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    COMe-A81-CT6

    COM-Express™ Type 6 Compact based on the NVIDIA® Tegra® K1 Mobile Processor SoC

    • NVIDIA 4-Plus-1™ ARM® Cortex® –A15 up to 2.3GHz clock frequency
    • 4x USB 3.0; 8x USB 2.0; 4 PCI-e x1
    • Low-power NVIDIA Kepler™ -based GPU with 192 CUDA® cores
    • Up to 4GB DDR3L soldered onboard

      COMe-A81-CT6

    COMe-A81-CT6

    COMe-A98-CT6

    COMe-A98-CT6

    COMe-C08-BT6

    COMe-C08-BT6

    COMe-B09-BT6

    COMe-B09-BT6

     
    Entwicklungsstatus des Produkts
    Prozessor
    NVIDIA Tegra K1 Mobile Processor Quad-Core, 4-Plus-1™ ARM® Cortex® –A15 MPCore R3 processor

    AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
    AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
    AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
    AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

    AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W

    AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
    AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

    Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP)
    Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz in Turbo Boost),  with HT, 8MB Cache, 45W TDP
    Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP
    Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz in Turbo Boost), with HT, 12MB Cache, 45W TDP 

    Intel® Core™ i3-6102E, Dual Core @ 1.9GHz, 3MB Cache, 25W TDP
    Intel® Core™ i3-6100E, Dual Core @ 2.7GHz, 3MB Cache, 35W TDP
    Intel® Core™ i5-6442EQ, Quad Core @ 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP
    Intel® Core™ i5-6440EQ, Quad Core @ 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP
    Intel® Core™ i7-6822EQ, Quad Core @ 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP
    Intel® Core™ i7-6820EQ, Quad Core @ 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505M V5, Quad Core @ 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1515M V5, Quad Core @ 2.8 GHZ, 8MB Cache, 45W TDP (ECC supported), GT4E LINE (D0) with OPC (A0)
    ------------------------------------------------------------------------------------------------------------
    Intel® Core i3-7102E, Dual core @ 2.10 GHz (3M Cache,  2.10 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Core™ i3-7100E, Dual Core @ 2.9GHz, 3MB Cache, 35W TDP
    Intel® Core i5-7442EQ, Quad core @ 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC no supported)
    Intel® Core i5-7440EQ, Quad Core @ 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 45W TDP
    Intel® Core™ i7-7820EQ, Quad Core @ 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP
    Intel® Xeon® E3-1505L V6, Quad core @ 2.20 GHz (8M Cache, 2.20 GHz) FCBGA1440 CPU + GPU - 25W TDP (ECC supported)
    Intel® Xeon® E3-1505M V6, Quad Core @ 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP

    Chipsatz
    ...
    ...
    Intel® QM370, HM370 or CM246 PCH

    SkyLake Platform: Intel® QM170, HM170 or CM236 PCH
    Kabylake Platform: Intel® QM175 or CM238 PCH

    Max Cores
    4
    4
    6
    4
    Maximale Gewindelänge
    0
    0
    12
    8 (HT not available with 6th Generation Core™ i5 and 7th Generation Core™ i3/i5 Processors)
    Speicher
    Dual Channel Soldered Down DDR3L-1833 memory, up to 4GB

    R-Series: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 2133MHz
    G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
    G-Series SoC-J: One SO-DIMM slot supporting DDR4 non-ECC modules up to 2133MHz 

    Two DDR4 SO-DIMM Slots supporting DDR4-2666 Memory, up to 32GB
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 CPUs combined with CM246 PCH

    Up to two DDR4 SO-DIMM Slots supporting DDR4-2133 (DDR4-2400 for 7th Generation processors) Memory
    ECC DDR4 memory modules supported only with Xeon® and Core™ i3 processors combined with CM236 / CM238 PCH
    Grafik

    Low-power NVIDIA Kepler™ -based GeForce® graphics processor with 192 CUDA® cores
    Supports OpenGL® ES 3.0, OpenGL® 4.4, DirectX® 11.1, Tessellation, CUDA® 7
    Up to 2160p30 HW decoding
    Up to 2160p24 HW encoding

    AMD Radeon 3rd -Generation Graphics Core Next (GCN)
    AMD RX-421BD - Radeon R7
    AMD RX-418GD, RX-416GD - Radeon R6
    AMD-RX-216GD -  Radeon R5
    AMD GX-217GI - Radeon R6E
    AMD GX-224IJ - Radeon R4E
    AMD GX-215IJ - Radeon R2E
    Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
    DirectX® 12 supported
    UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported 

    Intel® Gen9 LP graphic core architecture, up to 48 Execution Units
    Up to 3 independent displays supported
    DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
    HW accelerated video decode MPEG2, VC1/WMV9,
    AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
    HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG
    HEVC/H.265, VP9

