SECOMExp-GSeries
COM-Express™ Module with with new AMD Embedded G-Series Platform
COMING SOON
SECOMExp-iCORE
COM-Express™ Module with Intel® Core™ i3 / i5 / i7 / Celeron® Processor and Intel® HM55 Express Chipset with Dual Channel Memory
SECOMExp-iCORE-E4690
COM Express™ Module DVI Extension with Intel® Core™ i7 or Celeron® Processor, Intel® HM55 Express chipset and AMD Radeon™ Graphics E4690 Discrete GPU on board.
COMING SOON
SECOMExp-iCORE-XT
Extended temperature COM-Express™ Module with Intel® Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory
SECOMExp-ION
COM-Express™ Module with Intel® Atom® N270 or Celeron® T3100 Dual Core CPU and NVIDIA® ION Chipset with Dual Channel Memory
SECOMExp-x2000
COM Express™ Module with Intel® Atom™ Cedar View family processors and Intel® NM10 Express chipset.
COMING SOON
OTHER PRODUCTS:
SECOMExp-iCORE-XT
Extended temperature COM-Express™ Module with Intel® Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory
Extended temperature COM-Express™ Module with Intel® Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory
SECOMExp-ION
COM-Express™ Module with Intel® Atom® N270 or Celeron® T3100 Dual Core CPU and NVIDIA® ION Chipset with Dual Channel Memory
COM-Express™ Module with Intel® Atom® N270 or Celeron® T3100 Dual Core CPU and NVIDIA® ION Chipset with Dual Channel Memory
COM MODULES
Seco Com Modules are highly innovative. Flexibility and high speed are guarantee.
The major fields of application are industry, including automation and monitoring tools, medical, telecommunication, retail industry and gaming machines.
Com Modules are designed to accomodate next generations of interfaces.
Moreover Com Modules are very flexible in design: you can design a product with different CPU models using the same carrier board and mechanics, and then upgrade can be easily reached simply changing the CPU module.
The major fields of application are industry, including automation and monitoring tools, medical, telecommunication, retail industry and gaming machines.
Com Modules are designed to accomodate next generations of interfaces.
Moreover Com Modules are very flexible in design: you can design a product with different CPU models using the same carrier board and mechanics, and then upgrade can be easily reached simply changing the CPU module.
COM Express
Com (Computer on Module) Express is a standard form factor introduced in year 2005 by PICMG. This standard is an answer to the market request for more flexibility and the adoption of the latest technology improvements available from CPUs and Chipsets.
The COM Express module is available in 2 formats: the Basic Form Factor, with dimension of 125 x 95 mm, which is suited for highly power sensitive, small devices, and the Extended Form Factor, with dimension of 155 x 110 mm, which is a good choice for applications where performance (most of all the graphic) is more important than low power dissipation.
COM Express is also designed to accomodate next generations pf PCI Express (5GHz) and Serial ATA (300 Mbps) intefaces, doubling the data rates of actual generation. This is a feature that will surely establish this form factor and enables an easy technology update to the final applications.
Furthermore the design flexibility is the same as for the ETX CPU Modules, since it's a COMsolution: it's possible to design a product with different CPUs using the same carrier board and mechanics and the product upgrade is simply reached through a CPU module change and as a result time-to-market is shortened.
The COM Express module is available in 2 formats: the Basic Form Factor, with dimension of 125 x 95 mm, which is suited for highly power sensitive, small devices, and the Extended Form Factor, with dimension of 155 x 110 mm, which is a good choice for applications where performance (most of all the graphic) is more important than low power dissipation.
COM Express is also designed to accomodate next generations pf PCI Express (5GHz) and Serial ATA (300 Mbps) intefaces, doubling the data rates of actual generation. This is a feature that will surely establish this form factor and enables an easy technology update to the final applications.
Furthermore the design flexibility is the same as for the ETX CPU Modules, since it's a COMsolution: it's possible to design a product with different CPUs using the same carrier board and mechanics and the product upgrade is simply reached through a CPU module change and as a result time-to-market is shortened.
21/03/2013
SECO® UNVEILS NEW ENERGY-EFFICIENT CUDA ARM® DEVELOPMENT KIT: SECO MITX GPU DEVKIT (KAYLA PLATFORM)
San Jose (California), GPU Technology Conference 2013, 18th - 21 th March, 2013
During the NVIDIA GPU Technology Conference 2013, SECO unveiled in a first-ever preview of its latest energy-efficient DevKit – powered by the NVIDIA® Tegra® 3-based Qseven module on a Mini ITX form factor carrier board – the SECO mITX GPU DevKit (Kayla Platform).
