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    COMe-B09-BT6

    COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs

    • Intel® 6th and 7h generation Core™ / Xeon® CPUs
    • 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3
    • Intel® HD Graphics 530 /P530/630/P630

    • 2 x DDR4 So-DIMM slots

      COMe-B09-BT6

    COMe-B09-BT6

    SBC-B68-eNUC

    SBC-B68-eNUC

    COMe-C08-BT6

    COMe-C08-BT6

    COMe-A98-CT6

    COMe-A98-CT6

     
    Entwicklungsstatus des Produkts
    Prozessor

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Intel® Atom™ x5-E3930 Dual Core @1.3 GHz (Burst 1.8GHz), 2MB L2 Cache, 6.5W TDP
    Intel® Atom™ x5-E3940 Quad Core @1.6 GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP
    Intel® Atom™ x7-E3950 Quad Core @1.6 GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP
    Intel® Pentium® N4200 Quad Core @1.1GHz (Burst 2.5GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® N3350 Dual Core @1.1GHz (Burst 2.4GHz), 2MB L2 Cache, 6W TDP
    Intel® Celeron® J3455, Quad Core @1.5GHz (Burst 2.3GHz), 2MB L2Cache, 10W TDP
    Intel® Celeron® J3355, Dual Core @2.0GHz (Burst 2.5GHz), 2MB L2Cache, 10W TDP

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz in Turbo Boost),  with HT, 8MB Cache, 45W TDP
    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP
    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz in Turbo Boost), with HT, 12MB Cache, 45W TDP 

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    Chipsatz

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    ...
    Intel® QM370, HM370 or CM246 PCH
    ...
    Max Cores
    4
    4
    6
    4
    Maximale Gewindelänge
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    4
    12
    0
    Speicher
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Quad Channel soldered down LPDDR4 memory, up to 8GB

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

    Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz (up to 1600MHz with GX217GI)

    Grafik
    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9

    Integrated Intel® HD Graphics 500 series controller, with up to 18 Execution Units
    4K HW decoding and encoding of HEVC(H.265), H.264, VP8, VP9, MVC
    Three independent display support

    Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9,
    AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
    HEVC/H.265, VP9

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon™ R7
    AMD RX-418GD, RX-416GD - Radeon™ R6
    AMD GX-217GI - Radeon™ R6E
    Up to 3 independent displays supported (up to 2  with GX217GI)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported
    Videoschnittstellen

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Two DP++ 1.2 interfaces on miniDP connectors
    (supports HDMI displays through external adapter)
    embedded Display Port (eDP) internal connector
    LVDS through optional external adapter

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (R-Series SOCs only, excludes one DDI Port)
    PCI-express Graphics (PEG) x 8 (x4 with GX217GI)
    Videoauflösung

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DP Up to 4096 x 2160 @60HZ
    eDP     Up to 3840 x 2160 @60Hz
    HDMI Up to 3840 x 2160 @30Hz
    LVDS Up to 1920 x 1200 @ 60Hz

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200
    Massenspeicher
    4 x S-ATA Gen3 Channels

    Optional eMMC drive onboard
    M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **)
    microSD Card slot
    SATA 7p M connector

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os
    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    2x Gbit LAN / Intel Gigabit Ethernet i21x family controller
    M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **)
    M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230)

    ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive.

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller
    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    2 x USB 3.0 Host ports on USB 3.0 Type-A sockets
    2 x USB 2.0 Host ports on USB 2.0 Type-A sockets
    2 x USB 2.0 Host ports on internal pin header
    1 x USB 3.0 Host port on SSD/WWAN M.2 slot
    1 x USB 2.0 Host port on WLAN M.2 Slot

    4 x USB 3.1 Gen2 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e
    8 x PCI-e x1 Gen3 lanes
    1 x PCI-e x2 port on M.2 SSD/WWAN Slot
    1 x PCI-e x1 port on WLAN M.2 Slot

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    3 x PCI-e x1 Gen3 lanes
    Audio
    HD Audio Interface
    HD Audio codec / Cirrus Logic CS4207
    Mic In and Line Out Audio jacks
    Amplified Speaker output on internal pin header
    HD Audio Interface
    HD Audio Interface
    Serielle Anschlüsse
    2 x UARTs
    2 x RS-232/RS-422/RS-485 UARTS software configurable, oninternal Pin Header
    2 x UARTs
    ...
    Andere Schnittstellen

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    2 x I2C + 8 x GPI/Os on Feature connector
    Button / LED front panel header
    CIR (Consumer InfraRed) sensor
    microSIM slot for M.2 WWAN Modem
    Optional TPM 2.0 on-board

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4 x GPI, 4 x GPO

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Stromversorgung
    +12VDC ± 10% and +5VSB (optional)
    +18VDC ÷ +32VDC recommended
    +15VDC ÷ +36VDC absolute
    RTC Battery

