SECOCQ7-MXM

The only Carrier Board in the market able to join Qseven® CPU modules and MXM Graphic cards.

Optimised for use with QuadMo747-X/T30

Main Features

The Qseven® Carrier Board SECOCQ7-MXM is the only Carrier Board available in the market able to expand the capabilities offered by Qseven® CPU modules with advanced graphical performances given by MXM Graphic cards.

SECOCQ7-MXM Specifics:

Able to accept MXM 3.0 compliant Graphic Cards, both Type “A” and Type “B”. It has Triple HDMI interface, one coming out from Qseven® CPU module, the other derived by Display Ports #A and #C of MXM Graphic Card, plus LVDS interface, carried out from Qseven® CPU module.
Optimised for use with Quadmo747-X/T30 SECO Qseven® module, based on NVIDIA® Tegra® T30, Quad ARM® Cortex –A9MPcore™ CPU, 1.3GHz per core
SATA, Dual Gigabit Ethernet, microSD slot
AC’97 or HD Audio Codec onboard
Also suitable for heavy computational tasks, using graphic cores of MXM Graphic cards for parallel computational tasks, other than graphical.

Supported Modules	Qseven® Modules offering HDMI and PCI Express x4/x 1 interfaces MXM 3.0 compliant Graphic cards, both Type "A" and Type "B"
Mass Storage	1 x S-ATA connector μSD Card Slot
PCI-e x4 link between Qseven® and MXM3.0 modules
Video	HDMI connection from Qseven® module Dual HDMI connection derived from Display Ports #A and #C of MXM Graphic Cards LVDS connection from Qseven® module
Ethernet	1 Ethernet port directly managed by Qseven® CPU module 1 x Gigabit Ethernet controller embedded on the Carrier Board
USB	2 USB 2.0 standard ports Internal Pin Header for 2 additional USB2.0 ports 1 USB On-The Go port
Audio	Embedded AC'97 or HD Audio Codec
CMOS Battery	On Board Lithium Battery for CMOS Backup and RTC
Power supply	19VDC Power Input
Temperature	Operating: 0°C ÷ +60 °C
Dimensions	200 x 140 mm (7.87" x 5.51")

Compliant to Qseven^® Rel.1.20 specifications

SECO is founding member of Qseven^® Consortium

More information about this product and reserved material (Application Notes, FAQ, BSP), can be found on our site http://www.secoqseven.com

secocq7_mxm_datasheet_rel_2_0.pdf

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secocq7_mxm_manual_rel_2_0.pdf *

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21/03/2013 SECO® UNVEILS NEW ENERGY-EFFICIENT CUDA ARM® DEVELOPMENT KIT: SECO MITX GPU DEVKIT (KAYLA PLATFORM)
San Jose (California), GPU Technology Conference 2013, 18th - 21 th March, 2013

During the NVIDIA GPU Technology Conference 2013, SECO unveiled in a first-ever preview of its latest energy-efficient DevKit – powered by the NVIDIA® Tegra® 3-based Qseven module on a Mini ITX form factor carrier board – the SECO mITX GPU DevKit (Kayla Platform).

18/03/2013 SECO PRODUCTS ON NEW ELECTRONICA EXHIBITION-2013 ON NEXT WEEK IN MOSCOW
SECO products will be showed on next week during biggest Russian exhibition for electronics components and modules – The New Electronica Exhibition!

15/03/2013 SECOMEXP-RSERIES: COM-EXPRESS TYPE 6 MODULE WITH AMD EMBEDDED R-SERIES PLATFORM
SECO announced the SECOMExp-Rseries, a COM-Express™ TYPE 6 (basic module) based on the brand new Accelerated Processing Unit (APU) made by AMD.

15/03/2013 SECO UNVEILED SECOPITX-X2000, A SINGLE BOARD COMPUTER WITH INTEL® ATOM™ CEDAR VIEW FAMILY PROCESSORS AND INTEL® NM10 EXPRESS CHIPSET ON PICOITX FORM FACTOR
SECO announced the launch of the SECOpITX-x2000, a Single Board Computer in pico-ITX form factor (just 100 x 72mm), based on the newest Intel® Atom™ family of CPUs, N2000 and D2000, a series of Dual Core CPUs with Hyper Threading capabilities and 64-bit instruction set.

15/03/2013 SECO ANNOUNCED THE QUADMO747-X2000 – THE FIRST QSEVEN® REL. 2.0 COMPLIANT MODULE WITH INTEL® ATOM™ CEDAR VIEW FAMILY PROCESSORS AND INTEL® NM10 EXPRESS CHIPSET
During the Embedded World Exhibition & Conference, SECO unveiled the QuadMo747-x2000, based on the newest Intel® Atom™ family, N2000 and D2000, a series of Dual Core CPUs with Hyper Threading capability and 64-bit instruction set.

