Benvenuti nel sito SECO S.p.A.

×

Registrierung

Account-Informationen

  • Login-Daten

    oder login

    Vorname obbligatorisch!
    Nachname obbligatorisch!
    Steuernummer obbligatorisch
    Firmenname obbligatorisch!
    Mehrwertsteuernummer obbligatorisch!
    Land obbligatorisch!
    Vorname nicht gültig!
    Nachname nicht gültig!
    Das ist keine E-Mailadresse!
    E-Mailadresse obbligatorisch!
    Diese E-Mailadresse existiert schon!
    Password obbligatorisch!
    Geben Sie ein gültiges Password ein!
    Geben Sie 6 oder mehr Schriftzeichen ein!
    Geben Sie mindestens 16 Schriftzeichen ein!
    Password stimmen nicht überein!
    Allgemeinen Geschäftsbedingungen sind obligatorisch!
    E-Mail oder Password sind nicht korrekt!
    Account confirmation is required. Please, check your email for the confirmation link. To resend the confirmation email pleasehier klicken

    Q7-796

    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family

    • OMAP™ 37xx Family - ARM Cortex™ A8 up to 1 GHz core
    • 2 x COM ports; CAN interface; 10/100 Base-T interface
    • PowerVR SGX™ Graphics Accelerator + Up to 800MHz TMS320C64x+™ DSP Core
    • Mobile DDR 128 / 256MB / 512 MB onboard
    Verfügbar im industriellen Temperaturbereich

      Q7-796

    Q7-796

    SM-C12

    SM-C12

    μQ7-A75-J

    μQ7-A75-J

     
    Entwicklungsstatus des Produkts
    Prozessor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
    i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
    i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU 

    NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors

    - i.MX6S Solo - Single core up to 1GHz
    - i.MX6DL Dual Lite - Dual core up to 1GHz per core

    Chipsatz
    ...
    ...
    ...
    Max Cores
    1
    0
    2
    Max Thread
    0
    0
    ...
    Speicher
    Mobile DDR 128 / 256MB / 512 MB onboard
    Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

    Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F

    Grafik
    ...

    Integrated Graphics Processing Unit, supports 2 independent displays
    Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
    Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1

    Dedicated 2D Hardware accelerator
    Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
    Supports 2 independent displays

    Videoschnittstellen
    LVDS Single/Dual Channel 18/24 Bit
    HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
    18- / 24-bit Dual Channel LVDS interface or MIPI-DSI interface
    (factory alternatives)

    1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
    HDMI Interface

    Videoauflösung
    LVDS, up to 1366 x 768
    HDMIUp to 4096 x 2160 @ 60 (4K)
    MIPI-DSI, LVDSUp to 1920 x 1080 @ 60Hz

    LVDS, resolution up to 1920x1200
    HDMI, resolution up to 1080p

    Massenspeicher
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Optional SD 4-bit interface
    QSPI Flash soldered-onboard
    eMMC 5.0 drive soldered on-board

    On-board eMMC drive, up to 8 GB
    SD / MMC / SDIO interface
    Internal SPI Flash for booting

    Networking
    10/100 Base-T interface
    1 x Gigabit Ethernet interface
    Optional WiFi + BT LE module onboard
    Fast Ethernet (10/100) interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    2 USB 3.0 Host ports
    2 USB 2.0 Host ports
    1 USB 2.0 OTG port

    1 x USB OTG interface
    1 x USB 2.0 Host interface

    PCI-e
    ...
    2x PCI-e x1 ports

    1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)

    Audio
    AC’97 Audio Interface
    I2S Audio Interface
    I2S / AC’97 Audio Interface
    Serielle Anschlüsse
    2 x COM ports

    CAN interface
    Up to 2x UART Tx/Rx/RTS/CTS
    2x UART Tx/Rx
    1x CAN Bus (TTL level)
    ...
    Andere Schnittstellen

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    1x 4-lanes + 1x 2-lanes CSI camera interfaces
    I2C Bus
    SM Bus
    2x SPI interfaces
    QuadSPI interface
    12 x GPI/Os
    Boot select signals
    Power Management Signals

    On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
    - Additional SD interface
    - Up to 4 UARTs
    - CAN interface
    - Watchdog(s)
    - I2C interfaces
    - PWM outputs
    - SPI interface
    - Additional Audio interface

    (*) not all the combinations are allowed simultaneously Power Management Signals

    Stromversorgung
    ...