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Microsoft® Windows 10 Enterprise (64 bit)
    Microsoft® Windows 10 IoT Core
    Wind River Linux 64 bit
    Yocto (64 bit)
    Android (planning)

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 7
    Microsoft® Windows 8.1
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Betriebstemperatur

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (commercial version)
    -40°C ÷ +85°C (Industrial version) 

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    101.6 x 101.6 mm (4” x 4”)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    Beschreibung

    Details

    COMe-B09-BT6 is a COM Express™ Basic Type 6 module designed by SECO, based on the Intel® 6th and 7th generation Core™ / Xeon® (""Skylake"" and ""Kaby Lake"") CPUs, that features up to 4 Cores, HD Graphics 530 /P530/630/P630 and DDR4 RAM technology.
    Being able to support up to 3 independent displays, it also offers H.265 / HEVC HW Transcoder and resolution up to 4096x2304 @60Hz, 24bpp.

    Zusatzinformation

    Zusatzinformation

    Prozessor

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Chipsatz

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    Max Cores
    4
    Maximale Gewindelänge
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    Speicher
    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Grafik
    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    Videoschnittstellen

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Videoauflösung

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Massenspeicher
    4 x S-ATA Gen3 Channels
    Networking

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e
    8 x PCI-e x1 Gen3 lanes
    Audio
    HD Audio Interface
    Serielle Anschlüsse
    2 x UARTs
    Andere Schnittstellen

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Stromversorgung
    +12VDC ± 10% and +5VSB (optional)
    Betriebssystem

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Betriebstemperatur

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)
    Software
    BIOS
    • [Bios] - Release version 1.04*
    EAPI
    • [Embedded application programming interface] - Release version 1.20.15*
    Windows 7 (Skylake)
    • [Chipset - 64bit] - Driver version 10.1.1.40*
    • [Video - 64bit] - Driver version 21.20.16.4678*
    • [Lan - 64bit] - Driver version 22.3*
    • [Management Engine - 64bit] - Driver version 11.6.29.3287*
    Windows 10
    • [Chipset - 64bit] - Driver version 10.1.1.40*
    • [Video - 64bit] - Driver version 21.20.16.4678 *
    • [Lan - 64bit] - Driver version 22.3*
    • [Management Engine - 64bit] - Driver version 11.6.29.3287*
    • [Serial I/O - 64bit] - Driver version 30.100.1633.03*

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    Dokumente

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    COMe-B09-BT6

    COMe-B09-BT6
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    COM Express™ Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    MB09-5050-2100-I1 COM-Express Type 6 Intel® Core i7-6822EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6822EQ, PCH - QM175, eDP (B0), DP on DDI3 (B3) - Ind. Temp. Range Qualified Auf die Vergleichsliste
    MB09-2030-4100-C1 COM-Express Type 6 Intel® Core i3-6100E COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i3-6100E, PCH - CM236, LVDS (B1), VGA (B2) Auf die Vergleichsliste
    MB09-3020-2100-C1 COM-Express Type 6 Intel® Core i5-6442EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i5-6442EQ, PCH - QM170, eDP (B0), DP on DDI3 (B3) Auf die Vergleichsliste
    MB09-4020-2100-C1 COM-Express Type 6 Intel® Core i5-6440EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i5-6440EQ, PCH - QM170, eDP (B0), DP on DDI3 (B3) Auf die Vergleichsliste
    MB09-5010-2100-C1 COM-Express Type 6 Intel® Core i7-6822EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6822EQ, PCH - HM170, eDP (B0), DP on DDI3 (B3) Auf die Vergleichsliste
    MB09-6010-2000-C1 COM-Express Type 6 Intel® Core i7-6820EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6820EQ, PCH - HM170, eDP (B0), DP on DDI3 (B3) Auf die Vergleichsliste
    MB09-6020-2100-C1 COM-Express Type 6 Intel® Core i7-6820EQ COM Express Type 6 - COMe-B09-BT6 w/ Intel® Core i7-6820EQ, PCH - QM170, eDP (B0), DP on DDI3 (B3) Auf die Vergleichsliste
    MB09-7030-4100-C1 COM-Express Type 6 Intel® Xeon® E3-1505M V5 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Xeon® E3-1505M V5, PCH - CM236, LVDS (B1), VGA (B2) Auf die Vergleichsliste
    MB09-8030-2100-C1 COM-Express Type 6 Intel® Xeon® E3-1535M V5 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Xeon® E3-1535M V5,PCH - CM236, eDP (B0), DP on DDI3 (B3), TPM2.0 Auf die Vergleichsliste
    MB09-9030-4100-C1 COM-Express Type 6 Intel® Xeon® E3-1515M V5 COM Express Type 6 - COMe-B09-BT6 w/ Intel® Xeon® E3-1515M V5,PCH - CM236,LVDS (B1), VGA (B2), LINE GT4e (D0) OPCM (A0) Auf die Vergleichsliste
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