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    Mehr Ansichten

    SBC-B08

    SBC with NXP i.MX 6SoloX Processor

    • NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    • up to 2x Fast Eth; optional WiFi + BT LE
    • Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    • 32-bit DDR3L memory soldered on-board, up to 1GB
    Verfügbar im industriellen Temperaturbereich

      SBC-B08

    SBC-B08

    μQ7-A75-J

    μQ7-A75-J

    SYS-B08-7/BD

    SYS-B08-7/BD

    SBC-984

    SBC-984

     
    Entwicklungsstatus des Produkts
    Prozessor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    1 + 1
    2
    1 + 1
    4
    Maximale Gewindelänge
    ...
    ...
    ...
    0
    Speicher

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    512MB RAM
    Up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Grafik

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Videoschnittstellen

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface
    Video Input Port / Camera connector (only with PCB rev. C or higher)

    Videoauflösung

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    LVDS, up to 1920x1200
    HDMI, up to 1080p
    Massenspeicher

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    On-board eMMC drive, up to 8 GB
    mSATA Half-size slot (shared with miniPCI-express)
    Networking

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    Fast Ethernet (10/100) interface
    1x FastETH
    Gigabit Ethernet connector
    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    3 x standard USB 2.0 Type A
    1 x USB OTG on micro-AB connector
    Internal USB for optional WiFi module
    PCI-e
    ...

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    ...
    miniPCI-express slot, shared with mSATA (only PCI-e 1.1 and Gen2 are supported)
    Audio
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    I2S / AC’97 Audio Interface
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    AC’97 Audio Codec

    Mic In, Line out internal pin header connector
    Serielle Anschlüsse

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    ...

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    1 x RS-232 serial port
    TTL debug UART (Tx, RX only)
    CAN interface internal connector
    Andere Schnittstellen

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    I2C touch Connector
    Internal connector for power and reset buttons
    Stromversorgung

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +5VDC ± 5%
    Optional Low Power RTC

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    +12VDC ± 10%
    Embedded additional RTC circuitry for lowest power consumption
    Optional RTC Battery with lead cable and connector
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Android
    Linux

    Linux
    Yocto

    Android
    Linux
    Linux
    Betriebstemperatur

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Commercial

    0°C  ÷ +70 °C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    89.5 x 87 mm (3.52” x 3.43”)
    40x70 mm (1.57” x 2.76”)
    189.60 x 121.40 x 28.20 mm
    80 x 67 mm (3,15” x 2,64”)

    Beschreibung

    Details

    SBC-B08 is a new-generation all-in-one low-cost computer designed by SECO, equipped with a NXP i.MX 6SoloX applications processor able to run Android or Linux. SBC-B08 is a revolutionary product in terms of connectivity, interactivity with the real world and cost: a new concept of single board computer ready for Internet of Things applications and for the Post-PC era.
    Zusatzinformation

    Zusatzinformation

    Prozessor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz
    Max Cores
    1 + 1
    Speicher

    Soldered on-board DDR3L memory, 32-bit interface
    SYS-B08-BASIC/D: 512MB
    SYS-B08-FULL/D: 1GB

    Grafik

    Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator
    OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported

    Videoschnittstellen

    Single Channel 18-/24- bit LVDS connector + Touch Screen (I2C signals)
    24-bit Parallel RGB Connector

    Videoauflösung

    LVDS: up to 1366x768 @60Hz, 24bpp
    RGB: up to 1920x1080p @60Hz, 24bpp

    Massenspeicher

    16MB NOR Quad-SPI Flash soldered onboard µSD Card slot
    SYS-B08-FULL/D: 8GB eMMC soldered onboard

    Networking

    SYS-B08-BASIC/D:1x Fast Ethernet RJ-45 connector
    SYS-B08-FULL/D: 2x Fast Ethernet RJ-45 connector + WiFi (802.11 b/g/n) +BT LE combo module + antenna onboard

    USB
    1 x USB 2.0 OTG port
    3 x USB 2.0 Host ports on standard Type-A socket
    1 x USB 2.0 Host port on internal pin header
    Audio
    I2S Audio interface on programmable pin header
    S / PDIF interface (In and Out) on programmable pin header
    Serielle Anschlüsse

    1 x CAN Port reconfigurable as GPIO
    2x RS-232 (Tx/RX signals only) + 1x RS-485 serial ports on expansion pin header

    Andere Schnittstellen

    2 x I2C dedicated connectors (one reserved for Touch Screen)
    6 analog inputs for A/D Conversion
    Programmable (*) expansion pin header connector, able to offer:
    • CSI interface input (PAL and NTSC formats supported)
    • Up to 20 GPIO
    • SPI interface
    • SPDIF Audio interface
    • I2S Audio interface
    • CAN interface (TTL level)
    • 5 x PWM
    • 3 x I2C
    • 3 x serial ports (2x RS-232 +1xRS-485 interface)
    Embedded Low Power RTC
    (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.MX6SX processor.

    Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope)

    Stromversorgung

    +12VDC nominal voltage
    +3VDC cabled Coin Cell Battery

    Betriebssystem

    Android
    Linux

    Betriebstemperatur

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    89.5 x 87 mm (3.52” x 3.43”)
    Software

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    Dokumente

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    SBC-B08

    SBC-B08
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    SBC with NXP i.MX 6SoloX Processor
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    SYS-B08-I-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/Heatsink Auf die Vergleichsliste
    SYS-B08-BASIC/D SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink SBC - SBC-B08 Basic version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 512MB RAM - 1x FastETH - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/Heatsink Auf die Vergleichsliste
    SYS-B08-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Comm. Temp. w/ Heatsink Auf die Vergleichsliste
    SYS-B08-I-FULL/D SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink SBC - SBC-B08 Full version: NXP i.MX6SX SoloX, Single core Cortex®-A9 @ 1GHz + Cortex®-M4 core @ 227MHz - 1GB RAM - 8GB eMMC - 2x FastETH - Wi-Fi/BLE - RTC LP - RS-485 - RS-232 - CAN - Ind. Temp. w/ Heatsink Auf die Vergleichsliste

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