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Computer on Module with the AMD Embedded G-Series Platform

Additional Information

Processor AMD T56N, Dual Core @ 1.65 GHz, TDP 18W
AMD T40N, Dual Core @ 1.0 GHz, TDP 9W
AMD T44R, Single Core @ 1.2 GHz, TDP 9W
AMD T40E, Dual Core @ 1.0 GHz, TDP 6.4W
AMD T40R, Single Core @ 1.0 GHz, TDP 5.5W
AMD T16R, Single Core @615MHz, TDP 4.5W
Max Cores 2
Chipset AMD A55E Controller Hub
Memory Up to 4GB DDR3 / LVDDR3-1066 soldered onboard
Graphics integrated AMD GPU Radeon™:
HD6320 - AMD T56N
HD6290 - AMD T40N
HD6250 - AMD T44R, T40E, T40R and T16R
Dual display support
DirectX® 11, OpenGL 4.0, OpenCL™ 1.1 supported
Video Interfaces

Single/Dual Channel 18/24 Bit LVDS Interface
HDMI interface or DP interface
Additional VGA Interface

Video Resolution LVDS Interface, up to 1920x1200
HDMI, up to 1920x1200
DP, up to 2560 x 1600
VGA, up to 1920x1200 (up to 2048x1536 with T56N)
Mass Storage 2 x external S-ATA channels
SATA Flash Disk soldered onboard, up to 32GB
SD Memory Card interface
Networking Gigabit Ethernet port
USB 8x USB 2.0 ports
PCI-e 4 x PCI Express x1 ports (groupable up to 1 x PCI-e x4)
2 x Express Card Interface
Audio HD Audio Interface
Other Interfaces

I2C Bus
LPC BUS for legacy peripherals
Thermal / FAN management

Power Supply

+5VDC ± 5% and +5VSB (optional)

Operating System Microsoft® Windows® XP (32/64 bit)
Microsoft® Windows® 7 (32/64 bit)
Microsoft® Windows® 8 (32/64 bit)
Microsoft® Windows® Embedded Standard 7 (32/64 bit)
Microsoft® Windows® Embedded Standard 2009 (32/64 bit)
Linux (32/64 bit)
Operating Temperature

0°C ÷ +60°C (commercial version)


*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.

Dimensions 70x70 mm (2.76” x 2.76”)

QuadMo747-GSeries is a Qseven® Rel. 1.20 Compliant Module designed by SECO, based on the brand new Accelerated Processing Unit (APU) made by AMD, integrating in a single chip a low power (single or Dual core) CPU along with a middle level GPU, AMD RADEON™ HD6320/HD6290/HD6250, able to drive up to two independent monitors using the native LVDS / HDMI or VGA interfaces.

The Fusion realised in AMD APU itself represents an excellent solution for powerful low power modules, able to offer:
   • DirectX®11 support;
   • Advanced discrete-level GPU with OpenGL 4.0 and OpenCL™ 1.1 support;
   • Unprecedented graphics performance/watt thru advanced graphics and hardware    acceleration (delivering over 3X performance per watt of previous generation).

In addition, the Companion Controller Hub AMD A55E, with its 4x PCI Express ports x1, 2 x SATA channels, SD Memory Card interface and 8 x USB ports, complete the features of this versatile module.

P/N Description Configuration
Q888-ELAA-AAAA-C1 Qseven AMD "T40E" AMD "T40E", DDR3 4GB
Q888-EHAA-AAAA-C1 Qseven AMD DC T40E AMD DC T40E @1,0GHz (TDP 6.4W) - DDR3 2GB - Comm. Temp.
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  • B901

    The boxed solution B901 supports the CQ7-901 carrier board on Pico-ITX Form Factor and the following module:

    • Q7-928

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See also

  • Q7-A29

    Qseven® standard module with the 1st and 2nd Generation (“eKabini” and “Steppe Eagle”) AMD Embedded G-Series SOCs

view more

SECO s.r.l Via Calamandrei, 91, 52100 Arezzo Italy - Phone +39 0575 26979 - Fax: +39 0575 350210 - P.IVA 00325250512
Reg. Imprese n. 4196 Arezzo - REA n. 70645 - Meccanografico AR007079

Images are for illustrative purposes only. Actual product may differ
- ©SECO 2014, All rights reserved.


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