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    Q7-A29

    Qseven® standard module with the 1st and 2nd Generation (“eKabini” and “Steppe Eagle”) AMD Embedded G-Series SOCs

    • AMD Embedded G-Series System-on-Chip (SoC)
    • 1x USB 3.0; 6x USB 2.0; 1 x Optional UART (TTL level) + SPI interface
    • Embedded AMD HD RADEON GPUs
    • up to 8GB DDR3 1600MHz Single-Channel with ECC soldered onboard

    Beschreibung

    Details

    The Q7-A29 is a Qseven® Rel. 2.0 Compliant Module designed by SECO, based on the 1st and 2nd generation (i.e. ""eKabini"" and ""Steppe Eagle"")  AMD EMbedded G-Series, a family of Dual/Quad Core x86 CPUs with integrated discrete-class GPUs and I/O controllers on a Single chip.
    The wide selection of Quad and Dual Core SOCs, with their different embedded GPUs, allows achieving very high levels of performance, targeting all kind of applications, from graphics to industrial automation. The board is also available in an EXTREME Version, with all the components mounted onboard certified for the industrial temperature range.
    Zusatzinformation

    Zusatzinformation

    Prozessor










    AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W
    AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W
    AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W
    AMD GX-210JA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W
    AMD GX-411GA, Quad Core @1.1GHz, 2MB L2 Cache, TDP 15W,industrial grade temperature
    AMD GX-209HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W,industrial grade temperature



    AMD GX-412HC, Quad Core @ 1.2GHz, 2MB L2 Cache, TDP 7W
    AMD GX-222GC, Dual Core @ 2.2GHz, 1MB L2 Cache, TDP 15W
    AMD GX-216HC, Dual Core @ 1.6GHz, 1MB L2 Cache, TDP 10W,industrial grade temperature
    AMD GX-212JC, Dual Core @ 1.2GHz, 1MB L2 Cache, TDP 6W
    AMD GX-210JC, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W,industrial grade temperature


    Max Cores
    4
    Speicher
    Up to 8GB DDR single-channel memory soldered on-board,with optional ECC
    Up to 1600MHz DDR frequency
    Grafik
    Embedded AMD HD RADEON™ GPUs
    GX-415GA - HD8330e @ 500MHz
    GX-217GA - HD8280E @ 450MHz
    GX-210HA, GX-411GA - HD8210E @ 300MHz
    GX-210JA, GX-209HA - HD8180 @ 225MHz
    GX-412HC - RADEON™ R3E @ 267/350 MHz
    GX-222GC - RADEON™ R5E @ 655/800 MHz
    GX-216HC - RADEON™ R4E @ 300 MHz
    GX-212JC - RADEON™ R2E @ 267/300 MHz
    GX-210JC - RADEON™ R1E @ 267 MHz
    Dual independent display support
    Supports DirectX® 11.1, OpenGL rel. 4.2 and OpenCL™ rel. 1.2
    Videoschnittstellen
    HDMI or Multimode DisplayPort (DP++) interface
    embedded DisplayPort or 18 / 24 bit single / dual channelLVDS interface
    Additional VGA interface (optional external adapter is required)
    Videoauflösung
    HDMIUp to 4096x2160 @ 24Hz (Steppe Eagle SOCs)
    Up to 1920x1200 @ 60Hz (eKabini SOCs)
    DP++Up to 4096x2160 @ 30Hz (Steppe Eagle SOCs)
    Up to 2560x1600 @ 60Hz (eKabini SOCs)
    eDP:Up to 2048x1536 @ 60Hz
    Optional LVDS:Up to 1920x1200 @ 60Hz
    Massenspeicher
    Up to 2 x external SATA channels
    SD interface
    Optional SATA Flash Drive soldered on-board
    Networking
    Gigabit Ethernet interface
    USB
    1 x USB 3.0 Host port
    6 x USB 2.0 Host ports (one shared with USB 3.0)
    PCI-e
    4 x PCI-e x1 groupable lanes
    (3 x PCI-e x1 lanes with GX-210JA and GX-212JC)
    Audio
    HD Audio Interface
    Serielle Anschlüsse
    1 x Optional UART (TTL level) + SPI interface
    Andere Schnittstellen
    I2C / LPC / SM Bus
    Thermal / FAN management
    Optional SPI + UART interface
    Power Management Signals
    Watchdog
    Stromversorgung
    +5VDC ± 5%
    Betriebssystem
    Microsoft® Windows 7 (32/64 bit)

    Microsoft® Windows 8.1 (32/64 bit)

    Microsoft® Windows 10 (32/64 bit)

    Microsoft® Windows 10 IoT

    Microsoft® Windows Embedded Standard 7 (32/64 bit)

    Microsoft® Windows Embedded Standard 8 (32/64 bit)

    Linux (32/64 bit)
    Betriebstemperatur
    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software
    BIOS
    • [BIOS] - Release version 1.06*

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    Dokumente

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    Q7-A29

    Q7-A29
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    • AUSSCHLIEßLICH FIRMENKUNDENGESCHÄFT

      Technische Unterstützung wir nur Firmenkunden gewährt

    Orders placed between August 3dr and August 21st 2019 will be shipped from August 23rd 2019

    Qseven® standard module with the 1st and 2nd Generation (“eKabini” and “Steppe Eagle”) AMD Embedded G-Series SOCs
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    Out of production Il prodotto è in stato Discontinued
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