COMe-C89-CT6

Compact COM Express™ Rel.3.0 Type 6 module, with the AMD Ryzen™ Embedded R1000 family of SoCs

Product status

Development
Sampling
Production

Contact us for more information and quotes

CPU

AMD Ryzen™ Embedded R1000 processors

Graphics

AMD Radeon™ Vega GPU with 3 Compute Units

Connectivity

4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC Memory

Product details

Technical Info

  • Description
    Low-end AMD Ryzen™ on COM Express™ Type 6 Compact
  • Processor

    AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
    AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Dual Thread @ 2.4GHz (3.3 Boost), TDP 12-25W

  • Max Cores
    2
  • Memory

    Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB

  • Graphics

    AMD Radeon™ Vega 3 GPU with 3 Compute Units
    DirectX® 12 supported
    H.265 (10-bit) decode and 8-bit video encode
    VP9 decode
    3 independent displays supported

  • Video Interfaces

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I
    eDP or Single/Dual-Channel 18-/24- bit LVDS interface (factory alternatives to third DDI port)

  • Video Resolution

    DDIs, eDP: up to 4K
    LVDS: up to 1920 x 1200 @ 60Hz

  • Mass Storage

    2 x S-ATA Gen3 Channels

  • Networking

    Gigabit Ethernet interface
    Intel® I21x family GbE Controller 

  • USB

    Up to 4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

  • PCI-e

    Up to 2 x PCI-e x1 Gen3 lanes + 3x PCI-e x1 Gen2 lanes
    PCI-express Graphics (PEG) x4

  • Audio

    HD Audio Interface

  • Serial Ports

    2 x UARTs

  • Other Interfaces

    SPI, I2C, SM Bus, LPC bus, FAN management
    Optional TPM 2.0 module on-board
    4x GPI, 4 x GPO

  • Power Supply

    +12VDC ± 10% and +5VSB (optional)

  • Operating System

    Windows 10 64-bit
    Linux Ubuntu

  • Operating Temperature

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

     

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

  • Dimensions
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Software

Part Number

  • The ordering code for samples will be available soon.

    Part number description
    If you are interested in this product please contact us
    Contact us for more informations or quotes
    KONTAKTIEREN

Related Products

MC89-DISS-3-PK
COMe-C89-CT6 Heat Sink (ACTIVE)
Production
View Product
COM EXP T6 DEV KIT
Cross Platform Development Kit compatible with both x86 and Arm COM Express™ Type 6 modules
Development
View Product
MC89-DISS-1-PK
COMe-C89-CT6 Heat Spreader (PASSIVE)
Production
View Product
CCOMe-C30
Evaluation Carrier Board for COM Express™ Type 6 Modules on 3.5” form factor
Sampling
View Product

Market applications