Qseven

Qseven® Compact & Cost Efficient
The Qseven® standard has proven itself to be the most compact &
cost efficient Computer On Module on the embedded market.
The design flexibility of the architecture is the same as the other
COMs like ETX®, XTX™ or COM Express™: by replacing the board it
becomes possible to diversify the product range through the use of
different architectures. The Qseven® standard features PCI Express®,
ExpressCard®, Serial ATA®, Secure Digital I/O interface, DisplayPort™
(or TMDS or SDVO) interfaces, USB 2.0, High Definition Digital Audio,
LPC interface, Gigabit Ethernet, LVDS Display interface. All the signals
arrive to the carrier through a 230 pin MXM connector.
SECO provides complete system solutions for Qseven®.

Qseven® Standard

Benefits:
FAST Development
Flexibility
Innovative and Upgradable
Easy Cabling


 

SECO is one of the founding members of SGET.

 

 



Qseven® Features Overview

The Qseven® mandatory and optional features. The table shows the minimum and maximum required configuration
of the feature set.

Qseven® Supported Features
 

 



Qseven® STANDARD Rev. 2.0 specification

 

Mechanic and Cooling
Compact size
• Quadratic 7 cm (~2,76” x ~2,76”)
• Rev. 2.0 allows for a microQseven Size 4 x 7 cm (~2,76” x 1,57”)
• Solid mechanical mounting
• Cost efficient card edge connector
• Rugged 1.2 mm PCB thickness
Cooling interface
• Top edge defined for heat transfer
• Heat transfer from CPU, Chipset and DRAM enhanced via copper layers
• Heatspreader defined for high power versions (max. 12 W)

 

MXM Connector
MXM2 edge connector
• Multiple Sources Speedtech, Lotes, Aces and Yamaichi (automotive certified)
• 230 positions, .020” pitch, SMT
• 5.5 and 7.8 mm height versions
• Certified for rugged mobile applications and for high speed serial buses (PEG bus)
• Low cost connector
• 30μ gold plated versions for industrial applications

 



 


 

 

Changes for Rev. 2.0 (Sep. 2012)

Signals Added to Qseven Pinout
• 2x USB 3.0 shared with 4 x USB 2.0 ports
• GPIO interface alternative to LPC bus
• I2S interface shared with HDA and AC’97
• UART Interface
• eDP (embedded Display Port) shared with LVDS
• Additional I2C Bus shared with SM Bus
• One-Wire-signal

Updates
• MXM Connectors from Yamaichi (Automotive
specified), Foxconn, Aces
• Removed SDVO interface support
• Removed Express Card Support

 

 



The Computer-On-Module approach

Each time a new product must be placed on the market, it becomes necessary to spend a lot of time in the development and successive validation phases.

 

Therefore, any solution that allows reducing time, or recycling any of the work already done, is particularly appreciated in a world where the time-to-market requirement is getting shorter by the day. For this purpose, the modular approach represented by Computer-On-Module solutions, like Qseven® and COM Express™ modules, becomes an optimal solution, which can ensure compatibility, long term availability and scalability.


The availability of standard interfaces allows the customers to focus only on designing the carrier board, which can be perfectly tailored to the design requirements, and taking into consideration possible future evolutions.

The scalability offered by a modular approach allows, taking advantage of standard off-the-shelf modules, choosing the one that best fits the project requirements, and focusing all development resources on design-specific interfaces.
In this way, possible problems due to obsolescence of the devices are reduced to a minimum: it will be possible at any time to replace the COM module with one of higher performance or even of a newer generation, while maintaining compatibility and therefore reducing validation time and cost.


By making all the interfaces available through only a few pins, COM solutions allow a significant reduction of complexity and effort required for the development of the customer’s specific application interfaces: in most cases, only the routing of the interface buses to application-dedicated connectors is required, whether standard or not. Furthermore the software development can be optimized with this kind of approach: the manufacturer of the module provides the necessary drivers for the module, and also the support (via BIOS or BSP) of the standard peripherals contained on the reference carrier board. The customer can therefore focus on the development of the application software, relying on the continuity of support for the hardware layer.

Last but not least, the use of off-the-shelf standard modules combined with custom carrier boards can help in reducing global costs, even for low-volume mass production. In these cases, due to the low volume of production, it would be not possible to obtain low prices on the most expensive components, like the processor, the memory chips and so on. By using standard modules, instead, it is possible to reduce the impact of these devices on the final cost of the assembled system.
 

 



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