interfaces

    Videoauflösung
    DP++ Up to 4096 x 2160
    eDP     Up to 3840 x 2160 (4K)
    HDMI Up to 3840 x 2160 (4K)
    LMIPI-DSI, LVDS Up to 1920 x 1200
    Massenspeicher

    1 x external S-ATA Gen3 Channel
    SD interface
    Optional eMMC 5.0 drive soldered on-board

    Networking

    Up to 2 x Gigabit Ethernet interfaces
    Intel® I210 or I211 Controller (MAC + PHY)

    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    PCI-e
    4 x PCI-e Root Ports
    Audio
    HD Audio interface
    I2S Audio interface
    Serielle Anschlüsse

    2 x HS-UARTs
    2 x UARTs

    Andere Schnittstellen

    Up to 12x GPIOs
    I2C Bus
    SM Bus
    2x SPI interfaces
    LPC Bus
    FAN management
    Power Management Signals

    Stromversorgung
    +5VDC and +3.3V_RTC
    Betriebssystem

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Linux
    Yocto
    Android

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    50 x 82 mm (1.97” x 3.23”)
    Dokumente

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    SM-B69

    SM-B69
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      Technische Unterstützung wir nur Firmenkunden gewährt

    Orders placed between August 3dr and August 21st 2019 will be shipped from August 23rd 2019

    SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
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