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    Q7-922

    Computer on Module with NVIDIA® Tegra® T30 Processor

    • ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

    • 6x USB 2.0
    • NVIDIA GeForce Ultra low power GPU
    • up to 2GB DDR3L on-board soldered memory

      Q7-922

    Q7-922

    Q7-C26

    Q7-C26

    Q7-928

    Q7-928

    SYS-A62-10

    SYS-A62-10

     
    Entwicklungsstatus des Produkts
    Prozessor
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core

    NXP i.MX 8 Family:
    i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x Cortex®-M4F cores
    i.MX 8Quad - 4x Cortex®-A53 cores + 2x Cortex®-M4F cores

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6DP DualPlus - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core
    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores
    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    4
    0
    4
    0
    Maximale Gewindelänge
    0
    0
    0
    0
    Speicher
    up to 2GB DDR3L on-board soldered memory

    soldered down LPDDR4-3200 memory, 64-bit interface

    Up to 4GB DDR3L on-board (up to 2GB with i.MX6S)
    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit
    Grafik
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D, i.MX6DP and i.MX6Q)
    Enhanced 2D and 3D graphics with i.MX6DP
    Supports up to 3 independent displays with i.MX6D, i.MX6DPand i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    Videoschnittstellen
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector

    HDMI 2.0a or DP 1.3 interface, supporting HDCP 2.2
    Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4
    Video Input Port / Camera Connector

    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)
    Videoauflösung
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    HDMI:Up to 4Kp60
    LVDSUp to 1080p

    LVDS, up to 1920x1200
    HDMI, up to 1080p

    ...
    Massenspeicher
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface

    1x SATA Gen3 interface (alternative to 1x PCI-e x1 port)
    eMMC 5.1 drive soldered on-board
    SD 4-bit interface
    QSPI Flash soldered-on-board

    On-board eMMC drive, up to 32 GB
    SD / MMC / SDIO interface
    1 x μSD Card Slot on-board
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)
    Networking
    Gigabit Ethernet Interface

    1 x Gigabit Ethernet interface

    Gigabit Ethernet interface
    Gigabit Ethernet connector
    Optional WiFi pluggable module
    USB
    6 x USB 2.0 Host ports

    4 x USB 2.0 Host Ports 
    1 x USB 3.0 Host Port
    1 x USB 2.0 OTG port

    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)

    Up to 2x PCI-e x1 Gen3 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
    ...
    Audio
    HD Audio Interface

    I2S Audio Interface

    AC'97 Audio Interface
    I2S
    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
    Serielle Anschlüsse

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    1x UART Tx/Rx/RTS/CTS
    1x CAN Bus (TTL level)

    2 x serial ports (TTL interface)
    CAN port interface

    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")
    Andere Schnittstellen
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals

    CSI camera connector
    2x I2C Bus
    SPI interface
    8 x GPI/Os
    Boot select signal
    Power Management Signals
    Watchdog

    I2C Bus
    LPC Bus
    SM Bus
    Power Management Signals

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    Stromversorgung

    +5VDC ± 5%

    +5VDC ± 5%
    +3.3V_RTC

    +5VDC ± 5%

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem
    Linux

    Linux
    Android

    Linux
    Yocto
    Microsoft® Windows Embedded Compact 7

    Linux
    Yocto
    Windows® Embedded Compact 7
    Betriebstemperatur

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    269,60 x 189,20 x 17,17 mm

    Beschreibung

    Details

    Q7-922 is a Qseven® Rel. 1.20 Compliant Module designed by SECO that represents the top performance possibility for computational and graphical applications based on low power ARM architectures.
    The board integrates Tegra® T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
    Zusatzinformation

    Zusatzinformation

    Prozessor
    NVIDIA® Tegra® T30 with Quad ARM® CORTEX -A9
    MPCore® CPU, 1.3 GHz per core
    Max Cores
    4
    Speicher
    up to 2GB DDR3L on-board soldered memory
    Grafik
    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support
    Videoschnittstellen
    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector
    Videoauflösung
    HDMI: Up to 1920 x 1080p
    LVDS: Up to 2048 x 1536
    Massenspeicher
    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface
    Networking
    Gigabit Ethernet Interface
    USB
    6 x USB 2.0 Host ports
    PCI-e
    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)
    Audio
    HD Audio Interface
    Serielle Anschlüsse

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

    Andere Schnittstellen
    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals
    Stromversorgung

    +5VDC ± 5%

    Betriebssystem
    Linux
    Betriebstemperatur

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software
    Linux Kernel Patches
    • Patch to add jedec 5.1 Support*
    • e1000e_kernel_R16r2_svn1152.tar.gz*
    • Release Note - e1000e Patch.pdf*
    Linux 1.4
    • Linaro Compiler*
    • Kernel Linux 3.1.10*
    • File System Ubuntu 12.04 - Desktop version*
    • File System Ubuntu 12.04 - minimal version*
    • SECO Flash Bootargs*
    • SECO Tools*
    • U-Boot 2011.03*
    • md5sum.txt*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-922

    Q7-922
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    Computer on Module with NVIDIA® Tegra® T30 Processor
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    Q922-1210-1000-E0 Qseven NVIDIA® Tegra® T30 Nvidia Tegra T30 @1,3GHz, 2GB RAM, eMMC 4GB, CAN Controller, (Extended temperature -20°C to 70°C) Auf die Vergleichsliste
    Q922-1210-1000-C0 Qseven NVIDIA® Tegra® T30 Nvidia Tegra T30 @1,3GHz, 2GB RAM, eMMC 4GB, CAN Controller (commercial temp.) Auf die Vergleichsliste

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