    +5VDC
    +3.3V_RTC

    +5VDC ± 5%
    Optional Low Power RTC

    Energieverbrauch
    ...
    ...
    ...
    Betriebssystem
    Microsoft® Windows® CE 6.0

    Linux

    Linux
    Yocto
    Android

    Linux
    Yocto

    Betriebstemperatur

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial temp.)*
    -40°C ÷ +85°C (Industrial temp.)* 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    50 x 82 mm (1.97” x 3.23”)
    40x70 mm (1.57” x 2.76”)
    Security
    ...
    ...
    ...
    BIOS
    ...
    ...
    ...
    Embedded Controller Functionalities
    ...
    ...
    ...
    CAN Bus
    Keine Angabe
    ...
    ...
    Functional Safety Features
    Keine Angabe
    ...
    ...

    Beschreibung

    Details

    The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.


    The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    Texas Instruments® OMAP™ 37xx Family:
    AM3703 (Cortex™ A8 up to 1 GHz core)
    DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
    SGX™ Graphics Accelerator + Up to 800MHz
    TMS320C64x+™ DSP Core

    Max Cores
    1
    Speicher
    Mobile DDR 128 / 256MB / 512 MB onboard
    Videoschnittstellen
    LVDS Single/Dual Channel 18/24 Bit
    Videoauflösung
    LVDS, up to 1366 x 768
    Massenspeicher
    256 MB / 512MB / 1GB NAND Flash
    eMMC soldered onboard up to 16GB
    Networking
    10/100 Base-T interface
    USB
    1x USB OTG
    2x USB 2.0 Host
    Audio
    AC’97 Audio Interface
    Serielle Anschlüsse
    2 x COM ports

    CAN interface
    Andere Schnittstellen

    MMC/HC MMC/SD/SDHC/SDIO interface
    Video Input Port / Camera Connector
    LPC Bus
    SMBus
    SPI interface
    I2C bus
    JTAG

    Betriebssystem
    Microsoft® Windows® CE 6.0

    Linux
    Betriebstemperatur

    0°C ÷ +70°C (commercial version)
    -40°C ÷ +85°C (industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    70x70 mm (2.76” x 2.76”)
    Software

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Dokumente
    Data Sheet
    Manual
    • quadmo747_x_omap3_manual_rel1_5.pdf*

    * User need to register to site before download reserved files. Please login if you are a registered user.

    Q7-796

    Q7-796
    • BEWERTEN SIE UNSERE PRODUKTE

      Max. 3 Stück pro Artikelnummer
    • MUSTERPREISE

      Einschließlich Versandkosten
    • AUSSCHLIEßLICH FIRMENKUNDENGESCHÄFT

      Technische Unterstützung wir nur Firmenkunden gewährt
    Computer on Module based on the Texas Instruments® OMAP™ 37xx Family
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    M796-LLMCFBBI Qseven OMAP DM3730 OMAP3 DM3730CUSD100 @1GHz - 512MB 200MHz DDR SDRAM - SSD 1GB - 10/100 ETH - eMMC 4GB - CAMERA Connector - CAN Controller - Ind. Temp Auf die Vergleichsliste
    M796-FFPBCBBC Qseven OMAP DM3730 OMAP DM3730CUS100 @1GHz, 512MB 200MHz DDR SDRAM, SSD 512MB,10/100 ETH, eMMC 8GB, CAMERA Connector, CAN Controller (commercial temp.) Auf die Vergleichsliste
    M796-MLQCFBBI Qseven OMAP AM3703 OMAP AM3703CUSD100 @1GHz - 512MB 200MHz DDR SDRAM, SSD 512MB, 10/100 ETH, eMMC 4GB, CAMERA Connector, CAN Controller (industrial temp.) Auf die Vergleichsliste

    • Devices
    • Industrielle Automatisierung
    • IoT
    • Medizintechnik
    • Transport- und Verkehrswesen
    Top