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    Q7-B03

    Qseven® Rel. 2.1 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors

    • Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series
    • 2x USB 3.0; 4x PCI-e; 6x USB 2.0
    • Integrated Gen9-LP Graphics controller
    • up to 8GB Dual-Channel DDR3L-1866
    Verfügbar im industriellen Temperaturbereich

      Q7-B03

    Q7-B03

    SBC-A44-pITX

    SBC-A44-pITX

    Q7-928

    Q7-928

    SBC-B68-eNUC

    SBC-B68-eNUC

     
    Entwicklungsstatus des Produkts
    Prozessor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Atom E3845, Quad Core @ 1.91GHz, 2MB Cache, 10W TDP
    Intel® Atom E3827, Dual Core @ 1.75GHz, 1MB Cache, 8W TDP
    Intel® Atom E3826, Dual Core @ 1.46GHz, 1MB Cache, 7W TDP
    Intel® Atom E3825, Dual Core @ 1.33GHz, 1MB Cache, 6W TDP
    Intel® Atom E3815, Single Core @ 1.46GHz, 512KB Cache, 5W TDP
    Intel® Atom E3805, Dual Core @ 1.33GHz, 1MB Cache, 3W TDP

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    4
    4
    4
    4
    Maximale Gewindelänge
    4
    4
    0
    4
    Speicher
    Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB

    Up to 8GB on DDR3L-1333 ECC SO-DIMM Slot
    (DDR3L-1333 with E3845 and E3827, DDR3L-1067 the others)

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Grafik
    Integrated Gen9-LP Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
    SVC, MVC

    Integrated Intel® HD Graphics controller (not for E3805)
    Dual independent display support
    HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats
    HW encoding of H.264, MPEG2 and MVC formats

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Videoschnittstellen
    eDP interface or Single/Dual Channel 18/24bit LVDS interface
    through eDP-to-LVDS bridge
    HDMI or DP++ interface

    HDMI connector
    Single / Dual Channel 18- / 24- bit LVDS connector

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Videoauflösung
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS, VGA Up to 1920 x 1200 @ 60Hz
    HDMIUp to 1920x1080p @ 60Hz
    LVDS interfaceUp to 1920x1200 @ 60Hz

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz
    Massenspeicher

    Optional eMMC drive soldered onboard
    2 x external S-ATA Gen3 Channel
    SD interface

    Optional eMMC drive on-board
    1 x standard S-ATA connector
    mini mSATA interface on miniCard slot (shared with miniPCI-e)
    microSD Card slot

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Networking
    Gigabit Ethernet interface
    Intel® I210 or I211 Controller (MAC + PHY)
    Dual Gigabit Ethernet connector
    Gigabit Ethernet interface

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports (*)

    (*) Second USB 3.0 Host port can be exploited only using
    Qseven® Rel. 2.1 compliant Carrier boards
    2 x USB 3.0 Host ports on Dual Type-A socket
    2 x USB 2.0 Host port on internal pin header
    1 x USB 2.0 host port on miniPCI-e slot

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    PCI-e
    4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
    Ethernet controller)
    Half miniPCI-e slot (shared with mSATA)
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    Audio
    HD Audio interface

    Optional HD Audio Codec Cirrus Logic CS4207
    Mic In, LineOut internal pin header connector

    AC'97 Audio Interface
    I2S
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    Serielle Anschlüsse
    1 x UART, TTL interface
    2 x optional RS-232 / RS-422 / RS-485 Serial port on internal pin Header

    2 x serial ports (TTL interface)
    CAN port interface

    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    Andere Schnittstellen
    I2C Bus
    LPC Bus
    SM Bus
    SPI interface
    Watch Dog Timer
    Thermal / FAN management
    Power Management Signals
    8 x GPI/O
    FAN connector
    Switch / LED Front Header connector
    I2C connector with INT and RST# signals

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    Stromversorgung
    +5VDC and +5VSB (optional)

    +12VDC Power Jack or Mini-fit connector
    RTC Battery with lead cable and connector

    +5VDC ± 5%

    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 10 Enterprise (64bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Microsoft® Windows 7 (32/64 bit)
    Microsoft® Windows 8.1 (32/64 bit)
    Microsoft® Windows 10 (32/64 bit)
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7 (32/64 bit)
    Microsoft® Windows Embedded Standard 8 (32/64 bit)
    Microsoft® Windows Embedded Compact 7
    Linux (32/64 bit)
    Yocto

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial temperature range)
    -40°C ÷ +85°C (industrial temperature range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    100 x 72 mm (3,93” x 2,83”)
    70x70 mm (2.76” x 2.76”)
    101.6 x 101.6 mm (4” x 4”)
    Security
    ...
    Keine Angabe
    Keine Angabe
    ...
    BIOS
    ...
    Keine Angabe
    Keine Angabe
    ...
    Embedded Controller Functionalities
    ...
    Keine Angabe
    Keine Angabe
    ...

    Beschreibung

    Details

    The Q7-B03 is a Qseven® Rel. 2.1 compliant module based on the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly code name Apollo Lake) Processors. This solution is able to merge its high graphics performance (4K HW Video both decoding and encoding) and extreme temperature with excellent power efficiency. Also featuring wide connectivity capability and support for the most popular operating systems, the Q7-B03 is particularly suitable for low power embedded applications.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Max Cores
    4
    Maximale Gewindelänge
    4
    Speicher
    Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB
    Grafik
    Integrated Gen9-LP Graphics controller, with 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8,
    SVC, MVC
    Videoschnittstellen
    eDP interface or Single/Dual Channel 18/24bit LVDS interface
    through eDP-to-LVDS bridge
    HDMI or DP++ interface
    Videoauflösung
    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS, VGA Up to 1920 x 1200 @ 60Hz
    Massenspeicher

    Optional eMMC drive soldered onboard
    2 x external S-ATA Gen3 Channel
    SD interface

    Networking
    Gigabit Ethernet interface
    Intel® I210 or I211 Controller (MAC + PHY)
    USB
    6 x USB 2.0 Host Ports
    2 x USB 3.0 Host Ports (*)

    (*) Second USB 3.0 Host port can be exploited only using
    Qseven® Rel. 2.1 compliant Carrier boards
    PCI-e
    4 x PCI-e Root Ports (including the PCI-e port used for Gigabit
    Ethernet controller)
    Audio
    HD Audio interface
    Serielle Anschlüsse
    1 x UART, TTL interface
    Andere Schnittstellen
    I2C Bus
    LPC Bus
    SM Bus
    SPI interface
    Watch Dog Timer
    Thermal / FAN management
    Power Management Signals
    Stromversorgung
    +5VDC and +5VSB (optional)
    Betriebssystem

    Microsoft® Windows 10 Enterprise (64bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Betriebstemperatur

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software
    EAPI
    • [Embedded application programming interface] - Release version 1.20.15*
    BIOS
    • [Bios] - Release version 1.08*
    Linux
    • [I/O tools - Linux] - Using I2C and SPI bus in Linux *
    Windows 10
    • [Driver package] – Release version for Windows 10 iot 2016 (RS1)*
    • [Driver package] – Release version for Windows 10 iot 2019 (RS5)*
    Linux-YOCTO
    • [BSP] - Yocto Pyro*
    • [Images] - Sample images (sato and minimal) (pyro 64bit)*

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    Dokumente

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    Q7-B03

    Q7-B03
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    Qseven® Rel. 2.1 compliant module with the Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
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