15/03/2013 SECO ANNOUNCED THE µQ7-T30, A µQSEVEN REL. 2.0 COMPLIANT MODULE WITH NVIDIA® TEGRA®T30 PROCESSOR
During the Embedded World Exhibition & Conference, SECO announced the uQ7- T30, a uQseven module based on the Tegra® 3 SoC, for an energy-efficient and cost effective solution in only 7x4 cm (2.76”x1.57”).

15/03/2013 SECO UNVEILED μQ7-I.MX6, A μQSEVEN REL. 2.0 COMPLIANT MODULE WITH FREESCALE™ I.MX6 PROCESSOR
During the Embedded World Exhibition & Conference, SECO announced the uQ7-i.MX6, a uQseven Rel. 2.0 Compliant Module that offers top computational and graphical performance delivered by a low-power CPU.

15/03/2013 SECO UNVEILED SECOμSBC-T30, A SINGLE BOARD COMPUTER WITH NVIDIA® TEGRA® T30 PROCESSOR
During the Embedded World Exhibition & Conference, SECO announced the SECOuSBC-T30, a Single Board Computer (only 86 x 67 mm) based on Tegra T30 High-Definition Mobile processor from NVIDIA®, a Quad-Core Cortex A9 CPU with frequencies up to 1.3GHz.

15/03/2013 SECO UNVEILED SECOμSBC-I.MX6, A SINGLE BOARD COMPUTER WITH FREESCALE™ I.MX6 PROCESSOR
During the Embedded World Exhibition & Conference, SECO unveiled SECOuSBC-i.MX6 (a Single Board Computer (only 86 x 67 mm) based on i.MX6 Multimedia Applications platform from Freescale).

16/01/2013 AVNET EMBEDDED EMEA AND SECO SIGN PAN-EUROPEAN DISTRIBUTION AGREEMENT
Avnet Embedded EMEA announced the extension of its portfolio with embedded electronics from SECO, a manufacturer of computer-on-modules, single-board computers, carrier boards and peripheral boards. This new distribution agreement covers the entire EMEA region.

19/11/2012 LATEST NEWS ON CARMA
Latest news on CARMA

13/11/2012 SECO UNVEILS ITS FIRST MICRO QSEVEN® MODULE BASED ON TI’S DUAL-CORE OMAP™ 5 PROCESSOR
SECO® presents its first micro Qseven® module based on the OMAP™ 5 processor from Texas Instruments Incorporated (TI).

12/11/2012 SECO ANNOUNCES MASS PRODUCTION OF ITS QSEVEN® MODULE BASED ON THE LATEST FREESCALE I.MX6
SECO announces that its Qseven® module based on Freescale i.MX6 series processor on ARM® Cortex A9 multicore, QuadMo747-X/i.MX6, is ready for the mass production.

21/09/2012 QSEVEN® SPECIFICATION REVISION 2.0
Today, the Qseven Consortium has approved unanimously the Qseven Rev. 2.0 Specification, whose main purpose is the ARM Integration. Among the changes from Rev. 1.20 to Rev. 2.0, the most important is Qseven Halfsize Mechanical Outline.

12/06/2012 SECO AT FTF AMERICAS, JUNE 18-21 SAN ANTONIO, TX
SECO is sponsor at FTF America, June 18-21 in San Antonio, Texas

24/04/2012 SECO AT GTC PREVIEWS THE CARMA DEVKIT
At the GTC (GPU Technology Conference) SECO presents in a first-ever preview the CARMA DevKit: Energy-Efficient HPC on ARM

17/04/2012 AMD PRESENTS SECO G-SERIES PRODUCTS AT DESIGN WEST 2012
AMD had a variety of boards on display at DESIGN West 2012 based on their Embedded G-Series platform, which combines a low-power CPU with a discrete-level GPU, making it ideal for HD streaming and video games.

28/02/2012 THE NEW STANDARDIZATION GROUP FOR EMBEDDED TECHNOLOGIES (SGET) IS ON ITS WAY
The new Standardization Group for Embedded Technologies (SGET) is on its way

18/11/2011 AS NVIDIA PARTNER, SECO IS THE OFFICIAL HARDWARE DEVELOPER OF THE NEWEST DEVELOPMENT KIT TEGRA ARM + GPU
Nvidia has said it plans to develop a hardware and software development kit which will feature a quad-core Nvidia Tegra 3 ARM CPU accelerated by a discrete Nvidia GPU.

The kit's hardware will be developed by SECO and is expected to be available in the first half of 2012. Nvidia says it will support the hardware with its own proprietary CUDA parallel programming toolkit.