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    Q7-C26

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8 Applications Processors

    • NXP i.MX 8 Applications Processors

    • 1x USB 3.0; PCI-e x1 Gen3; CSI camera connector; Boot select signal
    • Integrated GPU, supports 2 independent displays

    • soldered down LPDDR4-3200 memory

    Verfügbar im industriellen Temperaturbereich

      Q7-C26

    Q7-C26

    SBC-A62-J

    SBC-A62-J

    Q7-928

    Q7-928

    μQ7-A75-J

    μQ7-A75-J

     
    Entwicklungsstatus des Produkts
    Prozessor

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    NXP i.MX 6 Family, based on ARM Cortex-A9 processors:
    SBC-A62-J-SOLO: Single Core (i.MX6S) @1GHz
    SBC-A62-J-LITE: Dual Core Lite (i.MX6DL) @1GHz
    SBC-A62-J-PLUS: Dual Core Plus (i.MX6DP) @1GHz
    SBC-A62-J-QUAD: Quad Core (i.MX6Q) @1GHz

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    0
    4
    4
    2
    Maximale Gewindelänge
    0
    0
    0
    ...
    Speicher

    soldered down LPDDR4-3200 memory, 64-bit interface

    Soldered on-board DDR3L memory***:
    SBC-A62-J-SOLO: 512MB 32-bit interface
    SBC-A62-J-LITE: 1GB 64-bit interface
    SBC-A62-J-PLUS: 2GB 64-bit interface
    SBC-A62-J-QUAD: 1GB 64-bit interface

    *** For additional configurability please contact SECO

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Grafik

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D
    OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62-J-QUAD)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays
    SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3independent displays

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Videoschnittstellen

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface
    HDMI interface 1.4

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Videoauflösung
    HDMI:Up to 4Kp60
    LVDSUp to 1080p

    HDMI: up to 1920 x 1080p
    LVDS: up to 1920 x 1200

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Massenspeicher

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    4GB eMMC drive soldered onboard***
    microSD Card slot
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector

    *** For additional configurability please contact SECO

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking

    1 x Gigabit Ethernet interface

    Gigabit Ethernet connector
    Internal USB connector for Wi-Fi Module

    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface
    USB

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e

    Up to 2x PCI-e x1 Gen3 ports

    ...
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio

    I2S Audio Interface

    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
    AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks

    AC'97 Audio Interface
    I2S
    I2S / AC’97 Audio Interface
    Serielle Anschlüsse

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Debug UART interface, TTL voltage level.
    SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V)
    Other serial interfaces on the expansion connector:
    SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) -2 x CAN (TTL level);
    SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level);
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level)

    2 x serial ports (TTL interface)
    CAN port interface

    ...
    Andere Schnittstellen

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector;
    Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF Audio interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs

    * Please note that some of these interfaces are factory options, other configurations are made via SW.

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Stromversorgung

    +5VDC ± 5%
    +3.3V_RTC

    +12VDC; Additional embedded Low Power RTC;
    SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real Time Clock (external battery required for time/date retention, not included)
    SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real TimeClock with onboard battery

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Linux
    Android

    - Free Android and Linux community BSP available at UDOO.org
    - SECO Android (under development) and Linux BSP / WEC7 on request. Please contact us
    - Yocto Guideline valid for SECO BSP

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux
    Yocto

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)**
    For industrial temp. (-40°C ÷ +85°C)** please contact us

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    110 x 86.5 mm (4.5” x 3.7”)
    70x70 mm (2.76” x 2.76”)
    40x70 mm (1.57” x 2.76”)

    Beschreibung

    Details

    The Q7-C26 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8 Applications Processors. This solution features rich m2m interface to control onboard subsystems and wide connectivity, taking advantage of the wide scalability offered by Qseven® form factor and the i.MX 8 family.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    Speicher

    soldered down LPDDR4-3200 memory, 64-bit interface

    Grafik

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Videoschnittstellen

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    Videoauflösung
    HDMI:Up to 4Kp60
    LVDSUp to 1080p
    Massenspeicher

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    Networking

    1 x Gigabit Ethernet interface

    USB

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    PCI-e

    Up to 2x PCI-e x1 Gen3 ports

    Audio

    I2S Audio Interface

    Serielle Anschlüsse

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Andere Schnittstellen

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    Stromversorgung

    +5VDC ± 5%
    +3.3V_RTC

    Betriebssystem

    Linux
    Android

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software

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    Dokumente

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    Q7-C26

    Q7-C26
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    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8 Applications Processors
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