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    Q7-796

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

    • OMAP™ 37xx Family - ARM Cortex™ A8 up to 1 GHz core
    • 2 x COM ports; CAN interface; 10/100 Base-T interface
    • PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core
    • Mobile DDR 128 / 256MB / 512 MB onboard
    Verfügbar im industriellen Temperaturbereich

      Q7-796

    Q7-796

    μQ7-962

    μQ7-962

    Q7-C25

    Q7-C25

    SYS-A62-10

    SYS-A62-10

     
    Entwicklungsstatus des Produkts
    Prozessor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core
    - i.MX6D Dual - Dual core up to 1GHz per core
    - i.MX6Q Quad - Quad core up to 1GHz per core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    Multicore NXP i.MX 6 processor family
    SYS-A62-10/SOLO: i.MX6S Solo, 1 x ARM Cortex-A9 @1 GHz Core
    SYS-A62-10/LITE: i.MX6DL Dual Lite, 2 x ARM Cortex-A9 @1 GHz Cores
    SYS-A62-10/QUAD: i.MX6Q Quad, 4 x ARM Cortex-A9 @1 GHz Cores
    Chipsatz
    ...
    ...
    ...
    ...
    Max Cores
    1
    4
    0
    0
    Maximale Gewindelänge
    0
    0
    0
    0
    Speicher
    Mobile DDR 128 / 256MB / 512 MB onboard
    up to 2GB DDR3L on-board (up to 1GB with i.MX6S)

    soldered down DDR4-2400 memory, 32-bit interface, up to 4GB

    On-board DDR3L soldered memory;
    SYS-A62-10/SOLO: 512MB 32-bit
    SYS-A62-10/LITE: 1GB 64-bit
    SYS-A62-10/QUAD: 1GB 64-bit
    Grafik
    ...
    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
    Supports up to 3 independent displays with i.MX6D and i.MX6Q
    Supports 2 independent displays with i.MX6DL and i.MX6S

    Integrated Graphics Processing Unit, supports 2 independent displays.
    Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
    Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11

    2D, OpenGL® ES2.0 3D HW accelerator
    OpenVG™ accelerator (SYS-A62/10/QUAD only)
    HW encoding of MPEG-4, H.263 V2, H.264, MJPEG
    HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX
    Videoschnittstellen
    LVDS Single/Dual Channel 18/24 Bit
    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface 1.4

    HDMI 2.0a / Display Port 1.3 interface, supporting HDCP 2.2 and HDCP 1.4/1.3
    eDP interface or 18- / 24-bit Dual Channel LVDS interface

    10,1” LVDS display, resolution 1280 x 800, 30K hours life
    P-Cap (Projected Capacitive touch screen), with 2mm glass cover
    Glass Hardness IK08, Surface Hardness 8H (450g)
    Videoauflösung
    LVDS, up to 1366 x 768
    HDMI, up to 1080p
    LVDS, up to 1920x1200
    HDMI/DP: Up to 4096 x 2160p60
    LVDS/eDP: Up to 1920 x 1080 @ 60Hz
    ...
    Massenspeicher
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Up to 8 GB eMMC drive soldered onboard
    SD / MMC / SDIO interface
    1 x External SATA Channel (only available with i.MX6D and i.MX6Q)

    eMMC 5.0 drive soldered on-board, up to 64GB
    Optional microSD slot on board
    QSPI Flash soldered-onboard

    On-board 4GB eMMC drive
    microSD Card Slot
    SATA Connector (SYS-A62-10/QUAD only)
    Networking
    10/100 Base-T interface
    Gigabit Ethernet interface

    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard

    Gigabit Ethernet connector
    Optional WiFi pluggable module
    USB
    1x USB OTG
    2x USB 2.0 Host
    1 x USB OTG interface
    4 x USB 2.0 Host interfaces

    1 x USB 3.0 OTG Ports
    Up to 4 x USB 2.0 Host Ports

    2 x USB 2.0 Type-A ports and 1 x USB 2.0 internal connector
    USB micro-B Client port
    PCI-e
    ...
    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    1x PCI-e x1 port, optional

    ...
    Audio
    AC’97 Audio Interface
    I2S / AC’97 Audio Interface

    I2S Audio Interface

    SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655
    AC’97 Audio Codec with Mic-In, Line-Out audio Jacks
    Serielle Anschlüsse
    2 x COM ports

    CAN interface
    2 x Serial ports (TTL interface)
    CAN port interface

    1x UART Tx/Rx/RTS/CTS (Optional)
    1x Debug UART
    Optional CAN Bus interface (TTL Level)

    Dedicated Serial ports:
    SYS-A62-10/SOLO: 2 x RS-232 ports 
    SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port
    SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port

    Other serial ports can be realised on expansion connector (see ""Other interfaces"")
    Andere Schnittstellen

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    I2C Bus
    SM Bus
    Power Management Signals

    I2C Bus
    SM Bus
    Optional SPI interface
    8 x GPI/Os
    UltraLow Power RTC
    Power Management Signals
    Watchdog

    MIPI-CSI Camera connector
    Programmable expansion connector with:
    SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces
    Stromversorgung
    ...
    +5VDC ± 5%

    +5VDC ±5% and +5VSB (optional)
    +3.3V_RTC

    +12VDC
    SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.MX6 RTC, require external battery for time/data retention
    SYS-A62-10/QUAD: low power RTC with on-board battery

    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem
    Microsoft® Windows® CE 6.0

    Linux
    Linux
    Yocto

    Linux
    Android

    Linux
    Yocto
    Windows® Embedded Compact 7
    Betriebstemperatur

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C ÷ +85°C (industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version, without WiF+BT optional module)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ 50°C

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    40x70 mm (μQseven, 1.57” x 2.76”)
    70x70 mm (2.76” x 2.76”)
    269,60 x 189,20 x 17,17 mm
    Security
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Keine Angabe
    BIOS
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Embedded Controller Functionalities
    Keine Angabe
    Keine Angabe
    Keine Angabe
    Keine Angabe

    Beschreibung

    Details

    The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.


    The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Max Cores
    1
    Speicher
    Mobile DDR 128 / 256MB / 512 MB onboard
    Videoschnittstellen
    LVDS Single/Dual Channel 18/24 Bit
    Videoauflösung
    LVDS, up to 1366 x 768
    Massenspeicher
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Networking
    10/100 Base-T interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    Audio
    AC’97 Audio Interface
    Serielle Anschlüsse
    2 x COM ports

    CAN interface
    Andere Schnittstellen

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    Betriebssystem
    Microsoft® Windows® CE 6.0

    Linux
    Betriebstemperatur

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software

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    Dokumente
    Data Sheet
    Manual
    • quadmo747_x_omap3_manual_rel1_5.pdf*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-796

    Q7-796
    • BEWERTEN SIE UNSERE PRODUKTE

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    • MUSTERPREISE

      Einschließlich Versandkosten
    • AUSSCHLIEßLICH FIRMENKUNDENGESCHÄFT

      Technische Unterstützung wir nur Firmenkunden gewährt

    Orders placed between August 3dr and August 21st 2019 will be shipped from August 23rd 2019

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family
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