    Intel® HD Graphics 530 (6th Generation Core™ processors), P530 (6th Generation Xeon® processors)
    Intel® HD Graphics 630 (7th Generation Core™ processors), P630 (7th Generation Xeon® processors)
    Up to 3 independent displays supported
    DirectX® 12.1, OpenGL 4.4, and OpenCL 2.0 support
    HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9
    Videoschnittstellen

    eDP interface or native Single Channel 18 / 24 bit LVDS interface or Single / Dual Channel 18 / 24bit LVDS interface
    HDMI interface
    2 x MIPI CSI Camera interfaces

    Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
    Optional VGA interface (excludes one DDI Port)
    Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI, HDMI 1.4
    eDP or Single/Dual-Channel 18-/24-bit LVDS interface or LVDS + VGA interface

    Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.2, DVI and HDMI 1.4
    eDP or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface
    PCI-express Graphics (PEG) Gen3 x16

    Videoauflösung
    HDMIup to 4096 x 2160 (4K)
    eDPup to 3840 x 2160
    LVDSup to 1920 x 1200

    DDIs: up to 4K
    LVDS, VGA: up to 1920 x 1200 @ 60Hz 

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 24Hz, 24bpp (HDMI 1.4)
    LVDS, VGA: up to 1920x1200 @ 60Hz

    eDP, DP: up to 4096x2304 @ 60Hz, 24bpp
    HDMI: up to 4096x2160 @ 60Hz, 24bpp
    LVDS, VGA: up to 1920x1200 @ 60Hz

    Massenspeicher
    1 x external S-ATA Gen2 Channel
    Optional eMMC drive soldered onboard, up to 32GB
    SD Card interface (multiplexed with GPIO signals)
    2 x SATA Gen3 Channels
    SD interface shared with GPI/Os

     4 x S-ATA Gen3 Channels
    SD interface (shared with GPI/Os) 

    4 x S-ATA Gen3 Channels
    Networking

    Gigabit Ethernet interface
    Realtek RTL8111G Controller (MAC + PHY)

    Gigabit Ethernet interface
    Intel® I210 / I211 GbE Controller

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    Gigabit Ethernet interface
    Intel® I219-LM GbE Controller

    USB
    8 x USB 2.0 Host Ports
    4 x USB 3.0 Host Ports
    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.1 Gen2 Host ports
    8 x USB 2.0 Host ports

    4 x USB 3.0 Host ports
    8 x USB 2.0 Host ports
    PCI-e
    Up to 4 x PCI-e x1 lanes (factory options)

    3 x PCI-e x 1 lanes 
    PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)

    8 x PCI-e x 1 Gen3 lanes
    PCI-express Graphics (PEG) Gen3 x16

    8 x PCI-e x1 Gen3 lanes
    Audio
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    HD Audio Interface
    Serielle Anschlüsse
    2 x UARTS, TX/RX signals only, TTL interface
    2 x HS UARTs
    2 x UARTs
    2 x UARTs
    Andere Schnittstellen

    I2C Bus
    LPC Bus
    SM Bus
    4 x GPI, 4 x GPO
    SPI Interface
    Watch Dog Timer
    Real Time Clock (optional, additional Low Power RTC)
    Power Management Signals
    Thermal / Fan Management
    On-board FAN connector

    SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
    LID# / SLEEP# / PWRBTN#, Watchdog
    4 x GPI, 4 x GPO (multiplexed with SD interface)
    Optional TPM 1.2 or 2.0 module onboard 

    SPI, I2C, SM Bus, Thermal Management, FAN management
    LPC bus
    Optional TPM 2.0 on-board
    LID#/SLEEP#/PWRBTN#, Watchdog
    4 x GPI, 4 x GPO

    2 x SPI, I2C, SM Bus, LPC bus, 2 x Express Card, FAN management
    Optional TPM 1.2
    LID# / SLEEP# / PWRBTN#, Watchdog
    4x GPI, 4 x GPO

    Stromversorgung
    +12VDC and +5VSB (optional)
    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and + 5VSB (optional)

    +12VDC ± 10% and +5VSB (optional)
    Energieverbrauch
    ...
    ...
    ...
    ...
    Betriebssystem
    Linux for Tegra (L4T) provides flashing utilities, bootloader, Linux kernel, Tegra hardware acceleration libraries for graphics, multimedia and compute (EGL, OpenGL-ES, GLX, OpenGL), and a reference File System for evaluating Linux on the Tegra platform

    Microsoft® Windows 7
    Microsoft® Windows 10
    Microsoft® Windows 10 IoT
    Microsoft® Windows Embedded Standard 7
    Microsoft® Windows Embedded Standard 8
    Linux

