soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

Integrated Graphics Processing Unit, supports 2 independent displays
Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
Enhanced 2D and 3D graphics with i.MX6DP
Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S

HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
eDP interface or 18- / 24-bit Dual Channel LVDS interface

1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface 1.4
Video Input Port / Camera Connector

LVDS, up to 1920x1200
HDMI, up to 1080p

eMMC 5.0 drive soldered on-board, up to 64GB
Optional microSD slot on board
QSPI Flash soldered-onboard

On-board eMMC drive, up to 32 GB
SD / MMC / SDIO interface
1 x μSD Card Slot on-board
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboard

1 x USB 3.0 OTG Ports
Up to 4 x USB 2.0 Host Ports

1 x USB OTG interface
4 x USB 2.0 Host interfaces

1x PCI-e x1 port, optional

I2S Audio Interface

1x UART Tx/Rx/RTS/CTS (Optional)
1x Debug UART
Optional CAN Bus interface (TTL Level)

2 x serial ports (TTL interface)
CAN port interface

I2C Bus
SM Bus
Optional SPI interface
8 x GPI/Os
UltraLow Power RTC
Power Management Signals
Watchdog

1x 4-lanes + 1x 2-lanes CSI camera interfaces
I2C Bus
SM Bus
2x SPI interfaces
QuadSPI interface
12 x GPI/Os
Boot select signals
Power Management Signals

I2C Bus
LPC Bus
SM Bus
Power Management Signals

+5V_DC ±5% and +5V_SB (optional)
+3.3V_RTC

+5V_DC
+3.3V_RTC

+5V_DC ± 5%

Linux
Yocto
Android

Linux
Yocto
Android

Linux
Yocto
Microsoft® Windows Embedded Compact 7

0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C ÷ +60°C (commercial version)
-40°C ÷ +85°C (industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.