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    Q7-C25

    Qseven® Rel. 2.1 compliant module with NXP i.MX 8M Applications Processors

    • NXP i.MX 8M Applications Processors

    • 2x USB 3.0; CSI camera connector; 1x CAN Bus; 2xI2C Bus; 8x GPI/Os
    • Integrated GPU, supports 2 independent displays

    • up to 8GB soldered down DDR4-2400 memory

    Verfügbar im industriellen Temperaturbereich

      Q7-C25

    Q7-C25

    μQ7-A75-J

    μQ7-A75-J

    SM-C12

    SM-C12

    μQ7-962

    μQ7-962

     
    Entwicklungsstatus des Produkts
    Prozessor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    0
    2
    0
    4
    Maximale Gewindelänge
    0
    ...
    0
    0
    Speicher

    soldered down DDR4-2400 memory, 32-bit interface, up to 8GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
    Grafik
    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S
    Videoschnittstellen

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Videoauflösung
    HDMI:Up to 4096 x 2160p60
    LVDS:Up to 1920 x 1080 @ 60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    Massenspeicher

    eMMC 5.0 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-onboard

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
    Networking

    1 x Gigabit Ethernet interface

    Fast Ethernet (10/100) interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet interface
    USB

    2 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    1 x USB 2.0 OTG port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces
    PCI-e

    2x PCI-e x1 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    2x PCI-e x1 ports
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    Audio

    I2S Audio Interface

    I2S / AC’97 Audio Interface
    I2S Audio Interface
    I2S / AC’97 Audio Interface
    Serielle Anschlüsse

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    ...
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    2 x Serial ports (TTL interface)
    CAN port interface
    Andere Schnittstellen

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Power Management Signals
    Watchdog

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C Bus
    SM Bus
    Power Management Signals
    Stromversorgung

    +5VDC ±5%
    +3.3V_RTC

    +5VDC ± 5%
    Optional Low Power RTC

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Linux
    Android

    Linux
    Yocto

    Linux
    Android
    Linux
    Yocto
    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    40x70 mm (1.57” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    40x70 mm (μQseven, 1.57” x 2.76”)

    Beschreibung

    Details

    The Q7-C25 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. Q7-C25 is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Speicher

    soldered down DDR4-2400 memory, 32-bit interface, up to 8GB

    Grafik
    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
    Videoschnittstellen

    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface

    Videoauflösung
    HDMI:Up to 4096 x 2160p60
    LVDS:Up to 1920 x 1080 @ 60Hz
    Massenspeicher

    eMMC 5.0 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-onboard

    Networking

    1 x Gigabit Ethernet interface

    USB

    2 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports
    1 x USB 2.0 OTG port

    PCI-e

    2x PCI-e x1 ports

    Audio

    I2S Audio Interface

    Serielle Anschlüsse

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    Andere Schnittstellen

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Power Management Signals
    Watchdog

    Stromversorgung

    +5VDC ±5%
    +3.3V_RTC

    Betriebssystem

    Linux
    Android

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software

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    Dokumente

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    Q7-C25

    Q7-C25
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    Qseven® Rel. 2.1 compliant module with the NXP i.MX 8M Applications Processors
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    • Devices
    • Gebäudetechnik /Home Automation
    • Industrielle Automatisierung
    • Infotainment/Vending
    • Transport- und Verkehrswesen
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