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    COMe-C08-BT6

    COM Express™ 3.0 Basic Type 6 Module with the Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs

    • Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs
    • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
    • Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    • DDR4 with ECC technology, up to 2666 MHz

      COMe-C08-BT6

    COMe-C08-BT6

    SBC-B68-eNUC

    SBC-B68-eNUC

    COMe-B09-BT6

    COMe-B09-BT6

    COMe-A98-CT6

    COMe-A98-CT6

     
    Entwicklungsstatus des Produkts
    Prozessor

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz in Turbo Boost),  with HT, 8MB Cache, 45W TDP
    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP
    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz in Turbo Boost), with HT, 12MB Cache, 45W TDP 

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    Chipsatz
    Intel® QM370, HM370 or CM246 PCH
    ...

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    ...
    Max Cores
    6
    4
    4
    4
    Maximale Gewindelänge
    12
    4
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    0
    Speicher

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

    Quad Channel soldered down LPDDR4 memory, up to 8GB
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH

    Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz (up to 1600MHz with GX217GI)

    Grafik

    Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9,
    AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
    HEVC/H.265, VP9

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon™ R7
    AMD RX-418GD, RX-416GD - Radeon™ R6
    AMD GX-217GI - Radeon™ R6E
    Up to 3 independent displays supported (up to 2  with GX217GI)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported
    Videoschnittstellen

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (R-Series SOCs only, excludes one DDI Port)
    PCI-express Graphics (PEG) x 8 (x4 with GX217GI)
    Videoauflösung

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200
    Massenspeicher

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    4 x S-ATA Gen3 Channels
    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller
    USB

    4 x USB 3.1 Gen2 Host ports
    8 x USB 2.0 Host ports

    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot
    8 x PCI-e x1 Gen3 lanes
    3 x PCI-e x1 Gen3 lanes
    Audio
    HD Audio Interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    HD Audio Interface
    HD Audio Interface
    Serielle Anschlüsse
    2 x UARTs
    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    2 x UARTs
    ...
    Andere Schnittstellen

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4 x GPI, 4 x GPO

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Stromversorgung

    +12VDC ± 10% and + 5VSB (optional)

    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery
    +12VDC ± 10% and +5VSB (optional)
    +12VDC ± 10% and + 5VSB (optional)
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Betriebstemperatur

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    101.6 x 101.6 mm (4” x 4”)
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    Beschreibung

    Details

    COMe-C08-BT6 is a COM Express™ Basic Type 6 with Intel® 8th Generation Core™ i7 / i5 / Xeon® Processors (formerly Coffee Lake H) reaching a maximum of 12 threads. Mounting the Intel® Gen9 LP graphic core architecture, COMe-C08-BT6 can manage up to 3 independent displays at once, with a resolution up to 4096x2304 @60Hz, 24bpp. The module also embeds an H.265 / HEVC hardware transcoder - a peculiarity that, combined with the outstanding performance and the compatibility with multiple video interfaces, makes it an ideal platform for projects operating in the field of gaming, digital signage, infotainment, and HMI.
    Zusatzinformation

    Zusatzinformation

    Prozessor

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz in Turbo Boost),  with HT, 8MB Cache, 45W TDP
    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP
    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz in Turbo Boost), with HT, 12MB Cache, 45W TDP 

    Chipsatz
    Intel® QM370, HM370 or CM246 PCH
    Max Cores
    6
    Maximale Gewindelänge
    12
    Speicher

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

    Grafik

    Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9,
    AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
    HEVC/H.265, VP9

    Videoschnittstellen

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Videoauflösung

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Massenspeicher

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB

    4 x USB 3.1 Gen2 Host ports
    8 x USB 2.0 Host ports

    PCI-e

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    Audio
    HD Audio Interface
    Serielle Anschlüsse
    2 x UARTs
    Andere Schnittstellen

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4 x GPI, 4 x GPO

    Stromversorgung

    +12VDC ± 10% and + 5VSB (optional)

    Betriebssystem

    Microsoft® Windows 10 
    Linux

    Betriebstemperatur

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    Software
    BIOS
    • [Bios] - Release version 1.00*
    EAPI
    • [Embedded application programming interface] - Release version 1.20.17*
    Windows 10
    • [Driver package] - Release version 02 for RS5*
    • [Driver package] - Release version 01*

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    Dokumente

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    COMe-C08-BT6

    COMe-C08-BT6
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    COM Express™ 3.0 Basic Type 6 Module with the Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    MC08-1000-1200-C0 COMe-C08-CT6 w/Intel i5-8400H, Quad Core @2.5GHz (4.2GHz in Turbo Boost), 8MB Cache, 45W TDP + Chipset HM370, TPM, eDP + VGA [only HDMI on DDI3] - Comm.Temp Auf die Vergleichsliste
    MC08-4000-1200-C0 COMe-C08-CT6 w/Intel i7-8850H, Hexa Core @2.6GHz (4.3GHz in Turbo Boost), 9MB Cache, 45W TDP + Chipset QM370 (AMT), TPM, eDP + VGA [only HDMI on DDI3] - Comm.Temp Auf die Vergleichsliste
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    • Industrielle Automatisierung
    • Infotainment/Vending
    • Medizintechnik
    • Messgeräte
    • Utilities (Energy-Telco)
    Top