San Jose (California), GPU Technology Conference 2013, 18th - 21 th March, 2013
During the NVIDIA GPU Technology Conference 2013, SECO unveiled in a first-ever preview of its latest energy-efficient DevKit – powered by the NVIDIA® Tegra® 3-based Qseven module on a Mini ITX form factor carrier board – the SECO mITX GPU DevKit (Kayla Platform).
18/03/2013
SECO PRODUCTS ON NEW ELECTRONICA EXHIBITION-2013 ON NEXT WEEK IN MOSCOW
SECO products will be showed on next week during biggest Russian exhibition for electronics components and modules – The New Electronica Exhibition!
SECO products will be showed on next week during biggest Russian exhibition for electronics components and modules – The New Electronica Exhibition!
15/03/2013
SECOMEXP-RSERIES: COM-EXPRESS TYPE 6 MODULE WITH AMD EMBEDDED R-SERIES PLATFORM
SECO announced the SECOMExp-Rseries, a COM-Express™ TYPE 6 (basic module) based on the brand new Accelerated Processing Unit (APU) made by AMD.
SECO announced the SECOMExp-Rseries, a COM-Express™ TYPE 6 (basic module) based on the brand new Accelerated Processing Unit (APU) made by AMD.
15/03/2013
SECO UNVEILED SECOPITX-X2000, A SINGLE BOARD COMPUTER WITH INTEL® ATOM™ CEDAR VIEW FAMILY PROCESSORS AND INTEL® NM10 EXPRESS CHIPSET ON PICOITX FORM FACTOR
SECO announced the launch of the SECOpITX-x2000, a Single Board Computer in pico-ITX form factor (just 100 x 72mm), based on the newest Intel® Atom™ family of CPUs, N2000 and D2000, a series of Dual Core CPUs with Hyper Threading capabilities and 64-bit instruction set.
SECO announced the launch of the SECOpITX-x2000, a Single Board Computer in pico-ITX form factor (just 100 x 72mm), based on the newest Intel® Atom™ family of CPUs, N2000 and D2000, a series of Dual Core CPUs with Hyper Threading capabilities and 64-bit instruction set.
15/03/2013
SECO ANNOUNCED THE QUADMO747-X2000 – THE FIRST QSEVEN® REL. 2.0 COMPLIANT MODULE WITH INTEL® ATOM™ CEDAR VIEW FAMILY PROCESSORS AND INTEL® NM10 EXPRESS CHIPSET
During the Embedded World Exhibition & Conference, SECO unveiled the QuadMo747-x2000, based on the newest Intel® Atom™ family, N2000 and D2000, a series of Dual Core CPUs with Hyper Threading capability and 64-bit instruction set.
During the Embedded World Exhibition & Conference, SECO unveiled the QuadMo747-x2000, based on the newest Intel® Atom™ family, N2000 and D2000, a series of Dual Core CPUs with Hyper Threading capability and 64-bit instruction set.
15/03/2013
SECO ANNOUNCED THE µQ7-T30, A µQSEVEN REL. 2.0 COMPLIANT MODULE WITH NVIDIA® TEGRA®T30 PROCESSOR
During the Embedded World Exhibition & Conference, SECO announced the uQ7- T30, a uQseven module based on the Tegra® 3 SoC, for an energy-efficient and cost effective solution in only 7x4 cm (2.76”x1.57”).
During the Embedded World Exhibition & Conference, SECO announced the uQ7- T30, a uQseven module based on the Tegra® 3 SoC, for an energy-efficient and cost effective solution in only 7x4 cm (2.76”x1.57”).
15/03/2013
SECO UNVEILED μQ7-I.MX6, A μQSEVEN REL. 2.0 COMPLIANT MODULE WITH FREESCALE™ I.MX6 PROCESSOR
During the Embedded World Exhibition & Conference, SECO announced the uQ7-i.MX6, a uQseven Rel. 2.0 Compliant Module that offers top computational and graphical performance delivered by a low-power CPU.
During the Embedded World Exhibition & Conference, SECO announced the uQ7-i.MX6, a uQseven Rel. 2.0 Compliant Module that offers top computational and graphical performance delivered by a low-power CPU.
15/03/2013
SECO UNVEILED SECOμSBC-T30, A SINGLE BOARD COMPUTER WITH NVIDIA® TEGRA® T30 PROCESSOR
During the Embedded World Exhibition & Conference, SECO announced the SECOuSBC-T30, a Single Board Computer (only 86 x 67 mm) based on Tegra T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
During the Embedded World Exhibition & Conference, SECO announced the SECOuSBC-T30, a Single Board Computer (only 86 x 67 mm) based on Tegra T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.
15/03/2013
SECO UNVEILED SECOμSBC-I.MX6, A SINGLE BOARD COMPUTER WITH FREESCALE™ I.MX6 PROCESSOR
During the Embedded World Exhibition & Conference, SECO unveiled SECOuSBC-i.MX6 (a Single Board Computer (only 86 x 67 mm) based on i.MX6 Multimedia Applications platform from Freescale).
