News

SECO at Computex 2018
Mon, 05/14/2018 - 09:00

SECO will showcase a comprehensive range of products at Nangang Exhibition Hall 1, booth No K0102, focused around SECO's cross-platform philosophy and its modular solutions with embedded system form factor standards (Qseven®, COM Express™, SMARC).

SECO at Intel Partner Connect
Fri, 05/11/2018 - 16:45

On 14-17 May 2018, SECO will take part to Intel® Partner Connect, an invite-only, premier-partner event by Intel® to be held at the Prague Congress Center in Prague, Czech Republic.

Wed, 05/09/2018 - 09:30
Tue, 05/08/2018 - 09:15

SECO participates in the Open Day of the Arezzo University Pole together with other companies of excellence in the IT and high tech sectors of the territory

Fri, 04/20/2018 - 07:15
Milan, 20th April 2018 – FII Tech Growth, a fund managed by Fondo Italiano d’Investimento SGR, announces today its second investment in SECO SpA, one of the European leaders in the embedded electronics market. SECO, headquartered in Arezzo, Tuscany, with subsidiaries in the U.S.A., Germany and Taiwan, was founded in 1979 by entrepreneurs Daniele Conti and Luciano Secciani. 
Wind River Partner Program
Thu, 04/19/2018 - 14:15

By combining almost a century of expertise, know-how and technology of SECO and Wind River, it is now possible to offer complete solutions to the end customer, from the sensor to cloud applications, across the entire IoT landscape.

Tue, 04/03/2018 - 10:15

On the occasion of the ESC Boston 2018 SECO will present for the first time its COM Express ™ Type VI based on Intel® 8th generation Core ™ / Xeon® processors (formerly known as Coffee Lake H)

COMe-C08-BT6
Tue, 04/03/2018 - 09:30

COMe-C08-BT6 enables the Intel® 8th Generation Core™ i7/i5/Xeon® Processors (formerly Coffee Lake H), reaching up to 12 threads. COMe-C08-BT6, a COM Express™ 3.0 Basic Type 6 Module, is an extraordinary platform as regards performance: with up to six cores at up to 4.7 GHz - not to mention the Intel® Hyper-Threading Technology, that adds 12 virtual cores on top of that – this module can handle anything you throw at it.

Fri, 02/23/2018 - 12:45

Among the solutions that SECO is going to present, the SYS-A90-IPC stands out as a boxed solution based on the AMD Embedded 3rd generation R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon). 

Fri, 02/23/2018 - 12:30

The SM-B71, among the products that SECO is going to present, deserves particular attention due to its unique architecture: it is a SMARC Rel. 2.0 compliant module with the Xilinx® Zynq® Ultrascale+™ MPSoC – in other words, a combination of ARM and FPGA heterogeneous processing in a standard form factor. 

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SECO S.p.A. Via Calamandrei, 91, 52100 Arezzo Italy - Phone +39 0575 26979 - Fax: +39 0575 350210 - P.IVA 00325250512
Reg. Imprese n. 4196 Arezzo - REA n. 70645 - Meccanografico AR007079


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