From cross-platform solutions to SECO’s Industrial Internet of Things platform to the disruptive UDOO BOLT, SECO is going to present the widest range of solutions for the IoT industry of tomorrow.
From May 28th to June 1st, SECO is exhibiting at Computex Taipei 2019, the leading global ICT and IoT show with a complete supply chain and ecosystems.
Co-organized by the Taiwan External Trade Development Council (TAITRA) and Taipei Computer Association (TCA), Computex provides a unique opportunity to engage with the whole spectrum of the ICT industry, from established brands to startups in the field of embedded computing, semiconductors and the Internet of Things.
SECO will present a comprehensive range of products at Taipei Nangang Exhibition Center, Hall 1, booth No K0105a, mainly centered around SECO’s cross-platform vision and its modular solutions based on state-of-the-art technologies and standard form factors (Qseven®, COM Express™, and SMARC).
The complete Qseven®-based product portfolio ranges from solutions featuring the NXP i.MX 8 Applications Processors - such as the Q7-C26, remarkable for its wide connectivity and rich M2M interface for onboard subsystems – or the NXP i.MX 8M Applications Processors (Q7-C25), to modules equipped with Intel® Atom X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors (Q7-B03) and Intel® Atom™ E3800 and Celeron® families (formerly Bay Trail) SoC (Q7-974).
COM Express™ solutions: the scalability of this form factor with the latest Intel® platforms will be highlighted with three innovative products: the COMe-C55-CT6 - Compact COM Express™ Rel. 3.0 Type 6 module with 8th Gen Intel® Core™ and Celeron™ U-series processors (formerly Whiskey Lake), the COMe-C24-CT6 - COM Express™ 3.0 Compact Type 6 Module with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors - and the COMe-C08-BT6 - COM Express™ with Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H). The COM Express™ Compact 3.0 Type 6 Module COMe-B75-CT6 with AMD Ryzen™ Embedded V1000 processors will be also showcased.
SMARC modules: among the highlighted solutions there will be the SM-B71, a SMARC Rel. 2.0 compliant module with Xilinx® Zynq® Ultrascale+™ MPSoC. Unique for its blending of the ARM and FPGA domains, it delivers a flexible ARM + FPGA heterogeneous processing in a standard form factor, merging the cost-effective Dual-Core to high-performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, granting extreme flexibility (up to 256k FPGA logic cells), vast scalability, and high-end performance all at once.
Not only hardware: a special focus will be on SECO's brand-new Industrial Internet of Things platform, an all-encompassing B2B service aiming at unleashing the customer’s full potential thanks to the power of AI and Big Data: mainly addressed to industrial enterprises, the service transforms the business into a fully-fledged Smart Industry.
Finally, SECO's booth will also include an area entirely dedicated to the company's latest creations in the realm of DIY electronics and open-source hardware: UDOO BOLT, an AI-first, high-performant SBC powered by AMD Ryzen™ Embedded V1000 SoC and also featuring an Arduino-compatible platform for sensing and programming the physical world, and UDOO X86II, the next-gen Intel® x86 II open hardware SBC with Intel® Quad Core 64 bit and Arduino™ Leonardo Microcontroller.
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