soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

Soldered on-board DDR3L memory***:
SBC-A62-J-SOLO: 512MB 32-bit interface
SBC-A62-J-LITE: 1GB 64-bit interface
SBC-A62-J-PLUS: 2GB 64-bit interface
SBC-A62-J-QUAD: 1GB 64-bit interface

*** For additional configurability please contact SECO

Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL® ES2.0 3D
OpenVG™ accelerator (only SBC-A62-J-PLUS and SBC-A62-J-QUAD)
HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays
SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3independent displays

Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
Enhanced 2D and 3D graphics with i.MX6DP
Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S

Integrated Graphics Processing Unit, supports 2 independent displays
Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
eDP interface or 18- / 24-bit Dual Channel LVDS interface

1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface
HDMI interface 1.4

1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface 1.4
Video Input Port / Camera Connector

HDMI: up to 1920 x 1080p
LVDS: up to 1920 x 1200

LVDS, up to 1920x1200
HDMI, up to 1080p

eMMC 5.0 drive soldered on-board, up to 64GB
Optional microSD slot on board
QSPI Flash soldered-onboard

4GB eMMC drive soldered onboard***
microSD Card slot
SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector

*** For additional configurability please contact SECO

On-board eMMC drive, up to 32 GB
SD / MMC / SDIO interface
1 x μSD Card Slot on-board
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboard

Gigabit Ethernet connector
Internal USB connector for Wi-Fi Module

1 x USB 3.0 OTG Ports
Up to 4 x USB 2.0 Host Ports

1 x USB OTG interface
4 x USB 2.0 Host interfaces

1x PCI-e x1 port, optional

I2S Audio Interface

SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD:
AC’97 Audio Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks

1x UART Tx/Rx/RTS/CTS (Optional)
1x Debug UART
Optional CAN Bus interface (TTL Level)

Debug UART interface, TTL voltage level.
SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V)
Other serial interfaces on the expansion connector:
SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) -2 x CAN (TTL level);
SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level);
SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level)

2 x serial ports (TTL interface)
CAN port interface

I2C Bus
SM Bus
Optional SPI interface
8 x GPI/Os
UltraLow Power RTC
Power Management Signals
Watchdog

Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector;
Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF Audio interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs

_{* Please note that some of these interfaces are factory options, other configurations are made via SW.}

I2C Bus
LPC Bus
SM Bus
Power Management Signals

1x 4-lanes + 1x 2-lanes CSI camera interfaces
I2C Bus
SM Bus
2x SPI interfaces
QuadSPI interface
12 x GPI/Os
Boot select signals
Power Management Signals

+5V_DC ±5% and +5V_SB (optional)
+3.3V_RTC

+12V_DC; Additional embedded Low Power RTC;
SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.MX6 Real Time Clock (external battery required for time/date retention, not included)
SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real TimeClock with onboard battery

+5V_DC ± 5%

+5V_DC
+3.3V_RTC

Linux
Android

- Free Android and Linux community BSP available at UDOO.org
- SECO Android (under development) and Linux BSP / WEC7 on request. Please contact us
- Yocto Guideline valid for SECO BSP

Linux
Yocto
Microsoft® Windows Embedded Compact 7

0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C  ÷ +60 °C (commercial temp.)**
For industrial temp. (-40°C ÷ +85°C)** please contact us

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.