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Q7-C25
Qseven® Rel. 2.1 compliant module with NXP i.MX 8M Applications Processors
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NXP i.MX 8M Applications Processors
- 1x USB 3.0; 4x USB2.0; 1x PCI-e x1; 1x CAN Bus; 2x UART; 8x GPI/Os
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Integrated GPU, supports 2 independent displays
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up to 4GB soldered down DDR4-2400 memory
![]() Q7-C25 |
![]() SM-C12 |
![]() Q7-928 |
![]() μQ7-962 |
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Entwicklungsstatus des Produkts |
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Prozessor |
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor: |
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor: |
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz - i.MX6DL Dual Lite - Dual core up to 1GHz per core - i.MX6D Dual - Dual core up to 1GHz per core - i.MX6DP DualPlus - Dual core up to 1GHz per core - i.MX6Q Quad - Quad core up to 1GHz per core |
NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
- i.MX6S Solo - Single core up to 1GHz - i.MX6DL Dual Lite - Dual core up to 1GHz per core - i.MX6D Dual - Dual core up to 1GHz per core - i.MX6Q Quad - Quad core up to 1GHz per core |
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Chipsatz |
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Max Cores |
0
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0
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4
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4
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Max Thread |
0
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0
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0
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0
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Speicher |
soldered down DDR4-2400 memory, 32-bit interface, up to 4GB |
Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
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Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
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up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
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Grafik |
Integrated Graphics Processing Unit, supports 2 independent displays. |
Integrated Graphics Processing Unit, supports 2 independent displays |
Dedicated 2D Hardware accelerator |
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q) Supports up to 3 independent displays with i.MX6D and i.MX6Q Supports 2 independent displays with i.MX6DL and i.MX6S |
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Videoschnittstellen |
HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3 |
HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface (factory alternatives) |
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface |
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface 1.4 |
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Videoauflösung |
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LVDS, up to 1920x1200 |
HDMI, up to 1080p
LVDS, up to 1920x1200 |
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Massenspeicher |
eMMC 5.0 drive soldered on-board, up to 64GB |
Optional SD 4-bit interface
QSPI Flash soldered-onboard eMMC 5.0 drive soldered on-board |
On-board eMMC drive, up to 32 GB |
Up to 8 GB eMMC drive soldered onboard
SD / MMC / SDIO interface 1 x External SATA Channel (only available with i.MX6D and i.MX6Q) |
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Networking |
1 x Gigabit Ethernet interface |
1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboard |
Gigabit Ethernet interface
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Gigabit Ethernet interface
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USB |
1 x USB 3.0 OTG Ports |
2 USB 3.0 Host ports
2 USB 2.0 Host ports 1 USB 2.0 OTG port |
1 x USB OTG interface |
1 x USB OTG interface
4 x USB 2.0 Host interfaces |
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PCI-e |
1x PCI-e x1 port, optional |
2x PCI-e x1 ports
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1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
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1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
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Audio |
I2S Audio Interface |
I2S Audio Interface
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AC'97 Audio Interface
I2S |
I2S / AC’97 Audio Interface
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Serielle Anschlüsse |
1x UART Tx/Rx/RTS/CTS (Optional) |
Up to 2x UART Tx/Rx/RTS/CTS
2x UART Tx/Rx 1x CAN Bus (TTL level) |
2 x serial ports (TTL interface) |
2 x Serial ports (TTL interface)
CAN port interface |
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Andere Schnittstellen |
I2C Bus |
1x 4-lanes + 1x 2-lanes CSI camera interfaces |
I2C Bus |
I2C Bus
SM Bus Power Management Signals |
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Stromversorgung |
+5VDC ±5% and +5VSB (optional) |
+5VDC |
+5VDC ± 5% |
+5VDC ± 5%
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Energieverbrauch |
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Betriebssystem |
Linux |
Linux |
Linux |
Linux
Yocto |
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Betriebstemperatur |
0°C ÷ +60°C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
0°C ÷ +70°C (commercial version) |
0°C ÷ +60°C (commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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Dimensionen |
70x70 mm (2.76” x 2.76”)
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50 x 82 mm (1.97” x 3.23”)
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70x70 mm (2.76” x 2.76”)
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40x70 mm (μQseven, 1.57” x 2.76”)
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Security |
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BIOS |
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Embedded Controller Functionalities |
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- Beschreibung
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Details
The Q7-C25 is a Qseven® Rel. 2.1 compliant module based on the NXP i.MX 8M Applications Processors with multicore processing: Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor for realtime applications and 4Kp60 HEVC decoding with HDR. Q7-C25 is a scalable solution for applications like domotics or vending, requiring advanced security, connectivity and multimedia.
- Zusatzinformation
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Zusatzinformation
Prozessor NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
• i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
• i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
• i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPUSpeicher soldered down DDR4-2400 memory, 32-bit interface, up to 4GB
Grafik Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11Videoschnittstellen HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
eDP interface or 18- / 24-bit Dual Channel LVDS interfaceVideoauflösung HDMI/DP: Up to 4096 x 2160p60 LVDS/eDP: Up to 1920 x 1080 @ 60Hz Videoschnittstellen DUAL CHANNEL LVDS, HDMI, eDP, DP Massenspeicher eMMC 5.0 drive soldered on-board, up to 64GB
Optional microSD slot on board
QSPI Flash soldered-onboardNetworking 1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboardUSB 1 x USB 3.0 OTG Ports
Up to 4 x USB 2.0 Host PortsPCI-e 1x PCI-e x1 port, optional
Audio I2S Audio Interface
Serielle Anschlüsse 1x UART Tx/Rx/RTS/CTS (Optional)
1x Debug UART
Optional CAN Bus interface (TTL Level)Andere Schnittstellen I2C Bus
SM Bus
Optional SPI interface
8 x GPI/Os
UltraLow Power RTC
Power Management Signals
WatchdogStromversorgung +5VDC ±5% and +5VSB (optional)
+3.3V_RTCBetriebssystem Linux
Yocto
AndroidBetriebstemperatur 0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version, without WiF+BT optional module)*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensionen 70x70 mm (2.76” x 2.76”)
Q7-C25
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Sku Artikelnummer | Beschreibung Artikelnummer | Konfiguration Artikelnummer | Kaufen Sie Muster online | Kontaktieren Sie uns | Vergleich |
QC25-0000-2200-C0 | Qseven with NXP i.MX 8M | Q7-C25 Qseven - NXP i.MX 8M, LVDS | Auf die Vergleichsliste |
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