Benvenuti nel sito SECO S.p.A.

×

Registrierung

Account-Informationen

  • Login-Daten

    oder login

    Vorname obbligatorisch!
    Nachname obbligatorisch!
    Steuernummer obbligatorisch
    Firmenname obbligatorisch!
    Mehrwertsteuernummer obbligatorisch!
    Land obbligatorisch!
    Vorname nicht gültig!
    Nachname nicht gültig!
    Das ist keine E-Mailadresse!
    E-Mailadresse obbligatorisch!
    Diese E-Mailadresse existiert schon!
    Password obbligatorisch!
    Geben Sie ein gültiges Password ein!
    Geben Sie 6 oder mehr Schriftzeichen ein!
    Geben Sie mindestens 16 Schriftzeichen ein!
    Password stimmen nicht überein!
    Allgemeinen Geschäftsbedingungen sind obligatorisch!
    E-Mail oder Password sind nicht korrekt!
    Account confirmation is required. Please, check your email for the confirmation link. To resend the confirmation email pleasehier klicken

    Q7-922

    Computer on Module with NVIDIA® Tegra® T30 Processor

    • ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

    • 6x USB 2.0
    • NVIDIA GeForce Ultra low power GPU
    • up to 2GB DDR3L on-board soldered memory

      Q7-922

    Q7-922

    SM-C12

    SM-C12

    μQ7-962

    μQ7-962

    μQ7-A75-J

    μQ7-A75-J

     
    Entwicklungsstatus des Produkts
    Prozessor
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    4
    2
    Max Thread
    0
    0
    0
    ...
    Speicher
    up to 2GB DDR3L on-board soldered memory
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Grafik
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Videoschnittstellen
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Videoauflösung
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz
    HDMI, up to 1080p
    LVDS, up to 1920x1200

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Massenspeicher
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking
    Gigabit Ethernet Interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Gigabit Ethernet interface
    Fast Ethernet (10/100) interface
    USB
    6 x USB 2.0 Host ports
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    2x PCI-e x1 ports
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio
    HD Audio Interface
    I2S Audio Interface
    I2S / AC’97 Audio Interface
    I2S / AC’97 Audio Interface
    Serielle Anschlüsse

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    2 x Serial ports (TTL interface)
    CAN port interface
    ...
    Andere Schnittstellen
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    I2C Bus
    SM Bus
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Stromversorgung

    +5VDC ± 5%

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%

    +5VDC ± 5%
    Optional Low Power RTC

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem
    Linux

    Linux
    Yocto
    Android

    Linux
    Yocto

    Linux
    Yocto

    Betriebstemperatur

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    40x70 mm (μQseven, 1.57” x 2.76”)
    40x70 mm (1.57” x 2.76”)
    Security
    ...
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    ...
    CAN Bus
    ...
    ...
    ...
    ...
    Functional Safety Features
    ...
    ...
    ...
    ...

    Beschreibung

    Details

    Q7-922 is a Qseven® Rel. 1.20 Compliant Module designed by SECO that represents the top performance possibility for computational and graphical applications based on low power ARM architectures.
    The board integrates Tegra® T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
    Zusatzinformation

    Zusatzinformation

    Prozessor
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core
    Max Cores
    4
    Speicher
    up to 2GB DDR3L on-board soldered memory
    Grafik
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support
    Videoschnittstellen
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    Videoauflösung
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    Massenspeicher
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Networking
    Gigabit Ethernet Interface
    USB
    6 x USB 2.0 Host ports
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    Audio
    HD Audio Interface
    Serielle Anschlüsse

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Andere Schnittstellen
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals
    Stromversorgung

    +5VDC ± 5%

    Betriebssystem
    Linux
    Betriebstemperatur

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software
    Linux Kernel Patches
    • Patch to add jedec 5.1 Support*
    • e1000e_kernel_R16r2_svn1152.tar.gz*
    • Release Note - e1000e Patch.pdf*
    Linux 1.4
    • Linaro Compiler*
    • Kernel Linux 3.1.10*
    • File System Ubuntu 12.04 - Desktop version*
    • File System Ubuntu 12.04 - minimal version*
    • SECO Flash Bootargs*
    • SECO Tools*
    • U-Boot 2011.03*
    • md5sum.txt*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-922

    Q7-922
    • BEWERTEN SIE UNSERE PRODUKTE

      Max. 3 Stück pro Artikelnummer
    • MUSTERPREISE

      Einschließlich Versandkosten
    • AUSSCHLIEßLICH FIRMENKUNDENGESCHÄFT

      Technische Unterstützung wir nur Firmenkunden gewährt
    Computer on Module with NVIDIA® Tegra® T30 Processor
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    Q922-1210-1000-C0 Q7 - Nvidia Tegra T30@1.3GHz, 2GB DDR3L Dual Channel, 4GB eMMC, CAN Controller - Commercial temp. range Q7 - Nvidia Tegra T30@1.3GHz, 2GB DDR3L Dual Channel, 4GB eMMC, CAN Controller - Commercial temp. range Auf die Vergleichsliste

    • Devices
    • Industrielle Automatisierung
    • Security/Surveillance
    • Transport- und Verkehrswesen
    • Utilities (Energy-Telco)
    Top