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    Mehr Ansichten

    RB71-DISS-2-PK

    SMARC HEAT SINK: SM-B71 Heat Sink (PASSIVE) - Packaged

    Beschreibung

    Details

    Highly integrated modules like SM-B71 offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed temperature range.

    The operating temperature specified in the Technical Features of SM-B71 indicates the temperature range in which any and all parts of the heat spreader / heat sink must remain, in order for SECO to guarantee functionality. Hence, these numbers do not necessarily indicate the suitable environmental temperature.

    The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc).

    It is the customer’s responsibility to design and apply an application-dependent cooling system, capable of ensuring that the heat spreader / heat sink temperature remain within the indicated range of the module.

    It is an absolute requirement that the customer, after thorough evaluation of the processor’s workload in the actual system application, the system enclosure and consequent air flow/Thermal analysis, accurately study and develop a suitable cooling solution for the assembled system.

    RB71-DISS-2-PK

    RB71-DISS-2-PK
    • BEWERTEN SIE UNSERE PRODUKTE

      Max. 3 Stück pro Artikelnummer
    • MUSTERPREISE

      Einschließlich Versandkosten
    • AUSSCHLIEßLICH FIRMENKUNDENGESCHÄFT

      Technische Unterstützung wir nur Firmenkunden gewährt
    SM-B71 Heat Sink (PASSIVE)
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    RB71-DISS-2-PK

    Highly integrated modules like SM-B71 offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed temperature range.

    The operating temperature specified in the Technical Features of SM-B71 indicates the temperature range in which any and all parts of the heat spreader / heat sink must remain, in order for SECO to guarantee functionality. Hence, these numbers do not necessarily indicate the suitable environmental temperature.

    The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc).

    It is the customer’s responsibility to design and apply an application-dependent cooling system, capable of ensuring that the heat spreader / heat sink temperature remain within the indicated range of the module.

    It is an absolute requirement that the customer, after thorough evaluation of the processor’s workload in the actual system application, the system enclosure and consequent air flow/Thermal analysis, accurately study and develop a suitable cooling solution for the assembled system.

    SM-B71 Heat Sink (PASSIVE)
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