Texas Instruments® OMAP™ 37xx Family:
AM3703 (Cortex™ A8 up to 1 GHz core)
DM3730 (Cortex™ A8, up to 1GHz core + PowerVR
SGX™ Graphics Accelerator + Up to 800MHz
TMS320C64x+™ DSP Core
||Mobile DDR 128 / 256MB / 512 MB onboard
||LVDS Single/Dual Channel 18/24 Bit
||LVDS, up to 1366 x 768
||256 MB / 512MB / 1GB NAND Flash
eMMC soldered onboard up to 16GB
||10/100 Base-T interface
||1x USB OTG
2x USB 2.0 Host
||AC’97 Audio Interface
||2 x COM ports
MMC/HC MMC/SD/SDHC/SDIO interface
Video Input Port / Camera Connector
||Microsoft® Windows® CE 6.0
0°C ÷ +70°C (commercial version)
-40°C ÷ +85°C (industrial version)
*Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
||70x70 mm (2.76” x 2.76”)
The Q7-796 is a Qseven® Spec. Rel. 1.20 Compliant Module designed by SECO, which represents the best solution for development of scalable ARM solutions, offering different level of performance and ultra-low power consumption demanding applications.
The board integrates the OMAP™ 37xx platform of Texas Instruments®, an application Processor integrating a Cortex™ A8 core. The processor is available in different versions, in order to meet all kind of customers needing.