    Microsoft® Windows 10 
    Linux

    Microsoft® Windows 7 (only for Skylake)
    Microsoft® Windows 8.1 (only for Skylake)
    Microsoft® Windows 10
    Linux
    Yocto

    Betriebstemperatur

    0°C ÷ +60 °C (commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)
    -40°C ÷ +85°C (Industrial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C  ÷ +60 °C (Commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    0°C ÷ +60°C (commercial version)
    -40°C / +70°C (Extended Temperature Range)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    95x95 mm (COM Express Compact, 3,74” x 3,74”)
    95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

    125 x 95 mm (Com Express™ Basic Form factor, Type 6 pinout)

    125 x 95 mm (COM Express Basic, 4.92” x 3,74”)

    Beschreibung

    Details

    The COMe-A81-CT6 features the most advanced and innovative SoC for unique mobile experiences in the COM Express Form Factor, ideal for applications in Visual Computing, Automotive and In-Vehicle Infotainment Systems. The board integrates 192 CUDA® cores and low-power NVIDIA Kepler™ graphics for extreme performance and powerful computing with extraordinary power efficiency. The NVIDIA TK1 is the first ARM SoC that fully complies with the COM Express Type 6 pinout with the best combination of performance and low power consumption while remaining highly cost-effective.
    Zusatzinformation

    Zusatzinformation

    Prozessor
    NVIDIA Tegra K1 Mobile Processor Quad-Core, 4-Plus-1™ ARM® Cortex® –A15 MPCore R3 processor
    Max Cores
    4
    Speicher
    Dual Channel Soldered Down DDR3L-1833 memory, up to 4GB
    Grafik

    Low-power NVIDIA Kepler™ -based GeForce® graphics processor with 192 CUDA® cores
    Supports OpenGL® ES 3.0, OpenGL® 4.4, DirectX® 11.1, Tessellation, CUDA® 7
    Up to 2160p30 HW decoding
    Up to 2160p24 HW encoding

    Videoschnittstellen

    eDP interface or native Single Channel 18 / 24 bit LVDS interface or Single / Dual Channel 18 / 24bit LVDS interface
    HDMI interface
    2 x MIPI CSI Camera interfaces

    Videoauflösung
    HDMIup to 4096 x 2160 (4K)
    eDPup to 3840 x 2160
    LVDSup to 1920 x 1200
    Massenspeicher
    1 x external S-ATA Gen2 Channel
    Optional eMMC drive soldered onboard, up to 32GB
    SD Card interface (multiplexed with GPIO signals)
    Networking

    Gigabit Ethernet interface
    Realtek RTL8111G Controller (MAC + PHY)

    USB
    8 x USB 2.0 Host Ports
    4 x USB 3.0 Host Ports
    PCI-e
    Up to 4 x PCI-e x1 lanes (factory options)
    Audio
    HD Audio Interface
    Serielle Anschlüsse
    2 x UARTS, TX/RX signals only, TTL interface
    Andere Schnittstellen

    I2C Bus
    LPC Bus
    SM Bus
    4 x GPI, 4 x GPO
    SPI Interface
    Watch Dog Timer
    Real Time Clock (optional, additional Low Power RTC)
    Power Management Signals
    Thermal / Fan Management
    On-board FAN connector

    Stromversorgung
    +12VDC and +5VSB (optional)
    Betriebssystem
    Linux for Tegra (L4T) provides flashing utilities, bootloader, Linux kernel, Tegra hardware acceleration libraries for graphics, multimedia and compute (EGL, OpenGL-ES, GLX, OpenGL), and a reference File System for evaluating Linux on the Tegra platform
    Betriebstemperatur

    0°C ÷ +60 °C (commercial version)

    *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

    Dimensionen
    95x95 mm (COM Express Compact, 3,74” x 3,74”)
    Software

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    Dokumente

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    COMe-A81-CT6

    COMe-A81-CT6
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    COM-Express™ Type 6 Compact based on the NVIDIA® Tegra® K1 Mobile Processor SoC
    Sku Artikelnummer Beschreibung Artikelnummer Konfiguration Artikelnummer Kaufen Sie Muster online Kontaktieren Sie uns Vergleich
    MA81-1330-1210-C0 COM-Express Type 6 Tegra K1 COM Express Type 6 - COMe-A81-CT6 w/ Tegra K1 - RAM DDR3L 2GB - eMMC 16GB - eDP - integrated RTC - PCIEX switch, 4 PCIEX conn COME - Comm. Temp. Auf die Vergleichsliste
    MA81-1330-1220-C0 COM-Express Type 6 Tegra K1 COM Express Type 6 - COMe-A81-CT6 w/ Tegra K1 - RAM DDR3L 2GB - eMMC 16GB - eDP - integrated RTC - no PCIEX switch, 1 PCIEX conn COME - Comm. Temp. Auf die Vergleichsliste

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