[Picture] Q7-922_front
[Picture] Q7-922_front

Q7-922

Computer on Module with NVIDIA® Tegra® T30 Processor

Product status

Development
Sampling
Production

Contact us for more information and quotes

CPU

ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

Graphics

NVIDIA GeForce Ultra low power GPU

Connectivity

6x USB 2.0

Memory

up to 2GB DDR3L on-board soldered memory

Product details

Technical Info

  • Description
    Q7-922 is a Qseven® Rel. 1.20 Compliant Module designed by SECO that represents the top performance possibility for computational and graphical applications based on low power ARM architectures. The board integrates Tegra® T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
  • Processor

    NVIDIA® Tegra® T30 with ARM® CORTEX -A9 Quad MPCore® CPU, 1.3 GHz per core

  • Max Cores
    4
  • Memory

    up to 2GB DDR3L on-board soldered memory

  • Graphics

    embedded NVIDIA® ULP GeForce® GPU
    Integrated High Definition Audio-Video Processor
    Dual independent display support

  • Video Interfaces

    LVDS Single / Dual Channel 18 / 24 bit interface
    HDMI 1.4a Interface
    Video Input Port / Camera connector

  • Video Resolution

    HDMI Up to 1920 x 1080p
    LVDS Up to 2048 x 1536

  • Mass Storage

    Up to 16GB on-board soldered eMMC drive
    1 x S-ATA Channel
    microSD Slot on-board
    4-bit SD / MMC interface

  • Networking

    Gigabit Ethernet Interface

  • USB

    6 x USB 2.0 Host ports

  • PCI-e

    1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes
    (with support for 2 x PCI-e x 1 devices)

  • Audio

    HD Audio Interface

  • Serial Ports

    2 serial ports (Tx, Rx signals)
    CAN Bus Interface

  • Other Interfaces

    I2C, SM Bus, LPC, SPI
    One Wire Interface
    Thermal Cooling Interface
    Power management signals

  • Power Supply

    +5VDC ± 5%

  • Operating System

    Linux

  • Operating Temperature

    0°C ÷ +60°C (commercial version)
    -20°C ÷ +70°C (extended version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    70x70 mm (2.76” x 2.76”)

Software

Part Number

  • Q922-1210-1000-C0

    Part number description
    Q7-922 w/ Nvidia Tegra T30 @1,3GHz - 2GB RAM - eMMC 4GB - CAN Controller - Comm. Temp.
    Contact us for more informations or quotes
    KONTAKTIEREN
  • Q922-1230-1000-C0

    Part number description
    Q7-922 w/ Nvidia Tegra T30 @1,3GHz - 2GB RAM - eMMC 4GB (JEDEC/MMC standard version 5.0 compliant) - CAN Controller - Comm. Temp.
    Contact us for more informations or quotes
    KONTAKTIEREN

Related Products

CQ7-A42
Qseven® rel. 2.0 Compliant Evaluation Carrier Board on 3.5” Form factor
Production
View Product
[Image] Q7 STARTER KIT 2.0
Q7 STARTER KIT 2.0
Cross Platform Starter Kit compatible with both x86 and Arm Rev. 2.0 Qseven® modules: a complete package including the basic components necessary to start developing
Production
View Product
[Picture] Q7 Dev Kit 2.0
Q7 DEV KIT 2.0
Cross Platform Development Kit for Qseven® philosophy, compatible with both x86 and Arm Rev. 2.0 Qseven® modules
Production
View Product
Q922-DISS-1-PK
Q7 HEAT SPREADER: Q7-922 Heat Spreader (PASSIVE)
Production
View Product
Q922-DISS-2-PK
Q7 HEAT SINK: Q7-922 Heat Sink (PASSIVE)
Production
View Product

Market applications