During the Embedded World Exhibition & Conference, SECO unveiled SECOuSBC-i.MX6 (a Single Board Computer (only 86 x 67 mm) based on i.MX6 Multimedia Applications platform from Freescale).
16/01/2013
AVNET EMBEDDED EMEA AND SECO SIGN PAN-EUROPEAN DISTRIBUTION AGREEMENT
Avnet Embedded EMEA announced the extension of its portfolio with embedded electronics from SECO, a manufacturer of computer-on-modules, single-board computers, carrier boards and peripheral boards. This new distribution agreement covers the entire EMEA region.
Avnet Embedded EMEA announced the extension of its portfolio with embedded electronics from SECO, a manufacturer of computer-on-modules, single-board computers, carrier boards and peripheral boards. This new distribution agreement covers the entire EMEA region.
13/11/2012
SECO UNVEILS ITS FIRST MICRO QSEVEN® MODULE BASED ON TI’S DUAL-CORE OMAP™ 5 PROCESSOR
SECO® presents its first micro Qseven® module based on the OMAP™ 5 processor from Texas Instruments Incorporated (TI).
SECO® presents its first micro Qseven® module based on the OMAP™ 5 processor from Texas Instruments Incorporated (TI).
12/11/2012
SECO ANNOUNCES MASS PRODUCTION OF ITS QSEVEN® MODULE BASED ON THE LATEST FREESCALE I.MX6
SECO announces that its Qseven® module based on Freescale i.MX6 series processor on ARM® Cortex A9 multicore, QuadMo747-X/i.MX6, is ready for the mass production.
SECO announces that its Qseven® module based on Freescale i.MX6 series processor on ARM® Cortex A9 multicore, QuadMo747-X/i.MX6, is ready for the mass production.
21/09/2012
QSEVEN® SPECIFICATION REVISION 2.0
Today, the Qseven Consortium has approved unanimously the Qseven Rev. 2.0 Specification, whose main purpose is the ARM Integration. Among the changes from Rev. 1.20 to Rev. 2.0, the most important is Qseven Halfsize Mechanical Outline.
Today, the Qseven Consortium has approved unanimously the Qseven Rev. 2.0 Specification, whose main purpose is the ARM Integration. Among the changes from Rev. 1.20 to Rev. 2.0, the most important is Qseven Halfsize Mechanical Outline.
12/06/2012
SECO AT FTF AMERICAS, JUNE 18-21 SAN ANTONIO, TX
SECO is sponsor at FTF America, June 18-21 in San Antonio, Texas
SECO is sponsor at FTF America, June 18-21 in San Antonio, Texas
24/04/2012
SECO AT GTC PREVIEWS THE CARMA DEVKIT
At the GTC (GPU Technology Conference) SECO presents in a first-ever preview the CARMA DevKit: Energy-Efficient HPC on ARM
At the GTC (GPU Technology Conference) SECO presents in a first-ever preview the CARMA DevKit: Energy-Efficient HPC on ARM
17/04/2012
AMD PRESENTS SECO G-SERIES PRODUCTS AT DESIGN WEST 2012
AMD had a variety of boards on display at DESIGN West 2012 based on their Embedded G-Series platform, which combines a low-power CPU with a discrete-level GPU, making it ideal for HD streaming and video games.
AMD had a variety of boards on display at DESIGN West 2012 based on their Embedded G-Series platform, which combines a low-power CPU with a discrete-level GPU, making it ideal for HD streaming and video games.
28/02/2012
THE NEW STANDARDIZATION GROUP FOR EMBEDDED TECHNOLOGIES (SGET) IS ON ITS WAY
The new Standardization Group for Embedded Technologies (SGET) is on its way
The new Standardization Group for Embedded Technologies (SGET) is on its way
18/11/2011
AS NVIDIA PARTNER, SECO IS THE OFFICIAL HARDWARE DEVELOPER OF THE NEWEST DEVELOPMENT KIT TEGRA ARM + GPU
Nvidia has said it plans to develop a hardware and software development kit which will feature a quad-core Nvidia Tegra 3 ARM CPU accelerated by a discrete Nvidia GPU.
The kit's hardware will be developed by SECO and is expected to be available in the first half of 2012. Nvidia says it will support the hardware with its own proprietary CUDA parallel programming toolkit.
Nvidia has said it plans to develop a hardware and software development kit which will feature a quad-core Nvidia Tegra 3 ARM CPU accelerated by a discrete Nvidia GPU.
The kit's hardware will be developed by SECO and is expected to be available in the first half of 2012. Nvidia says it will support the hardware with its own proprietary CUDA parallel programming toolkit.
