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SECOMEXP-iCORE-XT

Extended temperature COM-Express™ Module with Intel® Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory

Main Features

EXTENDED TEMPERATURE RANGE, -40°C ÷ +85°C
CPU Intel® Core™ i7-660UE @ 1GHz, 4MB Cache
Chipset Intel® HM55 Express Chipset
Memory 1066MHz DDR3 selected modules on two SO-DIMMs, supporting dual channel
FSB 100MHz
Graphic interface

integrated Intel® HD graphics controller with dual independent display support

Video Outputs Single/Dual Channel 18/24 bit LVDS interface DVI/HDMI/DisplayPort interface, multiplexed with PEG x16 interface CRT interface
Resolutions

Up to 2048 x 1536 on CRT Up to 2560 x 1600 with DisplayPort Up to 1920x1200 using HDMI/DVI

Mass Storage 1 x P-ATA Channel 4 x S-ATA Channels
USB 8 x USB 2.0 ports
PCI-e ports 4x PCI Express x1 lanes
Ethernet Gigabit Ethernet port
Audio HD Audio Interface
Interface Bus

PCI Bus LPC Bus for legacy peripherals SM Bus

Power Supply +12VDC and +5VSB(optional)
Dimensions 125x95 mm (COM Express Basic)

 

SECOMEXP-iCORE-XT

 

SECOMExp-iCORE-XT is a basic form factor, type 2 COM-Express™ module designed by SECO, also compliant to latest COM Express™ Extension specifications, based on the Intel® Core™ i7-660UE CPU and high performance Intel® HM55 Express Chipset, integrating HDMI, DVI and Display Port support, with usage of DDR3 Memories with Speed up to 1066MHz. With the reduction of the FSB of the CPU to a fixed frequency of 100MHz, the adoption of industrial temperature range components (except for CPU and Chipset), and the use of adequate heatsinks for higher temperatures, this board can offer the performance(*) of Intel iCore CPU in harsher environments, requiring extended temperature range.

secomexp_icore_xt_datasheet_rel_1_0.pdf

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17/04/2012 AMD PRESENTS SECO G-SERIES PRODUCTS AT DESIGN WEST 2012
AMD had a variety of boards on display at DESIGN West 2012 based on their Embedded G-Series platform, which combines a low-power CPU with a discrete-level GPU, making it ideal for HD streaming and video games.
02/04/2012 MCLAREN ELECTRONIC SYSTEMS SELECTED SECO I.MX51
McLAREN ELECTRONIC SYSTEMS SELECTED SECO i.MX51
26/03/2012 GIANLUCA VENERE INTERVIEW DURING THE EMBEDDED WORLD 2012
In this interview Gianluca Venere explains why SECO is fully committed to Qseven technology and he introduces the Nvidia Carma platform, which is based on ARM Cortex-A9 quad core and a multicore GPU. SECO also unveiled its first Qseven module with Freescale i.MX 6 series technology processor and a new module based on TI OMAP4. Moreover SECO improved the Qseven road map also for the x86 world with the new Qseven based AMD G series APUs.
28/02/2012 THE NEW STANDARDIZATION GROUP FOR EMBEDDED TECHNOLOGIES (SGET) IS ON ITS WAY
The new Standardization Group for Embedded Technologies (SGET) is on its way
03/01/2012 SECO AT ICE - LONDON, 24-26 JANUARY 2012
SECO will be at ICE Totally Gaming 2012, the most international and complete gaming exhibition. Come and visit SECO on stand #4281 at ICE, Earls Court - London - 24- 26 january 2012
18/11/2011 AS NVIDIA PARTNER, SECO IS THE OFFICIAL HARDWARE DEVELOPER OF THE NEWEST DEVELOPMENT KIT TEGRA ARM + GPU
Nvidia has said it plans to develop a hardware and software development kit which will feature a quad-core Nvidia Tegra 3 ARM CPU accelerated by a discrete Nvidia GPU.

The kit's hardware will be developed by SECO and is expected to be available in the first half of 2012. Nvidia says it will support the hardware with its own proprietary CUDA parallel programming toolkit.
20/10/2011 SECO ON CAN NEWSLETTER
SECO on CAN Newsletter
19/05/2012 SECO TECHNOLOGY IN ONE OF THE ROBOT AT ROBOTEX
SECO with its SECOn-ITX-ION sponsorized the Tallinn University of Technology Robotics Club NPO, Estonia.