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Modular HMI & Boxed Solutions

  • SYS-A62-10_front


    Embedded Panel with 10.1” LCD display based on the Multicore NXP i.MX6 SoC family
    Solo, Dual Lite and Quad- Core (ARM® Cortex® A9 Cores)
    0°C ÷ 50°C
  • SYS-B08-7 front


    Embedded Panel with 7” LCD display based on the NXP i.MX 6SoloX Processor
    NXP i.MX6SX SoloX Processor, Single core Cortex®-A9 @1GHz + Cortex®-M4 core @ 200MHz
    0°C ÷ +60 °C (Commercial temp.)
  • SYS-A90-IPC


    Boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon)

    AMD Embedded 3rd generation R-Series SOC or G-Series SOC-I

    0°C ÷ +60 °C (Commercial temp.)
  • B901


    The boxed solution B901 supports the carrier board on Pico-ITX Form Factor

SECO S.p.A. Via Calamandrei, 91, 52100 Arezzo Italy - Phone +39 0575 26979 - Fax: +39 0575 350210 - P.IVA 00325250512
Reg. Imprese n. 4196 Arezzo - REA n. 70645 - Meccanografico AR007079

Images are for illustrative purposes only. Actual product may differ
- ©SECO 2014, All rights reserved.


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